CN105590904A - Fingerprint identification multi-chip package structure and preparation method thereof - Google Patents

Abstract

The present invention discloses a fingerprint identification multi-chip package structure and a preparation method thereof, belonging to the field of the integrated circuit package and sensor technology, etc. One or more than one functional chips are connected with a substrate pad through a Flip chip technology or a Wire bonding technology and are encapsulated through mediums, an upper layer of a sensing chip is connected with the substrate pad through a conduction line post, a conductive hole, penetrating a packaging body, is arranged at the periphery of a chip in a lower layer of a packaging body. The fingerprint identification multi-chip package structure and a preparation method thereof are able to ensure that the processing technology of each chip is mutually independent, therefore the work efficiency is improved, and the yield is guaranteed.

Description

A kind of fingerprint recognition multichip packaging structure and preparation method thereof

Technical field

The present invention relates to the technology such as microelectronic packaging technology, sensor technology and chip interconnect.

Background technology

Along with the intelligent degree of end product improves constantly, various sensor chips emerge in an endless stream. Sensing chip has been expanded the application of the product such as smart mobile phone, panel computer, and for example, the appearance of fingerprint recognition chip has just improved the security of the said goods greatly.

For sensing chip, its maximum is characterised in that its chip surface exists induction region, and this region and its environmental stimuli that will identify are had an effect, and produces the signal of telecommunication that chip can be identified and process. The distance of this region and environmental stimuli is short as far as possible, or induction region is exposed, so that the signal producing can be detected. Current a lot of chip technology, because the restriction that is subject to package carrier size cannot be by multiple chip distribution on same surface. In prior art, having a solution is that single or multiple functional chips are first encapsulated in to substrate one side, then at substrate opposite side encapsulation sensing chip, thereby meet multi-chip integration packaging, but when substrate one side packing, opposite side contacts with the external world, easily causes contact staining in the process of producing, in the time that this side is encapsulated, can there is the risk of layering, affect the yield of integral product.

During for solution Double-face adhesive core there is the lamination problem causing because polluting in opposite side, domestic certain company has proposed a kind of employing sensing chip has been carried out to grooving processing, single or multiple functional chips are placed in groove and are encapsulated, thereby meet multi-chip integration packaging, but sensing chip is carried out to grooving processing, technique is comparatively complicated, easily causes sensing chip loss itself, or the defect such as generation micro-crack makes the reliability decrease of product.

Summary of the invention

The present invention is directed to sensing chip, particularly fingerprint recognition class chip provides a kind of low cost, the encapsulation that simple, reliability is high and the Integrated Solution that interconnects, utilize dielectric material to be coated single or multiple functional chips, generate conductive layer by sputtering technology at dielectric layer upper surface, complete wiring by Wiring technique again, then carry out the operation such as upper core, routing to sensing chip, avoided sensing chip itself to carry out the operations such as grooving.

A kind of fingerprint recognition multichip packaging structure disclosed by the invention comprises a sensing chip, and its surface exists induction region; Step horizontal plane is lower than sensing chip surface, by Wirebonding technique, the chip bonding pad on sensing chip surface is connected on the reserved conducting terminal of dielectric layer, thereby reach the effect interconnecting with substrate, the signal that this conductive structure collects sensing chip spreads out of, and realizes inducing function.

A kind of fingerprint recognition multichip packaging structure, mainly formed by functional chip, encasement medium, copper layer, conducting terminal, bonding die glue-line, sensing chip, bonding line and substrate, described functional chip is connected by planting ball, pad and substrate, encasement medium covering function chip, plant the top of ball, pad and substrate, encasement medium has conductive hole, copper layer is arranged at encasement medium top, conducting terminal is in conductive hole, copper layer is connected with substrate by conducting terminal, copper layer top is connected with sensing chip by bonding die glue-line, and sensing chip is connected with conducting terminal by bonding line.

Described functional chip passes through bonding die glue adhesive base plate, and is connected with substrate by bonding line.

Described functional chip has several, and all functions chip is positioned at same surface.

Described encasement medium is epoxy resin or polyimides.

Described sensing chip upper surface has induction region, induction region exposed or its on be coated with encasement medium.

A preparation method for fingerprint recognition multichip packaging structure, described method comprises:

Step 1: prepared substrate;

Step 2: the upper core that completes functional chip by Flipchip technique;

Step 3: by encasement medium, functional chip is sealed with medium, encasement medium has conductive hole;

Step 4: generate conductive layer copper layer at dielectric layer upper surface, conducting terminal is filled reserved conductive hole;

Step 5: complete wiring by Wiring technique, ensure and substrate interconnection;

Step 6: the upper core that completes sensing chip by bonding die glue;

Step 7: complete the interconnection of sensing chip and substrate by Wirebonding technique;

Step 8: the bonding line of sensing chip is sealed or protected by gluing process by plastic packaging medium.

The advantage of this structure is to have avoided sensing chip itself to carry out grooving, wiring, and in the wiring of dielectric material upper surface, then it is simple to paste core technical maturity, can improve encapsulating products yield, reduces failure risk.

Another one advantage is that the method for this structure of preparation can be by multiple functional chips and sensing chip integration packaging, the treatment process of each chip is independent mutually, can realize the multifunction of single package body, not only increase work efficiency, can also ensure yield rate.

