CN207760033U - The fan-out package structure of MEMS hydrophone chips - Google Patents
The fan-out package structure of MEMS hydrophone chips Download PDFInfo
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- CN207760033U CN207760033U CN201721453112.8U CN201721453112U CN207760033U CN 207760033 U CN207760033 U CN 207760033U CN 201721453112 U CN201721453112 U CN 201721453112U CN 207760033 U CN207760033 U CN 207760033U
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Abstract
The utility model provides the fan-out package structure of MEMS hydrophone chips, and excessive to solve MEMS hydrophones chip package process package dimension in the prior art, reliability is not good enough and complex process, problem of high cost, including：RDL wiring layers, MEMS hydrophone chips, the MEMS hydrophones flip-chip is on the upper surface of the RDL wiring layers；Functional chip, passive device and active device, the functional chip, the passive device and the active device are inverted in respectively on the upper surface of the RDL wiring layers；Encapsulated layer, the encapsulated layer are arranged on the upper surface of the RDL wiring layers, and the MEMS hydrophones chip, the functional chip, the passive device and the active device are enclosed in the encapsulated layer.
Description
Technical field
The utility model is related to hydrophone technical fields, specially the fan-out package structure of MEMS hydrophones chip.
Background technology
Underwater pressure change can be generated acoustical signal and be converted to electric signal by hydrophone, also known as underwater microphone,
So as to reliably obtain underwater pressure, it is commonly used for the mapping of sound field, the detection calibration of sonic transducer and ultrasound and sets
The research of the field of acoustics such as standby testing calibration and Performance Evaluation.It is with the continuous development of science and technology and progressive, hydrophone
Application technology is also gradually matured.
Existing piezoelectric mems hydrophone chip and each function module device are being connected on pcb board so independently
It is wired up again with plastic casing afterwards, such packaged type is maximum to be disadvantageous in that package dimension is excessive, and reliability is inadequate
Good and complex process, it is of high cost.
Utility model content
The shortcomings that for prior art described above, the purpose of this utility model is to provide the fans of MEMS hydrophone chips
Go out type encapsulating structure, excessive to solve MEMS hydrophones chip package process package dimension in the prior art, reliability is not good enough
And complex process, problem of high cost.
Its technical solution is such：The fan-out package structure of MEMS hydrophone chips, which is characterized in that including：
RDL wiring layers, the RDL wiring layers include upper surface and the lower surface opposite with the upper surface；
MEMS hydrophone chips, the MEMS hydrophones flip-chip is on the upper surface of the RDL wiring layers；
Functional chip, passive device and active device, the functional chip, the passive device and the active device
Part is inverted in respectively on the upper surface of the RDL wiring layers；
Encapsulated layer, the encapsulated layer are arranged on the upper surface of the RDL wiring layers, and by the MEMS hydrophones core
Piece, the functional chip, the passive device and the active device are enclosed in the encapsulated layer.
Further, the RDL wiring layers include the first RDL wiring layers and are stacked on the first RDL wiring layers
The upper surface of 2nd RDL wiring layers, the first RDL wiring layers is equipped with copper post, the top surface of the encapsulated layer and the copper post
Top surface maintain an equal level, between the first RDL wiring layers and the 2nd RDL wiring layers pass through copper post, scolding tin connection, the MEMS
Hydrophone chip attachment is in the 2nd RDL wiring layers, the functional chip, the passive device and the active device point
It is not inverted on the first RDL wiring layers.
Further, the lower surface of the 2nd RDL wiring layers is arranged with metal and soldered ball under soldered ball；
Further, the RDL wiring layers include metallic circuit and the dielectric that is arranged between the metallic circuit
Layer, the MEMS hydrophones chip, the functional chip, the passive device and the active device pin be separately connected
The metallic circuit, metal and the soldered ball are separately connected the metallic circuit under the copper post, the soldered ball.
Further, the passive device includes resistance, capacitance, inductance, filter, antenna, and the functional chip includes
Dsp chip, the active device include booster circuit, reduction voltage circuit, driving circuit.
