JPH03129839A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPH03129839A
JPH03129839A JP26962189A JP26962189A JPH03129839A JP H03129839 A JPH03129839 A JP H03129839A JP 26962189 A JP26962189 A JP 26962189A JP 26962189 A JP26962189 A JP 26962189A JP H03129839 A JPH03129839 A JP H03129839A
Authority
JP
Japan
Prior art keywords
mold
cavity
resin
temperature
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26962189A
Other languages
Japanese (ja)
Inventor
Yasuhiko Ishii
康彦 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP26962189A priority Critical patent/JPH03129839A/en
Publication of JPH03129839A publication Critical patent/JPH03129839A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould

Abstract

PURPOSE:To contrive a securement of the productivity of a resin sealing process by a method wherein a controlled cooling tube is provided in the interior of a metal mold to control the temperature of the metal mold. CONSTITUTION:In the manufacturing method of a semiconductor device, in which a lead frame 12 mounted with a semiconductor chip 11 is installed in a cavity 7 of a metal mold 10 for transfer molding use, a thermosetting resin is injected in the cavity 7 and the chip 11 is resin-sealed, a controlled cooling tube 3 is provided in the interior of the mold 10 to control the temperature of the mold 10, whereby the temperature of the mold 10 is made low and the resin 6 is injected in the cavity 7 at low speed. After the resin 8 is filled in the cavity 7, the temperature of the mold 10 is made high and the resin 8 in the cavity 7 is pressed and is made to mold. Thereby, an incomplete resin sealing, which generates a cavity and is left as the cavity, is suppressed to the minimum and the productivity of a resin sealing process can be secured.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a semiconductor device.

〔従来の技術〕[Conventional technology]

従来の半導体装置の製造方法は、第2図に示すように、
トランスファ成形用の金型10のキャビティ7の中に半
導体チップ11を搭載したリードフレーム12を装着し
、トランスファボット4内で加熱可塑させた熱硬化性の
樹脂ダブレット8を、プランジャー6でキャビティ7内
に注入し、キャビティ7内に充填された熱硬化性樹脂を
加圧成形する工程を有しているが、金型10の温度は、
所定の温度に固定されたまま、樹脂封止を行なっている
The conventional method for manufacturing semiconductor devices is as shown in FIG.
A lead frame 12 carrying a semiconductor chip 11 is mounted in a cavity 7 of a mold 10 for transfer molding, and a thermosetting resin doublet 8 heated and plasticized in a transfer robot 4 is inserted into a cavity 7 with a plunger 6. The temperature of the mold 10 is as follows:
Resin sealing is performed while the temperature is fixed at a predetermined temperature.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の半導体装置の製造方法は、トランスファ
成形用金型の温度が、一定の温度に固定されたままとな
っており、金型は、温度の急速な変更はできない機構と
なっている。
In the conventional semiconductor device manufacturing method described above, the temperature of the transfer molding mold remains fixed at a constant temperature, and the mold has a mechanism that does not allow rapid changes in temperature.

この金型の温度は、キャビティ内に充填される際の熱硬
化性の樹脂の溶融粘度と、加圧成形される際の熱硬化性
樹脂の硬化状態に大きな影響を与える。
The temperature of this mold has a large effect on the melt viscosity of the thermosetting resin when it is filled into the cavity and on the hardening state of the thermosetting resin when it is press-molded.

熱硬化性樹脂の溶融粘度が低いと、充填される際、流れ
が乱流となる為、空気を巻き込み、大きな空洞を生じた
状態の不良が発生する。
If the melt viscosity of the thermosetting resin is low, the flow will be turbulent when it is filled, causing air to be drawn in, resulting in defects such as large cavities.

