JPH0153501B2 - - Google Patents
Info
- Publication number
- JPH0153501B2 JPH0153501B2 JP58029097A JP2909783A JPH0153501B2 JP H0153501 B2 JPH0153501 B2 JP H0153501B2 JP 58029097 A JP58029097 A JP 58029097A JP 2909783 A JP2909783 A JP 2909783A JP H0153501 B2 JPH0153501 B2 JP H0153501B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- chuck
- semiconductor lead
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 238000000465 moulding Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 10
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
この発明は、半導体素子を取り付けたリードフ
レームを樹脂成形金型内に自動的に供給セツトす
ると共に、樹脂成形後の半導体リードフレームを
金型外部に自動的に取り出す方法の改良に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for automatically supplying and setting a lead frame to which a semiconductor element is attached into a resin molding mold, and automatically taking out the semiconductor lead frame after resin molding to the outside of the mold. This is related to the improvement of
ところで、半導体リードフレームは金型の型締
め前に金型内の所定位置に供給セツトされる必要
があり、また、その取り出しは金型の型開き後に
行なわれるのが通例である。近時、半導体リード
フレーム（以下、単にリードフレームという）の
上記した供給セツト及び取り出しを自動的に行な
うことによつて半導体素子の樹脂封入成形サイク
ルの短縮化を図ることが行なわれているが、特
に、高品質で高能率生産性が要請される今日的な
課題、例えば、キヤビテイ内への溶融樹脂の加圧
注入時間を約５秒・キユアリングタイムを約15
秒・その他の時間を約10秒（全約30秒間）で行な
うといつた高能率生産性と、高品質の保持という
相反した要請に充分に対応することができない実
状である。即ち、従来方法を説明すると、第１図
に示すように、まず、固定型１と可動型２とから
成る樹脂成形金型３を型開きを行なうと共に、該
両型間にリードフレーム４の供給・取出チヤツク
５を前進移動させる（同図１）。 Incidentally, the semiconductor lead frame must be supplied and set at a predetermined position within the mold before the mold is clamped, and it is customary to take it out after the mold is opened. Recently, attempts have been made to shorten the resin encapsulation molding cycle of semiconductor elements by automatically performing the above-mentioned supply setting and removal of semiconductor lead frames (hereinafter simply referred to as lead frames). In particular, today's issues that require high quality and high efficiency productivity, such as pressurized injection time of molten resin into the cavity of about 5 seconds and curing time of about 15 seconds.
The current situation is that it is not possible to adequately meet the contradictory demands of high efficiency productivity, such as processing time in about 10 seconds (total of about 30 seconds), and maintaining high quality. That is, to explain the conventional method, as shown in FIG. 1, first, a resin molding die 3 consisting of a fixed die 1 and a movable die 2 is opened, and a lead frame 4 is supplied between the two dies.・Move the ejection chuck 5 forward (FIG. 1).
次に、上記チヤツク５からリードフレーム４を
離脱して該リードフレームを両型１，２のパーテ
イングライン面における所定の位置に供給し、且
つ、該リードフレーム上の半導体素子が両型１，
２間に形成したキヤビテイ１ａ，２ａ部内に嵌入
される状態でセツトする（同図２）。次に、上記
チヤツク５を両型１，２間から金型３の外部位置
に後退移動させて、即ち、該両型間における障害
物を移動させた後に両型１，２の型締めを行なう
と共に、この状態でキヤビテイ１ａ，２ａ部内に
溶融樹脂材料を加圧注入して、リードフレーム４
上の半導体素子を樹脂封入させる樹脂成形を行な
う（同図３）。次に、所要のキユアリングタイム
後において両型１，２の型開きを行なう（同図
４）。次に、両型１，２間に前記チヤツク５を再
び前進移動させると共に、樹脂成形後のリードフ
レーム４′を突出ピン６にてキヤビテイ２ａから
突き出して上記チヤツク５に係止させ（同図５，
６）、次に、チヤツク５を後退移動させることに
よつて、リードフレーム４′を金型３の外部に取
り出すようにしているのである。従つて、以上の
説明からも明らかなように、従来方法において
は、チヤツク５の前進移動時に型閉めを行なう
と、該チヤツクが障害物となつてチヤツク５及び
金型３を破損することになるため、リードフレー
ム４，４′の供給セツト及び取り出しを行なうチ
ヤツク５の前進及び後退移動は、いずれも両型
１，２の型開き時において行なう必要があり、こ
のことが、成形サイクルの短縮化を阻害する要因
となつているのである。 Next, the lead frame 4 is removed from the chuck 5, and the lead frame is supplied to a predetermined position on the parting line surface of both molds 1 and 2, and the semiconductor element on the lead frame is removed from both molds 1 and 2.