The utility model realizes the wafer-level packaging of MEMS hydrophone chips, by chip and functional chip entirety plastic packaging, envelope
Dress size greatly reduces, and good reliability；Chip is encapsulated comprehensively using epoxide resin material, good reliability, encapsulating structure is adopted
Simple in structure with RDL wiring layers, there is salient point on positive and negative both sides, do not need routing technique, also do not need high-cost silicon perforation work
Skill (TSV), and can realize the encapsulation of MEMS hydrophone chips, reduce manufacturing process, reduce critical technological point, cost reduces；Together
When the utility model realize the fan-out packages of MEMS hydrophones, the thin space having due to fan-out package technology itself,
The high advantage of wiring density so that there are the advantages such as size is small using the MEMS hydrophones of this form encapsulation, while using fan
The MEMS hydrophone RDL wiring layers for going out type encapsulation can be directly connected to the pin of chip, therefore good electric property, signal transduction
When amplitude it is small, signal time delay can also shorten；Arranging multiplayer RDL wiring layers in the utility model, can meet that device is more, pin
For the demand of pin number in the case of a fairly large number of；In addition multilayer RDL wiring layers can also provide reflux for signal transmission
Path provides electro-magnetic screen layer etc., and signal transmission performance is more preferable.
Description of the drawings
The step of Fig. 1 is the first packaging method of the fan-out package structure of the MEMS hydrophone chips of the utility model
The flow diagram of a to step d；
The step of Fig. 2 is the first packaging method of the fan-out package structure of the MEMS hydrophone chips of the utility model
The flow diagram of e to step i；
The step of Fig. 3 is the first packaging method of the fan-out package structure of the MEMS hydrophone chips of the utility model
The flow diagram of j to step l；
The step of Fig. 4 is second of packaging method of the fan-out package structure of the MEMS hydrophone chips of the utility model
The flow diagram of a to step d；
The step of Fig. 5 is second of packaging method of the fan-out package structure of the MEMS hydrophone chips of the utility model
The flow diagram of e to step h；
The step of Fig. 6 is second of packaging method of the fan-out package structure of the MEMS hydrophone chips of the utility model
The flow diagram of i to step k；
The step of Fig. 7 is second of packaging method of the fan-out package structure of the MEMS hydrophone chips of the utility model
The flow diagram of i to step k；
Fig. 8 is the fan-out package structural schematic diagram of the MEMS hydrophone chips of the utility model.
Specific implementation mode
See Fig. 8, the fan-out package structure of the MEMS hydrophone chips of the utility model, including：
RDL wiring layers, RDL wiring layers include the first RDL wiring layers 1 and are stacked on second on the first RDL wiring layers 1
RDL wiring layers 2, the upper surfaces of the first RDL wiring layers 1 are equipped with copper post 3, the first RDL wiring layers 1 and the 2nd RDL wiring layers 2 it
Between connected by copper post 3, scolding tin, MEMS hydrophones chip 4 is mounted on the 2nd RDL wiring layers 2, functional chip 5, passive device 6
And active device 7 is inverted in respectively on the first RDL wiring layers 1, on the first RDL wiring layers 1 and the 2nd RDL wiring layers 2 respectively
Equipped with encapsulated layer 8, the top surface of encapsulated layer 8 maintains an equal level with the top surface of copper post 3, and by MEMS hydrophones chip 4, functional chip 5, passive
Device 6 and active device 7 are enclosed in encapsulated layer 8, and the lower surface of the 2nd RDL wiring layers 2 is arranged with 9 He of metal under soldered ball
Soldered ball 10；
First RDL wiring layers 1 and the 2nd RDL wiring layers 2 respectively include metallic circuit 11 and setting metallic circuit 11 it
Between insulating medium layer 12, MEMS hydrophones chip 4, functional chip 5, passive device 6 and active device 7 pin connect respectively
Connect metallic circuit 11, metal 9 and soldered ball 10 are separately connected metallic circuit 11 under copper post 3, soldered ball.
Passive device 6 includes resistance, capacitance, inductance, filter, antenna, and functional chip 5 includes dsp chip, active device
7 include booster circuit, reduction voltage circuit, driving circuit.
