CN102324394A - Continuous filling/packaging module box for DIP (double in-line package) integrated circuits - Google Patents
Continuous filling/packaging module box for DIP (double in-line package) integrated circuits Download PDFInfo
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- CN102324394A CN102324394A CN201110287611A CN201110287611A CN102324394A CN 102324394 A CN102324394 A CN 102324394A CN 201110287611 A CN201110287611 A CN 201110287611A CN 201110287611 A CN201110287611 A CN 201110287611A CN 102324394 A CN102324394 A CN 102324394A
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- China
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- mold insert
- diaphragm capsule
- die cavity
- dip
- continuous filling
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Abstract
The invention discloses a continuous filling/packaging module box for DIP (double in-line package) integrated circuits. The continuous filling/packaging module box comprises an insert seat (2), a formed insert (4) and a module-box ejector plate (6), wherein cavities (1) are arrayed on both sides of the formed insert (4), the middle of the formed insert (4) is provided with a plurality of charging baskets (3), a sprue insert (8) is arranged between the charging baskets (3) and the formed insert (4), a sprue is arranged in the sprue insert (8), and the charging baskets (3) are in pipe communication with the cavities (1) by the sprue in the sprue insert. By using the module box disclosed by the invention, the product packaging efficiency is greatly improved, the flow distance of resin is short, the resin residue is less, and the utilization ratio of resin is high, thereby saving a good deal of resin and reducing the cost.
Description
Technical field
Diaphragm capsule, especially the DIP class that the present invention relates to IC products encapsulation usefulness be the encapsulation diaphragm capsule of filling continuously.
Background technology
The dual in-line package technology is also claimed in DIP encapsulation, and English is Dual In-line Package, is a kind of simple package mode, and most middle small scale integrated circuits (IC) all adopt this packing forms.At present, the competition more and more fierce of semiconductor packages industry, the profit of product are then but in constantly compression minimizing, and be particularly outstanding especially as the product of this quasi-tradition of DIP14 (DIP16) L.Traditional DIP type encapsulation diaphragm capsule is as shown in Figure 1, and it comprises mold insert seat and the moulding mold insert that is positioned at the mold insert seat, the be placed in both sides of moulding mold insert of the die cavity that is used to encapsulate on the moulding mold insert; The every row of every side has only a die cavity, and the centre of moulding mold insert is a running channel, and running channel is communicated with each die cavity realizes encapsulation; Because the die cavity in the diaphragm capsule is few, therefore the product of encapsulation is few, simultaneously because running channel is long; The resin that resides in the running channel is many, causes bigger resin waste, the shortcoming of the single mode box of therefore this traditional DIP single cylinder mould be yield poorly, the utilance of resin is low; Production cost is high, the requirement that can't satisfy market gradually.
Summary of the invention
The object of the invention is exactly that solution DIP type encapsulation diaphragm capsule yields poorly, the utilance of resin is low, the problem that production cost is high.
The technical scheme that the present invention adopts is: the continuous filling encapsulation of DIP adhesive integrated circuit diaphragm capsule, and it comprises mold insert seat, moulding mold insert and diaphragm capsule push pedal, the diaphragm capsule push pedal is positioned at the below of mold insert seat; Be connected with several push rods in the diaphragm capsule push pedal, the moulding mold insert is provided with several die cavities that is used for encapsulating, and is provided with through hole in the die cavity; Push rod is positioned at through hole; It is characterized in that described die cavity array in the both sides of moulding mold insert, the centre of moulding mold insert is provided with several charging baskets, is provided with the running channel mold insert between charging basket and the moulding mold insert; Be provided with running channel in the running channel mold insert, charging basket is communicated with the die cavity pipe through the running channel in the running channel mold insert.
Adopt technique scheme, directly through encapsulating in the die cavity of expecting logical entering both sides, because running channel is short, the resin of staying in the running channel is few for the material cake, has therefore practiced thrift potting resin, and the while is because every row can have a plurality of die cavities, so output is improved greatly.
For further shortening running channel, every side is communicated with row's cavity bottom pipe on the described moulding mold insert.Inject resin to a die cavity like this, can realize injecting resin to three die cavities.
