CN206516614U - SIP encapsulates rubber moulding and sealed in unit - Google Patents
SIP encapsulates rubber moulding and sealed in unit Download PDFInfo
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- CN206516614U CN206516614U CN201621103897.1U CN201621103897U CN206516614U CN 206516614 U CN206516614 U CN 206516614U CN 201621103897 U CN201621103897 U CN 201621103897U CN 206516614 U CN206516614 U CN 206516614U
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- unit groove
- sip
- unit
- gum
- injection molding
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Abstract
Rubber moulding is encapsulated the utility model discloses a kind of SIP, for potted element chip the simple grain product lost is carried on the back so that super thick is made, several unit grooves and several one-to-one injection molding channels of unit groove and at least one gum-injecting port on the die ontology are opened in including die ontology, with a determining deviation, the injection molding channel connects corresponding unit groove and gum-injecting port, each unit groove correspondence one simple grain product of encapsulation.One unit groove of the utility model accordingly one simple grain product of individual packages, one injection molding channel of correspondence, during injecting glue, unit groove can fill packaging plastic quickly, and not only injecting glue speed is not likely to produce bubble soon, and effectively shortens the length of injection molding channel, so that air is able to effectively exclude, the generation of interior void is reduced, and is caused after injecting glue without special partitioning products, without special segmentation board cost is low, package speed is fast and can effectively prevent cutting from slipping up.The invention also discloses corresponding sealed in unit.
Description
Technical field
The utility model is related to a kind of chip package, more particularly to the product of super thick back of the body erosion is encapsulated.
Background technology
Existing super thick back of the body erosion (SIP, System in package) uses the plastic packaging side of traditional plate-like injecting glue transfer
The half-etching base of multiple products is provided with method, a lead frame, with reference to Fig. 1 a to Fig. 1 d, during encapsulation, first by multiple products
Element chip 61 is pasted onto on multiple half-etching bases in a lead frame 62 (with reference to Fig. 1 a to Fig. 1 b), (2) and then is drawing
Carry out carrying out back etching (referring to Fig. 1 c) after injecting glue formation solidification glue 63 (referring to Fig. 1 b), injecting glue in wire frame 62, after terminating, need
Separating technology is cut to separate and (refer to Fig. 1 d) cutting of product 64 in a lead frame.
However, because the plate of injecting glue is too thick, too big and tradition transfer injecting glue technology limitation, therefore in injecting glue process
In can produce that a large amount of sealings are not complete and interior void.And cutting deviation bad product is easily produced in cutting, also by side starved
It is exposed.Furthermore, because leadframe manufacturing process is complicated, (non-serviceable unit will for unavoidable generation bad product on slip
Dashed out by ink distribution point), glue amount is not enough when and the unit for not pasting element is just had on slip, therefore causing injecting glue, influences whole plate
The product of module unit.
Even if those skilled in the art have found the problem, it is desirable to reequip cutting machine to meet split requirement, but due to cutting
Cutting the board used in super thick back of the body erosion SIP products needs special repacking, is limited more, and the selection of super thick product cutting machine also has
Limitation, involves great expense so that the cost of every super thick back of the body erosion SIP product is higher, and loss is higher, wastes more, cost is higher.
Therefore, it is badly in need of a kind of new encapsulation to solve the problem of infull sealing in super thick back of the body erosion simple grain product, cutting skew.
Utility model content
The purpose of this utility model is to provide a kind of SIP encapsulation rubber moulding, and injecting glue speed is fast, and injecting glue effect is good, high yield rate.
Another object of the present utility model is to provide a kind of SIP sealed in units, and injecting glue speed is fast, and injecting glue effect is good, finished product
Rate is high.
To achieve these goals, rubber moulding is encapsulated the utility model discloses a kind of SIP, for potted element chip to make
Carry on the back the simple grain product of erosion into super thick, including die ontology, several units for being opened in a determining deviation on the die ontology
Groove and several one-to-one injection molding channels of unit groove and at least one gum-injecting port, the injection molding channel connect
Lead to corresponding unit groove and gum-injecting port, each unit groove correspondence one simple grain product of encapsulation.
Compared with prior art, SIP described in the utility model encapsulates one unit groove of rubber moulding accordingly individual packages one
Individual simple grain product, and unit groove one injection molding channel of correspondence, during injecting glue, unit groove can fill packaging plastic quickly,
Not only injecting glue speed is not likely to produce bubble soon, and effectively shortens the length of injection molding channel so that air is able to effectively exclude,
The generation of interior void is reduced, and is caused after injecting glue without special partitioning products, without special segmentation board cost is low, envelope
Dress speed is fast and can effectively prevent cutting from slipping up.