See that Fig. 1 to Fig. 3, the packaging method of the first MEMS hydrophone chip of the utility model include the following steps：
Step a：Prepare the first interim support plate 131 and second of encapsulation and encapsulates interim support plate 132, the first interim support plate of encapsulation
131 and second encapsulate interim support plate 132 respectively glass substrate；Step b：Respectively in the first interim support plate 131 and second of encapsulation
Encapsulate attachment adhesive tape layer 14 on interim support plate 132；Step c：Respectively in the interim interim load of the encapsulation of support plate 131 and second of the first encapsulation
The first RDL wiring layers 1, the 2nd RDL wiring layers 2 are prepared on the adhesive tape layer 14 of plate 132；Step d：It sinks on the first RDL wiring layers 1
Product seed layer 15；Step e：Copper post 3 is prepared in the seed layer 15 that first encapsulates interim support plate 131；Step f：To seed layer 15
Carrying out dry etching makes the first RDL wiring layers 1 expose；
Step g：Prepare MEMS hydrophones chip 4, function element 5, passive device 6 and active device 7, MEMS water is listened
In 4 upside-down mounting to the 2nd RDL wiring layers 2 of device chip, by function element 5, passive device 6 and 7 upside-down mounting of active device to the first RDL
On wiring layer 1；
Step h：It is packaged using epoxide resin material, respectively by copper post 3, MEMS hydrophones chip 4 and function element
5, passive device 6, active device 7 are enclosed in encapsulated layer 8；
Step i：Based on interim 132 and the 2nd RDL wiring layers 2 of support plate of second encapsulation of the separation of adhesive tape layer 14 so that the 2nd RDL
Expose the lower surface of wiring layer 2；
Step j：The gold of 2 lower surface of copper post 3 and the 2nd RDL wiring layers on the first RDL wiring layers 1 is connected by planting soldered ball
Belong to circuit to realize the connection of the first RDL wiring layers 1 and the 2nd RDL wiring layers 2；
Step k：Based on interim 131 and the first RDL wiring layers 1 of support plate of first encapsulation of the separation of adhesive tape layer 14 so that the first RDL
Expose the lower surface of wiring layer 1；
Step l：Metal 9 and soldered ball 10 under soldered ball are prepared under the lower surface of the first RDL wiring layers 1.
See that Fig. 4 to Fig. 7, the packaging method of second of MEMS hydrophone chip of the utility model include the following steps：
Step a：Prepare to encapsulate interim support plate 131, it is glass substrate to encapsulate interim support plate 131；Step b：It is interim in encapsulation
Adhere to adhesive tape layer 14 on support plate 131；Step c：The first RDL wiring layers 1 are prepared on adhesive tape layer 14；Step d：In the first RDL cloth
Deposited seed layer 15 on line layer 1；Step e：Copper post 3 is prepared in seed layer 15；Step f：Dry etching is carried out to seed layer 15
So that the first RDL wiring layers 1 expose；
Step g：Preparatory function device 5, passive device 6 and active device 7, by function element 5, passive device 6 and
In active device 7 upside-down mounting to the first RDL wiring layers 1；
Step h：It is packaged using encapsulating material, by copper post 3,7 envelope of function element 5, passive device 6 and active device
In 8 layers of encapsulation；
Step i：The 2nd RDL wiring layers 2 are prepared on encapsulated layer 8；
Step j：Prepare MEMS hydrophones chip 4, it will be 2 in 4 upside-down mounting to the 2nd RDL wiring layers of MEMS hydrophones chip；；
Step k：It is packaged using encapsulating material epoxy resin, MEMS hydrophones chip 4 is enclosed in encapsulated layer 8.
Step l：Interim 131 and the first RDL wiring layers 1 of support plate are encapsulated based on the separation of adhesive tape layer 13 so that the first RDL is connected up
Expose the lower surface of layer 1；
Step m：Metal 9 and soldered ball 10 under soldered ball are prepared under the lower surface of the first RDL wiring layers 1.
The fan-out package structure of the MEMS hydrophone chips of the utility model, by chip and functional chip, passive device,
Active device entirety plastic packaging, package dimension greatly reduces, and good reliability；Chip is encapsulated comprehensively using epoxide resin material,
Good reliability, encapsulating structure uses RDL wiring layers, simple in structure, and there is salient point on positive and negative both sides and is not necessarily to TSV techniques, reduce
Manufacturing process, reduces critical technological point, and cost reduces；The utility model realizes the fan-out package of MEMS hydrophones simultaneously, by
In the high advantage of thin space, wiring density that fan-out package technology itself has so that using the MEMS of this form encapsulation
Hydrophone has the advantages such as size is small, while can be directly connected to using the MEMS hydrophone RDL wiring layers of fan-out package
The pin of chip, therefore good electric property, amplitude is small when signal transduction, and signal time delay can also shorten, in addition the utility model
The encapsulation of MEMS hydrophone chips can facilitate stacked wafer to connect, the utility model by the way that copper post is arranged on RDL wiring layers
Middle arranging multiplayer RDL wiring layers can meet in the case that device is more, pin number is more the needs of for pin number；
In addition multilayer RDL wiring layers can also provide return flow path for signal transmission, provide electro-magnetic screen layer etc., signal transmission performance is more
It is good.