その対策として、金型の温度を低くすると、熱硬化性樹
脂の溶融粘度が高くなり、充填される際の流れが層流と
なる為、空気の巻き込みがなくなり、空洞の発生はなく
なるが、熱硬化性樹脂を加圧成形する際の硬化時間が長
くなる為、加圧成形の時間を延長する必要があり、樹脂
封止工程の生産性が低下するという問題がある。
As a countermeasure, lowering the temperature of the mold will increase the melt viscosity of the thermosetting resin, and the flow during filling will become laminar, eliminating air entrainment and eliminating the formation of cavities. Since the curing time when press-molding the curable resin becomes long, it is necessary to extend the pressure-molding time, and there is a problem that the productivity of the resin sealing process decreases.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の半導体装置の製造方法は、半導体チップを搭載
したリードフレームをトランスファ成形用金型のキャビ
ティ内に装着して熱硬化性樹脂を注入し樹脂封止する半
導体装置の製造方法において、前記金型の内部に強制冷
却管を設けて前記金型の温度を制御することにより前記
金型の温度を低くして前記熱硬化性樹脂を前記キャビテ
ィ内に低速で注入する工程と、前記キャビティ内に前記
熱硬化性樹脂を充填した後に前記金型の温度を高くして
前記キャビティ内の前記熱硬化性樹脂を加圧成形させる
工程とを含んで構成される。
The method for manufacturing a semiconductor device of the present invention is a method for manufacturing a semiconductor device in which a lead frame carrying a semiconductor chip is mounted in a cavity of a transfer mold, and a thermosetting resin is injected and resin-sealed. a step of lowering the temperature of the mold by providing a forced cooling pipe inside the mold to control the temperature of the mold, and injecting the thermosetting resin into the cavity at a low speed; After filling the thermosetting resin, the temperature of the mold is increased to pressurize the thermosetting resin in the cavity.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例を説明するためのトランスフ
ァモールド成形機の模式的断面図である。
FIG. 1 is a schematic sectional view of a transfer molding machine for explaining one embodiment of the present invention.

第1図に示すように、トランスファ成形用の金型10の
中に設けたキャビティ7の中に半導体チップ11を搭載
したリードフレーム12を装着し、トランスファボット
4内で熱硬化性の樹脂タブレット8を加熱して可塑性を
持たせた熱硬化性樹脂を、プランジャー6で射出し、キ
ャビティ7内に充填させ、その後熱硬化性樹脂を加圧成
形する。その際、熱硬化性樹脂がキャビティ7内に充填
を開始した時点を、トランスファボット4内に取付けた
リミットスイッチ5で検知して金型10の内部に取付け
た強制冷却管3のバルブ2を開き、強制冷却管3に水を
流し込んで、金型10の温度を下げた状態で熱硬化性樹
脂のキャビティ7内への充填を行う。次に、熱硬化性樹
脂がキャビティ7内に充填を完了した時点を、同じくト
ランスファボット4内に取付けたリミットスイッチ5で
検知し、金型10の内部に取付けた強制冷却管3のバル
ブ2を閉じて強制冷却管3への水の流し込みを止め、金
型10の温度を元に戻し、熱硬化性樹脂を加圧成形する
As shown in FIG. 1, a lead frame 12 on which a semiconductor chip 11 is mounted is mounted in a cavity 7 provided in a mold 10 for transfer molding, and a thermosetting resin tablet 8 is formed in a transfer mold 4. A thermosetting resin made plastic by heating is injected with a plunger 6 to fill the cavity 7, and then the thermosetting resin is pressure-molded. At that time, the limit switch 5 installed in the transferbot 4 detects the point at which the thermosetting resin starts filling into the cavity 7, and opens the valve 2 of the forced cooling pipe 3 installed inside the mold 10. , water is poured into the forced cooling pipe 3 to lower the temperature of the mold 10, and the cavity 7 is filled with thermosetting resin. Next, the limit switch 5 installed in the transferbot 4 detects when the thermosetting resin has completed filling into the cavity 7, and the valve 2 of the forced cooling pipe 3 installed inside the mold 10 is activated. It is closed to stop the flow of water into the forced cooling pipe 3, the temperature of the mold 10 is returned to the original temperature, and the thermosetting resin is pressure-molded.