For reducing charging basket, every side three rows are communicated with a charging basket pipe on the moulding mold insert.A charging basket can be to three row's supply resins.
Described every side die cavity is 18 rows, better effects if.
The every row's die cavity of described every side is 3, and is more suitable.
Described every row's die cavity dislocation is communicated with.
In sum, beneficial effect of the present invention is: because die cavity is many, single diaphragm capsule has 108 products, and 4 groups of diaphragm capsules also have 432 products, and single mode output is traditional 2.7 times, and the efficient of encapsulating products improves greatly, because running channel is short; Resin flow is apart from weak point, and resin residue is few, and the resin utilance is high, has practiced thrift a large amount of resins, has reduced cost.
Description of drawings
Fig. 1 is traditional DIP type encapsulation diaphragm capsule.
Fig. 2 encapsulates diaphragm capsule for the present invention.
Fig. 3 is the right view of Fig. 2.
Among the figure, 1, die cavity, 2, the mold insert seat, 3, barrel, 4, the moulding mold insert, 5, push rod, 6, the diaphragm capsule push pedal, 7, diaphragm capsule push rod fixed head, 8, the running channel mold insert.
Embodiment
Like Fig. 2, shown in Figure 3, the continuous filling encapsulation of DIP adhesive integrated circuit diaphragm capsule, it comprises mold insert seat 2, moulding mold insert 4 and diaphragm capsule push pedal 6; Diaphragm capsule push pedal 6 is positioned at the below of mold insert seat 2, is connected with several push rods 5 through diaphragm capsule push rod fixed head 7 in the diaphragm capsule push pedal 6, and moulding mold insert 4 is provided with several die cavities that is used for encapsulating 1; Be provided with the through hole of two symmetries in the die cavity 1, push rod 5 is positioned at through hole, after the formed product; The product of push rod 5 jack-up encapsulation is realized discharging.Die cavity 1 array is in the both sides of moulding mold insert 4, and is as shown in Figure 1, and three die cavities of every side constitute a row on the moulding mold insert 4; Three cavity bottoms are connected; And dislocation is communicated with, and when injecting resin, resin gets into first die cavity and gets into the adjacent die cavity of second letter again from the diagonal angle from a turning like this.The centre of moulding mold insert 4 is provided with several charging baskets 3; Be provided with running channel mold insert 8 between charging basket 3 and the moulding mold insert 4; Be provided with running channel in the running channel mold insert 8, charging basket 3 is communicated with die cavity 1 pipe through the running channel in the running channel mold insert, in the present embodiment; Per three row's die cavities are communicated with a charging basket 3 pipes, shown in the mid portion of Fig. 1.Charging basket 3 shifts to install, like this can conserve space, and every side die cavity is 18 rows, charging basket is 12.
The present invention injects resin through charging basket 3 is set in the die cavity of array, the quantity of die cavity increases greatly, and the use amount of resin reduces, so the present invention has the output height, the advantage that cost is low.
Diaphragm capsule of the present invention is that individual unit uses on mould bases, and diaphragm capsule is easy to maintenance, and mould bases also can supply other product diaphragm capsules to use, and diaphragm capsule of the present invention also can be used in the encapsulation of other products.
Claims (6)
1.DIP the continuous filling encapsulation of adhesive integrated circuit diaphragm capsule; It comprises mold insert seat (2), moulding mold insert (4) and diaphragm capsule push pedal (6), and diaphragm capsule push pedal (6) is positioned at the below of mold insert seat (2), is connected with several push rods (5) in the diaphragm capsule push pedal (6); Moulding mold insert (4) is provided with several die cavities that is used for encapsulating (1); Die cavity is provided with through hole in (1), and push rod (5) is positioned at through hole, it is characterized in that the both sides of described die cavity (1) array in moulding mold insert (4); The centre of moulding mold insert (4) is provided with several charging baskets (3); Be provided with running channel mold insert (8) between charging basket (3) and the moulding mold insert (4), the running channel mold insert is provided with running channel in (8), and charging basket (3) is communicated with die cavity (1) pipe through the running channel in the running channel mold insert.