Brief description of the drawings

Figure 1A and Figure 1B are the sensing chip schematic diagrames that the embodiment of the present invention has completed encapsulation, wherein;

In Figure 1A, functional chip carries out pasting chip by Flipchip technique;

In Figure 1B, functional chip is by bonding die sticker cartridge chip;

Fig. 2 A to Fig. 2 F is the process schematic diagram of this structural manufacturing process embodiment, wherein;

Fig. 2 A is the schematic diagram of substrate;

Fig. 2 B is the upper core schematic diagram that completes functional chip by Flipchip technique;

Fig. 2 C is the schematic diagram that functional chip is sealed with medium;

Fig. 2 D generates conductive layer at dielectric layer upper surface, and fills reserved conductive hole, and the schematic diagram of substrate interconnection;

Fig. 2 E is the schematic diagram that completes core on sensing chip by bonding die glue;

Fig. 2 F is by Wirebonding technique, completes the schematic diagram to sensing chip and substrate interconnection.

In figure, 1, functional chip; 2, encasement medium; 3, copper layer; 4, conducting terminal; 5, bonding die glue-line; 6, sensing chip; 7, bonding line; 8, substrate.

Detailed description of the invention

For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.

As shown in FIG. 1A and 1B, a kind of fingerprint recognition multichip packaging structure, mainly by functional chip 1, encasement medium 2, copper layer 3, conducting terminal 4, bonding die glue-line 5, sensing chip 6, bonding line 7 and substrate 8 form, described functional chip 1 is by planting ball, pad is connected with substrate 8, encasement medium 2 covering function chips 1, plant ball, the top of pad and substrate 8, encasement medium 2 has conductive hole, copper layer 3 is arranged at encasement medium 2 tops, conducting terminal 4 is in conductive hole, copper layer 3 is connected with substrate 8 by conducting terminal 4, copper layer 3 top are connected with sensing chip 6 by bonding die glue-line 5, sensing chip 6 is connected with conducting terminal 4 by bonding line 7.

Described functional chip 1 passes through bonding die glue adhesive base plate 8, and is connected with substrate 8 by bonding line.

Described functional chip has several, and all functions chip is positioned at same surface.

Described encasement medium 2 is the polymeric media such as capsulation material or the polyimides materials such as epoxy resin.

Described sensing chip 6 upper surfaces have induction region, induction region exposed or its on be coated with encasement medium 2.

Described functional chip 1 can complete upper core by Flipchip technique, also can pass through bonding die sticker cartridge chip.

The bonding line 7 of described sensing chip 6 can be sealed by medium, also can protect by a glue.

In Figure 1A, functional chip carries out pasting chip by Flipchip technique; In Figure 1B, functional chip is by bonding die sticker cartridge chip.

As shown in Fig. 2 A to Fig. 2 F, a kind of preparation method of fingerprint recognition multichip packaging structure, described method comprises:

Step 1: prepared substrate, as shown in Figure 2 A;

Step 2: complete the upper core of functional chip by Flipchip technique, as shown in Figure 2 B;

Step 3: by encasement medium, functional chip is sealed with medium, encasement medium has conductive hole, as shown in Figure 2 C;

Step 4: generate conductive layer copper layer at dielectric layer upper surface, conducting terminal is filled reserved conductive hole, as shown in Figure 2 D;

Step 5: complete wiring by Wiring technique, ensure and substrate interconnection, as shown in Figure 2 D;

Step 6: complete the upper core of sensing chip by bonding die glue, as shown in Figure 2 E;

Step 7: complete the interconnection of sensing chip and substrate by Wirebonding technique, as shown in Figure 2 F;

Step 8: the bonding line of sensing chip is sealed or protected by gluing process by plastic packaging medium, obtain the said encapsulating structure of the present invention, as shown in Figure 2 F.

Claims (6)

1. a fingerprint recognition multichip packaging structure, is characterized in that, mainly by functional chip (1), encasement medium (2), copper layer (3),Conducting terminal (4), bonding die glue-line (5), sensing chip (6), bonding line (7) and substrate (8) composition, described functional chip (1) is logicalCross and plant ball, pad and substrate (8) and be connected, encasement medium (2) covering function chip (1), plant the top of ball, pad and substrate (8),Encasement medium (2) has conductive hole, and copper layer (3) is arranged at encasement medium (2) top, and conducting terminal (4) is in conductive hole, and copper layer (3) passes throughConducting terminal (4) is connected with substrate (8), and copper layer (3) top is connected with sensing chip (6) by bonding die glue-line (5), sensing chip(6) be connected with conducting terminal (4) by bonding line (7).

2. a kind of fingerprint recognition multichip packaging structure according to claim 1, is characterized in that, described functional chip (1) is by stickySheet glue adhesive base plate (8), and be connected with substrate (8) by bonding line.

3. according to a kind of fingerprint recognition multichip packaging structure described in claim 1 or 2, it is characterized in that, if described functional chip hasDry, all functions chip is positioned at same surface.

4. a kind of fingerprint recognition multichip packaging structure according to claim 1, is characterized in that, described encasement medium (2) is epoxyResin or polyimides.

5. a kind of fingerprint recognition multichip packaging structure according to claim 1, is characterized in that, described sensing chip (6) upper surfaceHave induction region, induction region exposed or its on be coated with encasement medium (2).

6. a preparation method for fingerprint recognition multichip packaging structure, is characterized in that, described method comprises:

Step 1: prepared substrate;

Step 2: the upper core that completes functional chip by Flipchip technique;

Step 3: by encasement medium, functional chip is sealed with medium, encasement medium has conductive hole;

Step 4: generate conductive layer copper layer at dielectric layer upper surface, conducting terminal is filled reserved conductive hole;

Step 5: complete wiring by Wiring technique, ensure and substrate interconnection;

Step 6: the upper core that completes sensing chip by bonding die glue;

Step 7: complete the interconnection of sensing chip and substrate by Wirebonding technique;

Step 8: the bonding line of sensing chip is sealed or protected by gluing process by plastic packaging medium.