It is set so that it is inserted into the cavities 1a and 2a formed between the two (FIG. 2). Next, the chuck 5 is moved backward from between the molds 1 and 2 to a position outside the mold 3, that is, after moving the obstacle between the molds, the molds 1 and 2 are clamped. At the same time, in this state, a molten resin material is injected under pressure into the cavities 1a and 2a to form the lead frame 4.
Resin molding is performed to encapsulate the upper semiconductor element in resin (FIG. 3). Next, after a required curing time, both molds 1 and 2 are opened (FIG. 4). Next, the chuck 5 is moved forward again between the molds 1 and 2, and the lead frame 4' after resin molding is projected from the cavity 2a with the protruding pin 6 and is locked to the chuck 5 (see FIG. 5). ，
6) Next, by moving the chuck 5 backward, the lead frame 4' is taken out of the mold 3. Therefore, as is clear from the above explanation, in the conventional method, if the mold is closed while the chuck 5 is moving forward, the chuck becomes an obstacle and damages the chuck 5 and the mold 3. Therefore, the forward and backward movements of the chuck 5 for supplying and taking out the lead frames 4, 4' must be performed when both molds 1, 2 are opened, which shortens the molding cycle. This is a factor that hinders the
本発明は、固定型及び可動型から成る半導体素
子の樹脂封入成形用金型内における所定位置に供
給セツトした半導体リードフレームに対する樹脂
封入成形中に、上記半導体リードフレームの取出
チヤツクを金型側へ前進移動させると共に、該取
出チヤツクにて金型内の上記半導体リードフレー
ムを係止させ、次に、上記金型の型開きと同時的
に取出チヤツクを後退移動させて樹脂封入成形後
の半導体リードフレームを金型外部に取り出すこ
とを特徴とする半導体リードフレームの自動取出
方法に係るものであり、また、本発明は半導体リ
ードフレームを供給チヤツクにて係止し、この状
態で該半導体リードフレームを、固定型及び可動
型から成る半導体素子の樹脂封入成形用金型内に
おける所定位置に自動的に供給セツトし、次に、
上記金型の型締め及び樹脂成形を行ない、且つ、
この樹脂成形中に、上記供給チヤツクを半導体リ
ードフレームから離脱させて金型外部に後退移動
させると共に、供給チヤツクの該離脱及び後退移
動と並行して、半導体リードフレームの取出チヤ
ツクの金型側への前進移動及び該取出チヤツクに
よる金型内の半導体リードフレームの係止を行な
い、次に、上記金型の型開きと同時的に取出チヤ
ツクを後退移動させて半導体リードフレームを金
型外部に取り出すことを特徴とする半導体リード
フレームの自動供給・取出方法に係るものであ
り、品質を低下させることなく、前述した成形サ
イクルの可及的な短縮化を図ることによつて、こ
の種製品の生産性を向上させることを目的とする
ものである。 The present invention aims to move the ejection chuck of the semiconductor lead frame toward the mold side during resin encapsulation molding for a semiconductor lead frame that is supplied and set at a predetermined position in a mold for resin encapsulation of semiconductor elements consisting of a fixed type and a movable type. While moving forward, the semiconductor lead frame in the mold is locked by the ejection chuck, and then, at the same time as the mold is opened, the ejection chuck is moved backward to release the semiconductor lead after resin encapsulation molding. The present invention relates to an automatic take-out method for a semiconductor lead frame, which is characterized by taking out the frame to the outside of the mold. , automatically supply and set the semiconductor element at a predetermined position in the mold for resin encapsulation of the semiconductor element, which consists of a fixed type and a movable type, and then,
Performs mold clamping and resin molding of the above mold, and
During this resin molding, the supply chuck is detached from the semiconductor lead frame and moved backward to the outside of the mold, and in parallel with the detachment and backward movement of the supply chuck, the ejection chuck of the semiconductor lead frame is moved toward the mold side. The semiconductor lead frame is moved forward and the semiconductor lead frame is locked in the mold by the ejection chuck, and then the ejection chuck is moved backward at the same time as the mold is opened, and the semiconductor lead frame is taken out from the mold. This invention relates to an automatic supply/removal method for semiconductor lead frames, which is characterized by The purpose is to improve sexual performance.
