CN205211727U

CN205211727U - Fingerprint identification multi -chip packaging structure

Info

Publication number: CN205211727U
Application number: CN201520878740.5U
Authority: CN
Inventors: 王小龙; 谢建友; 张锐
Original assignee: Huatian Technology Xian Co Ltd
Current assignee: Huatian Technology Xian Co Ltd
Priority date: 2015-11-05
Filing date: 2015-11-05
Publication date: 2016-05-04
Anticipated expiration: 2025-11-05

Abstract

The utility model discloses a fingerprint identification multi -chip packaging structure belongs to fields such as integrated circuit package, sensor technology. The utility model discloses a singly individual or a plurality of function chip pass through flip chip technology or wire bonding technology and base plate solder connection to seal through the medium, upper sensing chip is connected with the base plate pad through switching on the terminal, and the periphery of chip is provided with the electrically conductive hole of running through in the packaging body in lower floor's packaging body. The utility model discloses can guarantee the equal mutual independence of treatment process of every chip, not only improve work efficiency, can also guarantee the yield.

Description

A kind of fingerprint recognition multichip packaging structure

Technical field

The utility model relates to the technology such as microelectronic packaging technology, sensor technology and chip interconnect.

Background technology

Along with the intelligence degree of end product improves constantly, various sensor chip emerges in an endless stream.Sensing chip extends the application of the product such as smart mobile phone, panel computer, and such as, the appearance of fingerprint recognition chip just substantially increases the fail safe of the said goods.

For sensing chip, its maximum feature is that its chip surface exists induction region, and this region and its environmental stimuli that will identify are had an effect, and produces the signal of telecommunication that chip can identify and process.The distance of this region and environmental stimuli is short as far as possible, or induction region is exposed, can be detected to make the signal produced.Current a lot of chip technology, because the restriction being subject to package carrier size cannot by multiple chip distribution on same surface.In prior art, a solution is had to be that single or multiple functional chip is first encapsulated in substrate side, then at substrate opposite side encapsulation sensing chip, thus meet multi-chip integration packaging, but in the process of producing during substrate one side packing, opposite side and extraneous contact, easily cause contact staining, the risk of layering can be there is when encapsulating this side, affecting the yield of integral product.

For opposite side during solution Double-face adhesive core exists because polluting the lamination problem caused, certain company domestic proposes a kind of employing and carries out grooving process to sensing chip, single or multiple functional chip is placed in groove and encapsulates, thus meet multi-chip integration packaging, but grooving process is carried out to sensing chip, technique is comparatively complicated, easily causes sensing chip itself to lose, or produces the reliability decrease that the defects such as micro-crack make product.

Utility model content

The utility model is for sensing chip, particularly fingerprint recognition class chip provides a kind of low cost, the encapsulation that simple, reliability is high and the Integrated Solution that interconnects, dielectric material is utilized to carry out coated to single or multiple functional chip, conductive layer is generated at dielectric layer upper surface by sputtering technology, wiring is completed again by Wiring technique, then carry out the upper core to sensing chip, the operations such as routing, avoid and the operations such as grooving are carried out to sensing chip itself.

Disclosed in the utility model, a kind of fingerprint recognition multichip packaging structure comprises a sensing chip, and its surface exists induction region; Step horizontal plane is lower than censorchip surface, by Wirebonding technique, the chip bonding pad of censorchip surface is connected on the conducting terminal that dielectric layer is reserved, thus reaching the effect with substrate interconnect, the signal that sensing chip collects by this conductive structure spreads out of, and realizes inducing function.

A kind of fingerprint recognition multichip packaging structure, form primarily of functional chip, encasement medium, layers of copper, conducting terminal, bonding die glue-line, sensing chip, bonding line and substrate, described functional chip by planting ball, pad is connected with substrate, encasement medium covering function chip, plant the top of ball, pad and substrate, encasement medium has conductive hole, layers of copper is arranged at encasement medium top, conducting terminal is in conductive hole, layers of copper is connected with substrate by conducting terminal, layers of copper top is connected with sensing chip by bonding die glue-line, and sensing chip is connected with conducting terminal by bonding line.

Described functional chip by bonding die glue adhesive base plate, and is connected with substrate by bonding line.

Described functional chip has several, and all functions chip is positioned at same surface.

Described encasement medium is epoxy resin or polyimides.

Described sensing chip upper surface has induction region, induction region exposed or its on be coated with encasement medium.

A preparation method for fingerprint recognition multichip packaging structure, described method comprises:

Step one: prepared substrate;

Step 2: the upper core being completed functional chip by Flipchip technique;

Step 3: encapsulated by functional chip medium by encasement medium, encasement medium has conductive hole;

Step 4: generate conductive layer layers of copper at dielectric layer upper surface, the conductive hole that conductive line column filling is reserved;

Step 5: complete wiring by Wiring technique, ensures and substrate interconnect;

Step 6: the upper core being completed sensing chip by bonding die glue;

Step 7: the interconnection being completed sensing chip and substrate by Wirebonding technique;

Step 8: the bonding line of sensing chip is encapsulated by plastic packaging medium or protected by gluing process.

The advantage of this structure is that of avoiding carries out grooving, wiring to sensing chip itself, and in the wiring of dielectric material upper surface, then it is simple to paste core technical maturity, can improve encapsulating products yield, reduces failure risk.