2. the continuous filling encapsulation of DIP adhesive integrated circuit according to claim 1 diaphragm capsule is characterized in that upward every side row's cavity bottom pipe connection together of described moulding mold insert (4).
3. the continuous filling encapsulation of DIP adhesive integrated circuit according to claim 2 diaphragm capsule is characterized in that upward every side three rows of moulding mold insert (4) are communicated with a charging basket (3) pipe.
4. the continuous filling encapsulation of DIP adhesive integrated circuit according to claim 3 diaphragm capsule is characterized in that described every side die cavity is 18 rows.
5. the continuous filling encapsulation of DIP adhesive integrated circuit according to claim 4 diaphragm capsule is characterized in that the every row's die cavity of described every side is 3.
6. according to claim 4 or the continuous filling encapsulation of 5 described DIP adhesive integrated circuits diaphragm capsule, it is characterized in that every row's die cavity dislocation is communicated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110287611A CN102324394A (en) | 2011-09-26 | 2011-09-26 | Continuous filling/packaging module box for DIP (double in-line package) integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110287611A CN102324394A (en) | 2011-09-26 | 2011-09-26 | Continuous filling/packaging module box for DIP (double in-line package) integrated circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102324394A true CN102324394A (en) | 2012-01-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110287611A Pending CN102324394A (en) | 2011-09-26 | 2011-09-26 | Continuous filling/packaging module box for DIP (double in-line package) integrated circuits |
Country Status (1)
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| CN (1) | CN102324394A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59151436A (en) * | 1983-02-17 | 1984-08-29 | Rohm Co Ltd | Resin sealing process of semiconductor device |
| JPS62202539A (en) * | 1986-02-28 | 1987-09-07 | Matsushita Electric Ind Co Ltd | Integrated circuit package and manufacture thereof |
| JPH11300781A (en) * | 1998-04-22 | 1999-11-02 | Matsushita Electric Works Ltd | Molding method for resin and mold equipment for molding |
| JP2000077445A (en) * | 1998-08-28 | 2000-03-14 | Toshiba Microelectronics Corp | Resin sealing device |
| CN200948658Y (en) * | 2006-03-22 | 2007-09-19 | 无锡华润安盛科技有限公司 | Plastic sealing mold of plastic sealing body for processing IC package |
| CN101223634A (en) * | 2005-07-13 | 2008-07-16 | 首尔半导体株式会社 | Mold for forming a molding member and method of fabricating a molding member using the same |
| CN201364884Y (en) * | 2008-12-31 | 2009-12-16 | 深圳市三浦半导体有限公司 | Semiconductor encapsulation mould |
| CN202230989U (en) * | 2011-09-26 | 2012-05-23 | 铜陵三佳山田科技有限公司 | DIP packaging die box used for integrated circuit continuous filling |
-
2011
- 2011-09-26 CN CN201110287611A patent/CN102324394A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59151436A (en) * | 1983-02-17 | 1984-08-29 | Rohm Co Ltd | Resin sealing process of semiconductor device |
| JPS62202539A (en) * | 1986-02-28 | 1987-09-07 | Matsushita Electric Ind Co Ltd | Integrated circuit package and manufacture thereof |
| JPH11300781A (en) * | 1998-04-22 | 1999-11-02 | Matsushita Electric Works Ltd | Molding method for resin and mold equipment for molding |
| JP2000077445A (en) * | 1998-08-28 | 2000-03-14 | Toshiba Microelectronics Corp | Resin sealing device |
| CN101223634A (en) * | 2005-07-13 | 2008-07-16 | 首尔半导体株式会社 | Mold for forming a molding member and method of fabricating a molding member using the same |
| CN200948658Y (en) * | 2006-03-22 | 2007-09-19 | 无锡华润安盛科技有限公司 | Plastic sealing mold of plastic sealing body for processing IC package |
| CN201364884Y (en) * | 2008-12-31 | 2009-12-16 | 深圳市三浦半导体有限公司 | Semiconductor encapsulation mould |
| CN202230989U (en) * | 2011-09-26 | 2012-05-23 | 铜陵三佳山田科技有限公司 | DIP packaging die box used for integrated circuit continuous filling |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120118 |