JPH0351111A - Resin sealing apparatus - Google Patents

Abstract

PURPOSE:To prevent the occurrence of voids in the inner part of a resin package by providing a resin reservoir communicating with a cavity on a lower mold. CONSTITUTION:A resin reservoir 11 is provided on a lower mold 2 communicating with the cavity of a resin sealing apparatus by a method of transfer mold type multiplunger. Thus, the voids generated in the side of an air vent 8 of the cavity can be released to the outside of a package via the resin reservoir 11. Whereby the occurrence of voids in the inner part of the resin package molded in the inner part of the cavity 3 can be prevented, therefore, the occurrence of corrosion or package cracks on the chip surface can be prevented as well.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin sealing device using a transfer mold type multi-plunger single type (hereinafter referred to as multi-plunger single type).

2. Description of the Related Art As a conventional multi-plunger one-type resin sealing device, for example, one constructed as shown in FIG. 3 is known.

Hereinafter, a description will be given based on the drawings. Reference numeral 1 indicates an upper mold, 2 a lower mold, and a cavity 3 is formed between the upper and lower molds 1 and 2. 1) A bot 6 containing 40 resin pellets is formed in the upper mold 1, and a plunger 〇 is slidably provided in the bot 5. 7 is a gate formed with a small gap between the upper and lower molds 1 and 2 to communicate the inner end of the bot 6 and one end of the cavity 3;
Reference numeral 8 denotes an air bend formed between the upper and lower molds 1.degree. 2 in order to remove air from the cavity 3.

In the above configuration, when the resin pellet 4 is put into the inside of the bot 6 and the plunger 6 is lowered, the resin pellet 4
is melted by the preheating of the upper and lower molds 1 and 2 and the plunger 6, and is injected into the cavity 3 through the gate 7.

Problems to be Solved by the Invention In the multi-pusher one-type resin sealing device as described above, the resin pellets 4 put into the bot 5 begin to melt due to heat, but the entire resin pellets 4 do not start melting at the same time. In this case, the air between the resin pellet 4 and the bot 5 does not escape and is caught in the resin. In this state, the resin is injected into the cavity 3, and as a result, the resin is molded in the cavity 3 as shown in Fig. 4. There was a problem in that voids 10 were generated inside the resin package 9.

The present invention is intended to solve such problems, and aims to provide a resin sealing device that can prevent the occurrence of voids inside a resin package.

Means for Solving the Problem In order to solve this problem, the present invention provides a resin reservoir in the lower mold that communicates with the cavity.

This configuration allows the air vent in the cavity to
Since the voids generated in the ll can be discharged to the outside of the pancage through the resin reservoir, it is possible to prevent voids from occurring inside the resin package molded inside the cavity, and prevent corrosion on the chip surface. It is possible to prevent the occurrence of package cracks, etc.

EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings (FIG. 1 and FIG. 2). In the drawings, the same reference numerals as in 1) Conventional Example II indicate the same members, and detailed explanation thereof will be omitted.

In the figure, reference numeral 11 denotes a resin reservoir formed in the lower mold through an air bend.

Width 161111 for DIP64 pin. Length 3 mm, depth 1
．． 6 By providing a silk resin reservoir 11, the cavity 3
The void 1o that has entered can be sent out to the resin reservoir 11.

Effects of the Invention As described above, according to the present invention, the air drawn in from the pot becomes voids within the cavity, and the voids can be sent out through the resin reservoir, thereby preventing voids from forming inside the cavity. It is possible to prevent corrosion and package cracks from occurring.

[Brief explanation of drawings]

1 and 2 show an embodiment of the present invention, FIG. 1 is a cross-sectional view of a resin sealing device, FIG. 2 is a cross-sectional view after molding, and FIGS. 3 and 4 are a conventional example. 3 is a sectional view of the resin sealing device, and FIG. 4 is a sectional view after molding. 1...Top mold, 2...Bottom mold, 3...
...Cavity, 4...Resin pellet, 6
...Pot, 6...Francher, 7
...Gate, 8...Airbend, 9
...Package, 1o...Void, 1
1...Resin pool.

Claims (1)

[Claims] This is a resin sealing device using a transfer mold type multi-plunger method, in which a resin reservoir communicating with a cavity is provided in the lower mold.