以下、本発明方法を第２図に示す実施例図に基
づいて説明する。 Hereinafter, the method of the present invention will be explained based on the embodiment diagram shown in FIG.
まず、固定型１１と可動型１２とから成る樹脂
成形金型１３の型開きを行なうと共に、リードフ
レーム１４を供給チヤツク１５1にて係止し、こ
の状態で該リードフレームを、上記金型１３の所
定位置に自動的に供給し、該リードフレーム上の
半導体素子が両型１１，１２間に形成したキヤビ
テイ１１ａ，１２ａ部内に嵌入されるようにセツ
トするが、上記リードフレーム１４は供給チヤツ
ク１５1に係止された状態にある（同図１）。次
に、上記した状態で両型１１，１２の型閉めを行
なうと共に、キヤビテイ１１ａ，１２ａ内に溶融
樹脂材料を加圧注入して上記半導体素子の樹脂封
入成形を行ない、且つ、この樹脂成形中に、上記
供給チヤツク１５1をリードフレーム１４から離
脱させて金型１３の一方側の外部に後退移動させ
ると共に、この供給チヤツク１５1の該離脱及び
後退移動と並行して、樹脂成形後のリードフレー
ム１４′の取出チヤツク１５2の金型１３の所定位
置への前進移動及び該取出チヤツクによる上記リ
ードフレーム１４′の係止を行なう（同図２）。次
に、所要のキユアリングタイム後において両型１
１，１２の型開きを行なうと同時に、上記リード
フレーム１４′を突出ピン１６にてキヤビテイ１
２ａから突き出し、この型開きと同時的に取出チ
ヤツク１５2を金型１３の他方側の外部に後退移
動させることによつて、上記リードフレーム１
４′の取り出しを行なうものである。 First, the resin molding die 13 consisting of the fixed die 11 and the movable die 12 is opened, and the lead frame 14 is locked with the supply chuck 151 , and in this state, the lead frame is inserted into the mold 13. The lead frame 14 is automatically supplied to a predetermined position of the supply chuck 15 and set so that the semiconductor element on the lead frame is fitted into the cavities 11a and 12a formed between the molds 11 and 12. 1 (see Figure 1). Next, in the above state, both molds 11 and 12 are closed, and a molten resin material is injected under pressure into the cavities 11a and 12a to perform resin encapsulation molding of the semiconductor element, and during this resin molding, Then, the supply chuck 15 1 is detached from the lead frame 14 and moved backward to the outside of one side of the mold 13, and in parallel with the detachment and backward movement of the supply chuck 15 1 , the leads after resin molding are removed. The take-out chuck 152 of the frame 14' is moved forward to a predetermined position of the mold 13, and the lead frame 14' is locked by the take-out chuck (FIG. 2). Next, after the required curing time, both molds 1
At the same time as molds 1 and 12 are opened, the lead frame 14' is inserted into cavity 1 using the protruding pin 16.
By protruding from the lead frame 2a and moving the ejecting chuck 152 backward to the outside of the other side of the mold 13 at the same time as the mold is opened, the lead frame 1 is removed.
4' is taken out.
なお、第２図において、符号１１ｂ，１２ｂで
示した凹所は、供給チヤツク１５1及び取出チヤ
ツク１５2と金型１３側との接触を避ける目的で
形成されたものである。 Incidentally, in FIG. 2, the recesses indicated by numerals 11b and 12b are formed for the purpose of avoiding contact between the supply chuck 151 and the ejection chuck 152 and the mold 13 side.