Another one advantage is that the method for this structure of preparation can by multiple functional chip and sensing chip integration packaging, the treatment process of each chip is independent mutually, the multifunction of single package body can be realized, not only increase work efficiency, can also rate of finished products be ensured.

Accompanying drawing explanation

Fig. 1 is the sensing chip schematic diagram that the utility model embodiment has completed encapsulation;

In Figure 1A, functional chip carries out pasting chip by Flipchip technique;

In Figure 1B, functional chip is by bonding die sticker cartridge chip;

Fig. 2 is the process schematic of this structural manufacturing process embodiment;

Fig. 2 A is the schematic diagram of substrate;

Fig. 2 B is the upper core schematic diagram being completed functional chip by Flipchip technique;

Fig. 2 C is the schematic diagram encapsulated by functional chip medium;

Fig. 2 D generates conductive layer at dielectric layer upper surface, and fills reserved conductive hole, and the schematic diagram of substrate interconnect;

Fig. 2 E is the schematic diagram being completed core on sensing chip by bonding die glue;

Fig. 2 F is by Wirebonding technique, completes the schematic diagram to sensing chip and substrate interconnect.

In figure, 1, functional chip; 2, encasement medium; 3, layers of copper; 4, conducting terminal; 5, bonding die glue-line; 6, sensing chip; 7, bonding line; 8, substrate.

Embodiment

For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.

As shown in Figure 1, a kind of fingerprint recognition multichip packaging structure, primarily of functional chip 1, encasement medium 2, layers of copper 3, conducting terminal 4, bonding die glue-line 5, sensing chip 6, bonding line 7 and substrate 8 form, described functional chip 1 is by planting ball, pad is connected with substrate 8, encasement medium 2 covering function chip 1, plant ball, the top of pad and substrate 8, encasement medium 2 has conductive hole, layers of copper 3 is arranged at encasement medium 2 top, conducting terminal 4 is in conductive hole, layers of copper 3 is connected with substrate 8 by conducting terminal 4, layers of copper 3 top is connected with sensing chip 6 by bonding die glue-line 5, sensing chip 6 is connected with conducting terminal 4 by bonding line 7.

Described functional chip 1 by bonding die glue adhesive base plate 8, and is connected with substrate 8 by bonding line.

Described encasement medium 2 is the polymeric media such as capsulation material or the polyimides materials such as epoxy resin.

Described sensing chip 6 upper surface has induction region, induction region exposed or its on be coated with encasement medium 2.

Described functional chip 1 can complete upper core by Flipchip technique, also can pass through bonding die sticker cartridge chip.

The bonding line 7 of described sensing chip 6 can be encapsulated by medium, also can be protected by a glue.

In Figure 1A, functional chip carries out pasting chip by Flipchip technique; In Figure 1B, functional chip is by bonding die sticker cartridge chip.

As shown in Figure 2, a kind of preparation method of fingerprint recognition multichip packaging structure, described method comprises:

Step one: prepared substrate, as shown in Figure 2 A;

Step 2: the upper core being completed functional chip by Flipchip technique, as shown in Figure 2 B;

Step 3: encapsulated by functional chip medium by encasement medium, encasement medium has conductive hole, as shown in Figure 2 C;

Step 4: generate conductive layer layers of copper at dielectric layer upper surface, the conductive hole that conductive line column filling is reserved, as shown in Figure 2 D;

Step 5: complete wiring by Wiring technique, ensures and substrate interconnect, as shown in Figure 2 D;

Step 6: the upper core being completed sensing chip by bonding die glue, as shown in Figure 2 E;

Step 7: the interconnection being completed sensing chip and substrate by Wirebonding technique, as shown in Figure 2 F;

Step 8: encapsulated to the bonding line of sensing chip by plastic packaging medium or protected by gluing process, obtains the said encapsulating structure of the utility model, as shown in Figure 2 F.

Claims

1. a fingerprint recognition multichip packaging structure, it is characterized in that, primarily of functional chip (1), encasement medium (2), layers of copper (3), conducting terminal (4), bonding die glue-line (5), sensing chip (6), bonding line (7) and substrate (8) composition, described functional chip (1) is by planting ball, pad is connected with substrate (8), encasement medium (2) covering function chip (1), plant ball, the top of pad and substrate (8), encasement medium (2) has conductive hole, layers of copper (3) is arranged at encasement medium (2) top, conducting terminal (4) is in conductive hole, layers of copper (3) is connected with substrate (8) by conducting terminal (4), layers of copper (3) top is connected with sensing chip (6) by bonding die glue-line (5), sensing chip (6) is connected with conducting terminal (4) by bonding line (7).

2. a kind of fingerprint recognition multichip packaging structure according to claim 1, is characterized in that, described functional chip (1) by bonding die glue adhesive base plate (8), and is connected with substrate (8) by bonding line.

3. a kind of fingerprint recognition multichip packaging structure according to claims 1 or 2, it is characterized in that, described functional chip has several, and all functions chip is positioned at same surface.

4. a kind of fingerprint recognition multichip packaging structure according to claim 1, is characterized in that, described encasement medium (2) is epoxy resin or polyimides.

5. a kind of fingerprint recognition multichip packaging structure according to claim 1, is characterized in that, described sensing chip (6) upper surface has induction region, induction region exposed or its on be coated with encasement medium (2).