CN206864462U - A kind of sorting-type storage chip encapsulating structure - Google Patents
A kind of sorting-type storage chip encapsulating structure Download PDFInfo
- Publication number
- CN206864462U CN206864462U CN201720660136.4U CN201720660136U CN206864462U CN 206864462 U CN206864462 U CN 206864462U CN 201720660136 U CN201720660136 U CN 201720660136U CN 206864462 U CN206864462 U CN 206864462U
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- CN
- China
- Prior art keywords
- storage chip
- lead frame
- sorting
- layer
- encapsulating structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
It the utility model is related to a kind of sorting-type storage chip encapsulating structure, include lead frame, the front of lead frame is provided with front potting resin, the back side is provided with back side potting resin, storage chip layer and pad chip layer are provided with the potting resin of front, storage chip layer is stacked in pad chip layer, and pad chip layer is arranged on lead frame, it is connected between storage chip layer and lead frame and is bonded gold thread, lead frame is provided at both ends with plating pin；The sorting-type storage chip encapsulating structure of the utility model, due to that the heart need not be pressed to make, timbering material manufacture craft is simple, and the flatness of support is good compared with the material flatness for having the pressure heart, is advantageous to the process operations such as packaging and routing, chip stickup；Encapsulating structure takes unbalanced mode up and down, can effectively alleviate the mould flow velocity degree mismatch problem in encapsulation injection molded process.
Description
Technical field
It the utility model is related to technical field of semiconductor encapsulation, and in particular to a kind of sorting-type storage chip encapsulating structure.
Background technology
After wafer manufacturing comes out, into wafer coupons test phase, genuine is according to size heterogeneity, by what is sorted out again
Storage chip carries out requiring that encapsulation factory is encapsulated again by specified specification.
Such sorting general back side of chip is already provided with original-pack chip thin films adhesive tape, because the sorting chip memory time is longer,
Chip cannot be typically directly used in be pasted on lead frame.In existing encapsulating products, the note of upper and lower balanced type is taken
Mould.In order to accommodate 1-2 layers chip even more chips in TSOP packaging bodies, down-lead bracket needs to do the deeper pressure heart
Make, the down-lead bracket of this depth pressure heart does not reach the requirement of packaging technology, and due to pressing, the heart is too deep to be caused in chip routing key
Bonding point during conjunction is unstable, and chip excessively may result in chip and leak outside in entirely encapsulation cavity, and influence product can
By property, original encapsulating structure chip number of plies is low, and capacity is small.
Utility model content
The purpose of the utility model is to provide a kind of sorting-type storage chip encapsulation knot for overcome the deficiencies in the prior art
Structure.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of sorting-type storage chip encapsulating structure,
Comprising lead frame, the front of lead frame is provided with front potting resin, and the back side is provided with back side potting resin, front encapsulation
Storage chip layer and pad chip layer are provided with resin, storage chip layer is stacked in pad chip layer, and pad chip layer is set
Put on the lead frames, be connected between storage chip layer and lead frame and be bonded gold thread, lead frame is provided at both ends with electricity
Plate pin.
Preferably, the storage chip layer include be sequentially stacked on top layer sorting-type storage chip in pad chip layer and
Bottom sorting-type storage chip.
Preferably, the front of the lead frame is provided with adhesive tape layer, and pad chip is glued by adhesive tape layer and lead frame
Even.
Preferably, the thickness of the adhesive tape layer is 20 microns.
Preferably, the size of the pad chip layer is more than storage chip layer.
Due to the utilization of above-mentioned technical proposal, the utility model has following advantages compared with prior art：
The sorting-type storage chip encapsulating structure of the utility model, due to that the heart need not be pressed to make, timbering material system
Make that technique is simple, the flatness of support is good compared with the material flatness for having the pressure heart, is advantageous to packaging and routing, and the processing procedures such as chip is pasted are made
Industry；Encapsulating structure takes unbalanced mode up and down, can effectively alleviate the mould flow velocity degree mismatch problem in encapsulation injection molded process.
Brief description of the drawings
Technical solutions of the utility model are described further below in conjunction with the accompanying drawings：
Accompanying drawing 1 is a kind of schematic diagram of sorting-type storage chip encapsulating structure described in the utility model.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment the utility model is described in further detail.