It is preferred that the unit groove is arranged in a row or at least two rows, often row has N number of unit groove, the gum-injecting port
There is N number of and respectively with every row N number of unit groove corresponding, the injection molding channel connects corresponding unit groove and correspondingly
Gum-injecting port.At least two row's unit grooves cause a gum-injecting port to be molded simultaneously to multiple unit grooves, are not influenceing finished product
And improve packaging efficiency on the premise of injecting glue efficiency.
Specifically, the left side and/or right side of the gum-injecting port are respectively equipped with least two row's unit grooves, and homonymy is often arranged N number of
The unit groove location is relative to be arranged with lining up N.
More specifically, the corresponding injection molding channel of unit groove described at least two of each column is closing on remittance at the gum-injecting port
Close.
It is preferred that the gum-injecting port is respectively arranged on the left side and the right side the corresponding unit groove of an at least row, further improve
Packaging efficiency.
It is preferred that each injection molding channel includes one or at least two injection runners.
It is preferred that the shape of the unit groove is corresponding with the shape of the simple grain product.
Specifically, the unit groove is trapezoidal, is easy to the demoulding after injecting glue.
The invention also discloses a kind of SIP sealed in units, the list lost is carried on the back so that super thick is made for potted element chip
Granule product, including lead frame and injection moulding apparatus, the injection moulding apparatus include the SIP and encapsulate rubber moulding, and the lead frame includes base
Several half-etching bases corresponding with the unit groove, each described half are provided with a determining deviation on plate, the substrate
The element chip that base is used to install a simple grain product is etched, the SIP encapsulation rubber moulding can be placed on the half-etching base
So that element chip described in one is located at described in one in unit groove, the injection moulding apparatus is described from gum-injecting port edge by packaging plastic
Injection molding channel is molded to the unit groove one by one.
Compared with prior art, SIP of the present utility model encapsulates one unit groove of rubber moulding accordingly individual packages one
Simple grain product, and unit groove one injection molding channel of correspondence, during injecting glue, unit groove can fill packaging plastic quickly, no
But injecting glue speed is not likely to produce bubble soon.On the other hand, one unit groove of the utility model correspondence, one injection molding channel, can be with
Effectively shorten the length of injection molding channel so that air is able to effectively exclude, reduce the generation of interior void.Another further aspect, by
In the unit groove of the different simple grain product encapsulation of the utility model be independent of each other, therefore without specially segmentation production after injecting glue
Product, by follow-up back etching can separating simple grain product independence, cost is low, package speed is fast and can be effective
Prevent cutting from slipping up.
Brief description of the drawings
Fig. 1 a to Fig. 1 d are the encapsulation flow charts of prior art.
Fig. 2 a are the injecting glue schematic diagrames of SIP sealed in units described in the utility model first embodiment.
Fig. 2 b are the structural representations that SIP described in the utility model first embodiment encapsulates rubber moulding.
Fig. 2 c are the structural representations of lead frame described in the utility model first embodiment.
Fig. 3 a are the injecting glue schematic diagrames of SIP sealed in units described in the utility model second embodiment.
Fig. 3 b are the structural representations that SIP described in the utility model second embodiment encapsulates rubber moulding.
Fig. 3 c are the structural representations of lead frame described in the utility model second embodiment.
Fig. 4 a to Fig. 4 d are that the utility model is packaged that SIP encapsulation knots are made using the lead frame to element chip
The injecting glue flow chart of structure.
Fig. 5 is the schematic perspective view of SIP encapsulating structures described in the utility model.
Embodiment
To describe technology contents of the present utility model, construction feature, the objects and the effects in detail, below in conjunction with implementation
Mode simultaneously coordinates accompanying drawing to be explained in detail.
With reference to Fig. 2 a to Fig. 2 c, the utility model discloses a kind of SIP sealed in units 100, for potted element chip 30
(as shown in fig. 4 a) the simple grain product 400 (as shown in figure 4d) lost, including lead frame 20 and injection moulding apparatus, institute are carried on the back so that super thick is made
State injection moulding apparatus packaging plastic is molded to lead frame 20, with the element chip 30 at package leadframe 20.