以上のように、第一発明方法は、樹脂成形中に
取出チヤツク１５2にてリードフレーム１４′を係
止させて、該リードフレームを型開きと同時的に
金型１３の外部に自動的に取り出すものであり、
また、第二発明方法は、供給チヤツク１５1にて
リードフレーム１４の供給セツトを自動的に行な
うと共に、樹脂成形中に供給チヤツク１５1を後
退移動させ、且つ、これに連続して上記第一発明
方法を行なうものであるから、前述したように、
型締め時の所要時間（例えば約20秒間）の間に、
供給チヤツク１５1及び取出チヤツク１５2の後退
及び前進移動を並行して行なうと共に、金型の型
開きと同時的に樹脂成形後のリードフレーム１
４′を取り出すことが可能となるため、全体的な
成形サイクルを大幅に短縮化することができると
いつた有用顕著な効果を奏するものである。 As described above, the first invention method locks the lead frame 14' with the take-out chuck 152 during resin molding, and automatically moves the lead frame to the outside of the mold 13 at the same time as the mold is opened. It is something to take out,
Further, in the second invention method, the supply chuck 15 1 is automatically set to supply the lead frame 14, and the supply chuck 15 1 is moved backward during resin molding, and the supply chuck 15 1 is continuously moved back. Since it is a method of invention, as mentioned above,
During the time required for mold clamping (for example, about 20 seconds),
The supply chuck 15 1 and the ejection chuck 15 2 are moved backward and forward in parallel, and at the same time as the mold is opened, the lead frame 1 after resin molding is removed.
Since it becomes possible to take out the mold 4', the overall molding cycle can be significantly shortened, which is a useful and remarkable effect.
また、上記したような大幅な成形サイクルの短
縮化が行なわれるにも拘らず、型閉めの所要時間
は短縮されないから、例えば、キユアリングタイ
ムの不足に起因する樹脂成形部の変形・欠損等の
弊害が発生せず、従つて、その品質を均一に保ち
得て、この種製品の高品質性を保持することがで
きるものである。更に、大幅な成形サイクルの短
縮化はこの種製品の生産性を著しく向上させるも
のであるから、その高能率生産とコストダウンを
図り得て、前述したような今日的課題に充分に対
応することができる等の優れた実用的効果を奏す
るものである。 In addition, even though the molding cycle has been significantly shortened as described above, the time required for mold closing is not shortened, so, for example, deformation and breakage of resin molded parts due to insufficient curing time can occur. No harmful effects occur, therefore, the quality can be maintained uniformly, and the high quality of this type of product can be maintained. Furthermore, since a significant shortening of the molding cycle will significantly improve the productivity of this type of product, it will be possible to achieve high efficiency production and cost reduction, and to fully respond to the current issues mentioned above. It has excellent practical effects such as the ability to
第１図は、半導体リードフレームの金型への供
給及び金型からの取り出しを行なう従来方法の説
明図、第２図はその本発明方法の実施例を示すも
ので、同図１，２，３は金型の概略正面
図、同図１，２，３は可動型の概略平面図
である。
１１……固定型、１２……可動型、１３……金
型、１４，１４′……半導体リードフレーム、１
５1……供給チヤツク、１５2……取出チヤツク。
FIG. 1 is an explanatory diagram of a conventional method for supplying a semiconductor lead frame to a mold and taking it out from the mold, and FIG. 2 shows an embodiment of the method of the present invention. 3 is a schematic front view of the mold, and FIGS. 1, 2, and 3 are schematic plan views of the movable mold. 11... Fixed type, 12... Movable type, 13... Mold, 14, 14'... Semiconductor lead frame, 1
5 1 ... Supply chuck, 15 2 ... Ejection chuck.