As shown in figure 1, a kind of sorting-type storage chip encapsulating structure described in the utility model, comprising lead frame 4, draws
The front of wire frame 4 is provided with front potting resin 1, and the back side is provided with back side potting resin 2, set in front potting resin 1
There are storage chip layer and pad chip layer 5, pad chip layer 5 includes without electrical functions, storage chip layer and is sequentially stacked on pad
Top layer sorting-type storage chip 9 and bottom sorting-type storage chip 7 in chip layer 5, the size of pad chip layer 5 are more than top layer
The size of sorting-type storage chip 9 and bottom sorting-type storage chip 7, top layer sorting-type storage chip 9 and bottom sorting-type are deposited
Storage chip 7 is bonded successively by the adhesive tape carried, and the tape thickness carried is 20~25 microns；The front of the lead frame 4
Adhesive tape layer 6 is provided with, the thickness of adhesive tape layer 6 is 20 microns, and pad chip 5 passes through adhesive tape layer 6 and the adhesion of lead frame 4；It is described
Interconnection is provided between top layer sorting-type storage chip 9 and bottom sorting-type storage chip 7 and lead frame 4 is bonded gold
Line 3, bonding gold thread 3 carry out the electric connection of chip using routing combination welding technique, and lead frame 4 is provided at both ends with plating
Pin 8.
It the above is only concrete application example of the present utility model, do not form any limit to the scope of protection of the utility model
System.All technical schemes formed using equivalent transformation or equivalent replacement, all fall within the utility model rights protection scope it
It is interior.
Claims (5)
- A kind of 1. sorting-type storage chip encapsulating structure, it is characterised in that：Include lead frame（4）, lead frame（4）Front It is provided with front potting resin（1）, the back side is provided with back side potting resin（2）, front potting resin（1）In be provided with storage core Lamella and pad chip layer（5）, storage chip layer is stacked on pad chip layer（5）On, pad chip layer（5）It is arranged on lead frame Frame（4）On, storage chip layer and lead frame（4）Between be connected with bonding gold thread（3）, lead frame（4）Be provided at both ends with Electroplate pin（8）.
- 2. sorting-type storage chip encapsulating structure according to claim 1, it is characterised in that：The storage chip layer includes It is sequentially stacked on pad chip layer（5）On top layer sorting-type storage chip（9）With bottom sorting-type storage chip（7）.
- 3. sorting-type storage chip encapsulating structure according to claim 1, it is characterised in that：The lead frame（4）'s Front is provided with adhesive tape layer（6）, pad chip（5）Pass through adhesive tape layer（6）With lead frame（4）Adhesion.
- 4. sorting-type storage chip encapsulating structure according to claim 3, it is characterised in that：The adhesive tape layer（6）Thickness Spend for 20 microns.
- 5. sorting-type storage chip encapsulating structure according to claim 1, it is characterised in that：The pad chip layer（5） Size be more than storage chip layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720660136.4U CN206864462U (en) | 2017-06-08 | 2017-06-08 | A kind of sorting-type storage chip encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720660136.4U CN206864462U (en) | 2017-06-08 | 2017-06-08 | A kind of sorting-type storage chip encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206864462U true CN206864462U (en) | 2018-01-09 |
Family
ID=60831330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720660136.4U Active CN206864462U (en) | 2017-06-08 | 2017-06-08 | A kind of sorting-type storage chip encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206864462U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034386A1 (en) * | 2018-08-14 | 2020-02-20 | 苏州德林泰精工科技有限公司 | Stepped stacked chip packaging structure employing resin gasket and preparation process |
-
2017
- 2017-06-08 CN CN201720660136.4U patent/CN206864462U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034386A1 (en) * | 2018-08-14 | 2020-02-20 | 苏州德林泰精工科技有限公司 | Stepped stacked chip packaging structure employing resin gasket and preparation process |
| US11462448B2 (en) | 2018-08-14 | 2022-10-04 | Su Zhou Dream Technology Co., Ltd. | Step-type stacked chip packaging structure based on resin spacer and preparation process |
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