With reference to Fig. 2 a and Fig. 2 b, the injection moulding apparatus includes SIP and encapsulates rubber moulding 10, and the SIP encapsulation rubber moulding 10 includes mould
Several unit grooves 12 and several described units for have body 11, being opened on the die ontology 11 with a determining deviation
The one-to-one injection molding channel 13 of groove 12 and at least one gum-injecting port 14, it is recessed that the injection molding channel 13 connects corresponding unit
Groove 12 and gum-injecting port 14, each correspondence of unit groove 12 one simple grain product 400 of encapsulation.
In the present embodiment, the unit groove 12 has two rows, often arranges 8, and two rows unit groove location it is relative with
And line up 8 row, gum-injecting port 14 is one-to-one therewith to have 8, and the injection moulding apparatus can be by packaging plastic from the gum-injecting port 14
It is molded one by one to the unit groove 12 along the injection molding channel 13.Certainly, the unit groove 12 can also line up 1 row, 3
Row, 4 rows etc., the number often arranged can be set according to actual conditions.
Preferably, unit groove 12 described in two rows is respectively arranged on the left and right sides of the gum-injecting port 14.Certainly, described in two rows
Unit groove 12 can also be located at the left side or right side of the gum-injecting port 14 simultaneously, and the row of unit groove 12 is not limited in two
Row, and the unit groove 12 of the left and right sides of gum-injecting port 14 does not require symmetrical.
Wherein, the shape of the unit groove 12 is corresponding with the shape of the simple grain product 400.Specifically, the list
First groove 12 is trapezoidal, is easy to the demoulding after injecting glue.
Wherein, each injection molding channel 13 includes one or at least two injection runners.In the present embodiment, Mei Yisuo
Stating injection molding channel 13 includes three injection runners.
With reference to Fig. 2 a and Fig. 2 c, the lead frame 20 is included on substrate 21, the substrate 21 with a determining deviation provided with some
The individual half-etching base 22 being separated from each other, each half-etching base 22 is used for the element core for installing a simple grain product 400
Piece 30.Wherein, the position distribution of the half-etching base 22 is corresponding with the unit groove 12.In the present embodiment, a base
Plate is provided with 8 half-etching bases 22.During injection, SIP encapsulation rubber moulding 10 can be placed on the half-etching base 22 so that
Element chip 30 described in one is located at described in one in unit groove 12, and the injection moulding apparatus is by packaging plastic from the gum-injecting port 14 along institute
Injection molding channel 13 is stated to be molded one by one to the unit groove 12 with potted element chip 30.
With continued reference to Fig. 2 a to Fig. 2 c, one and a half etching base 22 is provided with each substrate 21, the lead frame 20 is wrapped
Two substrates 21 are included, two substrates 21 are arranged at the left and right sides of gum-injecting port 14 parallel.Two row's unit grooves 12 are correspondingly arranged at two bases
With to two substrates progress injecting glue on plate 21.
Wherein, the position of half-etching base 22 and the unit groove 12 on die ontology 11, distribution are corresponding on substrate 21, its
Can correspond or correspond at double.For example in the present embodiment, 16 half-etching bases can be set on substrate 21
22, die ontology 11 is packaged to the element chip 30 on substrate 21 in two times.
With reference to Fig. 2 a, with reference to Fig. 4 a to Fig. 4 d and Fig. 5, when the utility model is molded to element chip 30, including
Following steps：(1) lead frame 20 is provided；(2) element chip 30 of several simple grain products is pasted onto correspondingly
On several half-etching bases 22；(3) packaging plastic is molded to the half-etching base correspondingly by injection molding channel 13
22 sentence each chip component 30 of individual packages；(4) back etching is carried out to the lead frame after encapsulation after encapsulation adhesive curing,
Cause several half-etching bases 22 on the substrate to be separated from each other while the back is etched and produced so that N number of simple grain is made
Product 400.
Wherein, the step (3) specifically includes：SIP encapsulation rubber mouldings 10 are placed on the half-etching base 22, so that one
The element chip 30 is located at described in one in unit groove 12；Packaging plastic is molded to institute correspondingly by injection molding channel 13
State in unit groove 12 so that packaging plastic is filled in the unit groove 12, so as to encapsulate the chip component 30.
It is the utility model second embodiment with reference to Fig. 3 a to Fig. 3 c, and unlike first embodiment, in the embodiment
In, the left and right sides of the gum-injecting port 14 is respectively arranged with two row's unit grooves 12, and unit groove 12 is corresponding described in two rows
Injection molding channel 13 converges at the gum-injecting port 14 closing on.Wherein, the left and right sides unit groove of the gum-injecting port 14 is not limited
System, in two rows, can also be three rows, four rows etc..