Claims (1)
封入成形用金型内における所定位置に供給セツト
した半導体リードフレームに対する樹脂封入成形
中に、上記半導体リードフレームの取出チヤツク
を金型側へ前進移動させると共に、該取出チヤツ
クにて金型内の上記半導体リードフレームを係止
させ、次に、上記金型の型開きと同時的に取出チ
ヤツクを後退移動させて樹脂封入成形後の半導体
リードフレームを金型外部に取り出すことを特徴
とする半導体リードフレームの自動取出方法。 ２ 半導体リードフレームを供給チヤツクにて係
止し、この状態で該半導体リードフレームを、固
定型及び可動型から成る半導体素子の樹脂封入成
形用金型内における所定位置に自動的に供給セツ
トし、次に、上記金型の型締め及び樹脂成形を行
ない、且つ、この樹脂成形中に、上記供給チヤツ
クを半導体リードフレームから離脱させて金型外
部に後退移動させると共に、供給チヤツクの該離
脱及び後退移動と並行して、半導体リードフレー
ムの取出チヤツクの金型側への前進移動及び該取
出チヤツクによる金型内の半導体リードフレーム
の係止を行ない、次に、上記金型の型開きと同時
的に取出チヤツクを後退移動させて半導体リード
フレームを金型外部に取り出すことを特徴とする
半導体リードフレームの自動供給・取出方法。[Scope of Claims] 1. During resin encapsulation molding for a semiconductor lead frame that is supplied and set at a predetermined position in a mold for resin encapsulation of semiconductor elements consisting of a fixed type and a movable type, the ejection chuck of the semiconductor lead frame is While moving forward toward the mold side, the semiconductor lead frame in the mold is locked by the ejection chuck, and then, simultaneously with the opening of the mold, the ejection chuck is moved backward to remove the semiconductor lead frame after resin encapsulation molding. 1. An automatic method for taking out a semiconductor lead frame, the method comprising taking out the semiconductor lead frame to the outside of a mold. 2. Locking the semiconductor lead frame with a supply chuck, and in this state, automatically supplying and setting the semiconductor lead frame at a predetermined position in a mold for resin encapsulation of semiconductor elements consisting of a fixed type and a movable type, Next, the mold is clamped and resin molded, and during the resin molding, the supply chuck is removed from the semiconductor lead frame and moved backward to the outside of the mold, and the supply chuck is removed and retreated. In parallel with the movement, the ejecting chuck of the semiconductor lead frame is moved forward toward the mold side and the ejecting chuck locks the semiconductor lead frame in the mold, and then, simultaneously with the opening of the mold, An automatic method for supplying and taking out a semiconductor lead frame, characterized in that the semiconductor lead frame is taken out of the mold by moving a take-out chuck backward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2909783A JPS59154031A (en) | 1983-02-22 | 1983-02-22 | Automatic supply and taking-out method for semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2909783A JPS59154031A (en) | 1983-02-22 | 1983-02-22 | Automatic supply and taking-out method for semiconductor lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59154031A JPS59154031A (en) | 1984-09-03 |
| JPH0153501B2 true JPH0153501B2 (en) | 1989-11-14 |
Family
ID=12266845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2909783A Granted JPS59154031A (en) | 1983-02-22 | 1983-02-22 | Automatic supply and taking-out method for semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59154031A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3429441A1 (en) * | 1984-08-10 | 1986-02-20 | Hoechst Ag, 6230 Frankfurt | THERMOPLASTIC, SOFTENER-CONTAINING POLYVINYLBUTYRAL MOLDINGS |
| JP2612465B2 (en) * | 1988-03-22 | 1997-05-21 | Supply method of semiconductor frame | |
| JP6164380B1 (en) * | 2017-01-30 | 2017-07-19 | 第一精工株式会社 | Substrate conveying apparatus and substrate conveying method |
| JP7240339B2 (en) * | 2020-01-20 | 2023-03-15 | Ｔｏｗａ株式会社 | Method for manufacturing resin molded product and resin molding apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5287767A (en) * | 1976-01-16 | 1977-07-22 | Yamada Seisakusho Kk | Automatic loading device for work load frame |
| JPS5287768A (en) * | 1976-01-16 | 1977-07-22 | Yamada Seisakusho Kk | Automatic conveying frame body for work load frame |
-
1983
- 1983-02-22 JP JP2909783A patent/JPS59154031A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5287767A (en) * | 1976-01-16 | 1977-07-22 | Yamada Seisakusho Kk | Automatic loading device for work load frame |
| JPS5287768A (en) * | 1976-01-16 | 1977-07-22 | Yamada Seisakusho Kk | Automatic conveying frame body for work load frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59154031A (en) | 1984-09-03 |
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