More than, the only preferable specific implementation mode of the utility model, but the scope of protection of the utility model is not limited to
In this, any people for being familiar with the technology is in the technical scope disclosed by the utility model, the change or replacement that can be readily occurred in,
It should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model should be with claim
Subject to protection domain.
Claims (7)
- The fan-out package structure of 1.MEMS hydrophone chips, which is characterized in that it includes：RDL wiring layers, the RDL wiring layers include upper surface and the lower surface opposite with the upper surface；MEMS hydrophone chips, the MEMS hydrophones flip-chip is on the upper surface of the RDL wiring layers；Functional chip, passive device and active device, the functional chip, the passive device and the active device point It is not inverted on the upper surface of the RDL wiring layers；Encapsulated layer, the encapsulated layer are arranged on the upper surface of the RDL wiring layers, and by the MEMS hydrophones chip, institute Functional chip, the passive device and the active device is stated to be enclosed in the encapsulated layer.
- 2. the fan-out package structure of MEMS hydrophones chip according to claim 1, it is characterised in that：The RDL cloth Line layer includes the first RDL wiring layers and is stacked on the 2nd RDL wiring layers on the first RDL wiring layers, the first RDL cloth The upper surface of line layer is equipped with copper post, and the top surface of the encapsulated layer and the top surface of the copper post maintain an equal level, the first RDL wiring layers It is connected by copper post, scolding tin between the 2nd RDL wiring layers, the MEMS hydrophones chip attachment is in the 2nd RDL Wiring layer, the functional chip, the passive device and the active device are inverted in the first RDL wiring layers respectively On.
- 3. the fan-out package structure of MEMS hydrophones chip according to claim 2, it is characterised in that：Described second The lower surface of RDL wiring layers is arranged with metal and soldered ball under soldered ball.
- 4. the fan-out package structure of MEMS hydrophones chip according to claim 3, it is characterised in that：The RDL cloth Line layer includes metallic circuit and the insulating medium layer that is arranged between the metallic circuit, the MEMS hydrophones chip, described The pin of functional chip, the passive device and the active device is separately connected the metallic circuit, the copper post, described Metal and the soldered ball are separately connected the metallic circuit under soldered ball.
- 5. the fan-out package structure of MEMS hydrophones chip according to claim 1, it is characterised in that：The passive device Part includes resistance, capacitance, inductance, filter, antenna.
- 6. the fan-out package structure of MEMS hydrophones chip according to claim 1, it is characterised in that：The function core Piece includes dsp chip.
- 7. the fan-out package structure of MEMS hydrophones chip according to claim 1, it is characterised in that：The active device Part includes booster circuit, reduction voltage circuit, driving circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721453112.8U CN207760033U (en) | 2017-11-03 | 2017-11-03 | The fan-out package structure of MEMS hydrophone chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721453112.8U CN207760033U (en) | 2017-11-03 | 2017-11-03 | The fan-out package structure of MEMS hydrophone chips |
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| Publication Number | Publication Date |
|---|---|
| CN207760033U true CN207760033U (en) | 2018-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721453112.8U Active CN207760033U (en) | 2017-11-03 | 2017-11-03 | The fan-out package structure of MEMS hydrophone chips |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107758604A (en) * | 2017-11-03 | 2018-03-06 | 纽威仕微电子（无锡）有限公司 | The fan-out package structure and method of MEMS hydrophone chips |
| CN110246766A (en) * | 2019-06-12 | 2019-09-17 | 上海先方半导体有限公司 | A kind of fan-out packaging structure and its manufacturing method |
-
2017
- 2017-11-03 CN CN201721453112.8U patent/CN207760033U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107758604A (en) * | 2017-11-03 | 2018-03-06 | 纽威仕微电子（无锡）有限公司 | The fan-out package structure and method of MEMS hydrophone chips |
| CN110246766A (en) * | 2019-06-12 | 2019-09-17 | 上海先方半导体有限公司 | A kind of fan-out packaging structure and its manufacturing method |
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