これにより、空洞となって残る不完全樹脂封止は最小限
度に抑えられ、又、樹脂封止工程の生産性も確保でき、
安定した樹脂封止を行うことができる。
As a result, incomplete resin sealing that remains as a cavity can be minimized, and the productivity of the resin sealing process can also be ensured.
Stable resin sealing can be performed.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、半導体装置の樹脂封止工
程において、熱硬化性樹脂がキャビティ内に充填される
時間と、熱硬化性樹脂が加圧成形される時間の、トラン
スファ成形用金型の温度を急速に変化させることができ
るので、樹脂封止型半導体装置の品質を向上させること
ができ、又、樹脂封止工程の生産性も確保できるという
効果を有する。
As explained above, the present invention provides a transfer molding die for the time when the thermosetting resin is filled into the cavity and the time when the thermosetting resin is pressure-molded in the resin encapsulation process of a semiconductor device. Since the temperature can be changed rapidly, the quality of the resin-sealed semiconductor device can be improved, and the productivity of the resin-sealing process can also be ensured.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例を説明するためのトランス
ファモールド成形機の模式的断面図、第2図は従来の半
導体装置の製造方法を説明するためのトランスファモー
ルド成形機の模式的断面図である。 1・・・強制冷却装置、2・・・バルブ、3・・・強制
冷却管、4・・・トランスファボット、5・・・リミッ
トスイッチ、6・・・プランジャー、7・・・キャビテ
ィ、8・・・樹脂タブレット、9・・・成形プレス機、
10・・・金型、11・・・半導体チップ、12・・・
リードフレーム。
FIG. 1 is a schematic cross-sectional view of a transfer molding machine for explaining an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of a transfer molding machine for explaining a conventional semiconductor device manufacturing method. It is a diagram. DESCRIPTION OF SYMBOLS 1... Forced cooling device, 2... Valve, 3... Forced cooling pipe, 4... Transferbot, 5... Limit switch, 6... Plunger, 7... Cavity, 8 ... Resin tablet, 9... Molding press machine,
10... Mold, 11... Semiconductor chip, 12...
Lead frame.

Claims (1)

【特許請求の範囲】[Claims]  半導体チップを搭載したリードフレームをトランスフ
ァ成形用金型のキャビティ内に装着して熱硬化性樹脂を
注入し樹脂封止する半導体装置の製造方法において、前
記金型の内部に強制冷却管を設けて前記金型の温度を制
御することにより前記金型の温度を低くして前記熱硬化
性樹脂を前記キャビティ内に低速で注入する工程と、前
記キャビティ内に前記熱硬化性樹脂を充填した後に前記
金型の温度を高くして前記キャビティ内の前記熱硬化性
樹脂を加圧成形させる工程とを含むことを特徴とする半
導体装置の製造方法。
In a method for manufacturing a semiconductor device in which a lead frame carrying a semiconductor chip is mounted in a cavity of a transfer molding mold, a thermosetting resin is injected and resin-sealed, a forced cooling pipe is provided inside the mold. a step of lowering the temperature of the mold by controlling the temperature of the mold and injecting the thermosetting resin into the cavity at a low rate; and after filling the thermosetting resin into the cavity, 1. A method of manufacturing a semiconductor device, comprising the step of increasing the temperature of a mold and pressurizing the thermosetting resin in the cavity.
JP26962189A 1989-10-16 1989-10-16 Manufacture of semiconductor device Pending JPH03129839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26962189A JPH03129839A (en) 1989-10-16 1989-10-16 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26962189A JPH03129839A (en) 1989-10-16 1989-10-16 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPH03129839A true JPH03129839A (en) 1991-06-03

Family

ID=17474901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26962189A Pending JPH03129839A (en) 1989-10-16 1989-10-16 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPH03129839A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368805A (en) * 1992-03-24 1994-11-29 Fuji Electric Co., Ltd. Method for producing resin sealed type semiconductor device
US7162796B2 (en) 1998-04-10 2007-01-16 Micron Technology, Inc. Method of making an interposer with contact structures
NL2000356C2 (en) * 2006-12-05 2008-06-06 Fico Bv Method and device for encapsulating electronic components wherein the encapsulating material is cooled.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368805A (en) * 1992-03-24 1994-11-29 Fuji Electric Co., Ltd. Method for producing resin sealed type semiconductor device
US7162796B2 (en) 1998-04-10 2007-01-16 Micron Technology, Inc. Method of making an interposer with contact structures
NL2000356C2 (en) * 2006-12-05 2008-06-06 Fico Bv Method and device for encapsulating electronic components wherein the encapsulating material is cooled.
WO2008085026A1 (en) * 2006-12-05 2008-07-17 Fico B.V. Method and device for encapsulating electronic components, wherein the encapsulating material is cooled
KR101495576B1 (en) * 2006-12-05 2015-02-25 베시 네덜란드 비.브이. Method and device for encapsulating electronic components, wherein the encapsulating material is cooled

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