Above disclosed is only preferred embodiment of the present utility model, can not limit this practicality with this certainly new
The interest field of type, therefore the equivalent variations made according to present utility model application the scope of the claims, still belong to the utility model and are covered
Scope.
Claims (9)
1. a kind of SIP encapsulates rubber moulding, the simple grain product lost is carried on the back so that super thick is made for potted element chip, it is characterised in that：Bag
It is several unit grooves for include die ontology, being opened on the die ontology with a determining deviation, recessed with unit several described
The one-to-one injection molding channel of groove and at least one gum-injecting port, the injection molding channel connect corresponding unit groove and injecting glue
Mouthful, each unit groove correspondence one simple grain product of encapsulation.
2. SIP as claimed in claim 1 encapsulates rubber moulding, it is characterised in that：The unit groove is arranged in a row or at least two rows,
Often row has N number of unit groove, and the gum-injecting port has N number of and respectively with every row N number of unit groove corresponding, the note
Mould the corresponding unit groove of flow passage and corresponding gum-injecting port.
3. SIP as claimed in claim 2 encapsulates rubber moulding, it is characterised in that：The left side and/or right side of the gum-injecting port are set respectively
There are at least two row's unit grooves, homonymy often arranges N number of unit groove location relatively to line up N row.
4. SIP as claimed in claim 3 encapsulates rubber moulding, it is characterised in that：Unit groove correspondence described at least two of each column
Injection molding channel converge at the gum-injecting port closing on.
5. SIP as claimed in claim 1 encapsulates rubber moulding, it is characterised in that：The gum-injecting port be respectively arranged on the left side and the right side to
The corresponding unit groove of a few row.
6. SIP as claimed in claim 1 encapsulates rubber moulding, it is characterised in that：Each injection molding channel is including one or at least
Two injection runners.
7. SIP as claimed in claim 1 encapsulates rubber moulding, it is characterised in that：The shape of the unit groove is produced with the simple grain
The shape of product is corresponding.
8. SIP as claimed in claim 7 encapsulates rubber moulding, it is characterised in that：The unit groove is trapezoidal.
9. a kind of SIP sealed in units, the simple grain product lost is carried on the back for potted element chip so that super thick is made, it is characterised in that：Bag
Lead frame and injection moulding apparatus are included, the injection moulding apparatus includes the SIP encapsulation rubber mouldings as any one of claim 1-8, institute
Stating lead frame is included on substrate, the substrate with a determining deviation provided with several half-etching bottoms corresponding with the unit groove
Seat, each half-etching base is used for the element chip for installing a simple grain product, and the SIP encapsulation rubber moulding can be placed on described
So that element chip described in one is located at described in one in unit groove on half-etching base, the injection moulding apparatus is by packaging plastic from described
Gum-injecting port is molded to the unit groove one by one along the injection molding channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621103897.1U CN206516614U (en) | 2016-09-30 | 2016-09-30 | SIP encapsulates rubber moulding and sealed in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621103897.1U CN206516614U (en) | 2016-09-30 | 2016-09-30 | SIP encapsulates rubber moulding and sealed in unit |
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| Publication Number | Publication Date |
|---|---|
| CN206516614U true CN206516614U (en) | 2017-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201621103897.1U Active CN206516614U (en) | 2016-09-30 | 2016-09-30 | SIP encapsulates rubber moulding and sealed in unit |
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| Country | Link |
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| CN (1) | CN206516614U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531665A (en) * | 2016-09-30 | 2017-03-22 | 乐依文半导体(东莞)有限公司 | SIP packaging glue film, packaging device, and packaging method |
-
2016
- 2016-09-30 CN CN201621103897.1U patent/CN206516614U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531665A (en) * | 2016-09-30 | 2017-03-22 | 乐依文半导体(东莞)有限公司 | SIP packaging glue film, packaging device, and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220517 Address after: 523000 No. 7, Zhenyuan West Road, Chang'an Town, Dongguan City, Guangdong Province Patentee after: Liance Youte semiconductor (Dongguan) Co.,Ltd. Address before: 523000 Zhen'an science and Technology Industrial Park, Chang'an Town, Dongguan City, Guangdong Province Patentee before: Lewin semiconductor (Dongguan) Co.,Ltd. |
|
| TR01 | Transfer of patent right |