CN115832147A - Stack type packaging body structure, process and light-emitting chip device - Google Patents
Stack type packaging body structure, process and light-emitting chip device Download PDFInfo
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- CN115832147A CN115832147A CN202211690826.6A CN202211690826A CN115832147A CN 115832147 A CN115832147 A CN 115832147A CN 202211690826 A CN202211690826 A CN 202211690826A CN 115832147 A CN115832147 A CN 115832147A
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Abstract
The invention discloses a stacked package structure, a process and a light-emitting chip device, which comprise a package, wherein the package is internally and respectively encapsulated with: the bottom of the pin is exposed out of the packaging body; the terminal of the control chip faces the pin and is pasted on the pin; the light-emitting chip is stacked above the control chip, and the light-emitting surface of the light-emitting chip is exposed out of the packaging body; the circuit layer, circuit layer will give out light chip, control chip and pin electric connection, the pin forms through electroplating for draw out the electrical property of packaging body, and the control chip and the encapsulation of the class structure of piling up about giving out light chip adoption both reduce the structure, shorten the circuit, reduce resistance, and the circuit is more stable, all adopts the mode paster of flip-chip with control chip and luminous chip, and the encapsulation size is further controlled, can satisfy ultra-thin type chip's production requirement.
Description
Technical Field
The invention belongs to the technical field of LED chip packaging, and particularly relates to a stacked packaging body structure, a stacked packaging body process and a light-emitting chip device.
Background
Along with the continuous progress of the integrated circuit packaging technology, the integrated level of an integrated circuit is gradually improved, the integrated circuit has more and more rich functions and more varieties, a light-emitting device integrated circuit is one of the integrated circuits, a light-emitting device (LED) refers to a semiconductor device for converting current into light, specifically, an LED light-emitting chip and a control chip are electrically connected in an integrated mode, the light-emitting control of the LED chip is achieved, then the LED light-emitting chip is packaged, air and moisture are isolated, and the service life of the chip is guaranteed.
From the encapsulation development process of chip, traditional luminescent device encapsulation generally carries out electric connection with control chip (IC chip) and luminescent chip (LED chip) through the mode of routing, IC chip and LED chip are whole pastes on LED lamp area after, IC chip and LED chip are connected with IC chip and LED chip to rethread conductive device or wire, then seal the rubberizing and carry out the printing opacity, the structure of this kind of technology preparation, when laying components and parts, can lead to interval between the components and parts big, thereby it is big to integrate the low encapsulation volume that leads to of degree.
In order to control the distance, the traditional routing process is upgraded to a flat type, and the routing is replaced by electrical connection through combining a rewiring process, wherein the specific process comprises the following steps: IC chip and LED chip tiling (that is the LED chip is placed in one side of IC chip) are on the base plate, form heavy wiring group (RDL) through semiconductor layer-by-layer packaging technology behind the paster, realize the electric connection of IC chip and the LED chip of its side, but this kind of integrated packaging mode, with IC chip and LED chip tiling, need increase the encapsulation size in the width, and IC chip and LED chip are when damaging, it is difficult to tear two parts apart the change alone, need destroy whole packaging body, and the encapsulation size can not reduce, the encapsulation space is very restricted, can not reach ultra-thin requirement, the event awaits urgent need to design a kind of packaging body structure of piling up, technology and luminescent chip device.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a stacked package structure, a process and a light-emitting chip device.
In order to achieve the above object, the present invention provides a stacked package structure, which includes a package body, and the package body respectively encapsulates:
the bottom of the pin is exposed out of the packaging body;
the terminal of the control chip faces the pin and is pasted on the pin;
the light-emitting chip is stacked above the control chip, and the light-emitting surface of the light-emitting chip is exposed out of the packaging body;
and the circuit layer is used for electrically connecting the light-emitting chip, the control chip and the pins.
Furthermore, the pins are formed by electroplating and used for leading out the electrical property of the packaging body, and one ends of the pins exposed out of the packaging body are provided with welding discs in an electroplating mode.
Furthermore, the circuit layer comprises a conductive column, a redistribution layer and a metal column, the redistribution layer leads out the electrical property of the control chip to realize redistribution, and the metal column and the conductive column are respectively electrically connected with the light-emitting chip and the pins through the redistribution layer.
Further, the terminals of the light emitting chip are flip-chip arranged above the control chip towards the control chip.
Further, the package structure further comprises fluorescent glue encapsulated on the light emitting chip.
A stacking type light-emitting chip device comprises the stacking type packaging body structure.
A packaging process of a stack type packaging body comprises the following steps:
a first packaging step: mounting a control chip on the pins in an inverted manner, plating a conductive column on the pins, and then packaging for the first time and grinding to expose the top surfaces of the coplanar conductive columns;
a circuit layer forming step: forming a redistribution layer on the surface of the package body to realize the electrical connection of the top surface of the conductive column, and forming a metal column on the redistribution layer;
and a second packaging step: and then packaging the circuit layer for the second packaging, grinding the top surface of the exposed metal column, and then pasting the light-emitting chip corresponding to the metal column.
Furthermore, the pins are formed by electroplating and used for leading out the electrical property of the packaging body, and one ends of the pins exposed out of the packaging body are provided with welding discs in an electroplating mode.
Furthermore, the circuit layer comprises a conductive column, a redistribution layer and a metal column, the redistribution layer leads out the electrical property of the control chip to realize redistribution, and the metal column and the conductive column are respectively electrically connected with the light-emitting chip and the pins through the redistribution layer.
Further, the terminals of the light emitting chip are flip-chip arranged above the control chip towards the control chip.
Further, the package structure further comprises fluorescent glue encapsulated on the light emitting chip.
The invention applies for: the encapsulation of stacking type structure about this application adopts control chip and luminescence chip, both reduce the structure, shorten the circuit, reduce resistance, the circuit is more stable, all adopt the mode paster of flip-chip with control chip and luminescence chip, the encapsulation size is further controlled, can satisfy the production requirement of ultra-thin type chip, and it connects to change the tiled chip into stacking type chip, control chip or luminescence chip are not once sealed, can unpack apart alone during the damage, reduce the damage of other parts.
Drawings
Fig. 1 is a cross-sectional view of a stacked package structure and a light emitting chip device according to the present invention;
FIG. 2 is a schematic diagram illustrating a first packaging step of a packaging process for a stack-type package according to the present invention;
FIG. 3 is a schematic diagram illustrating a circuit layer forming step of a package process for a stack-type package according to the present invention;
fig. 4 is a schematic diagram of a second packaging step of the packaging process of the stack package according to the present invention.
The notation in the figure is: the light-emitting diode package comprises a package body 1, pins 2, a control chip 3, a light-emitting chip 4, a circuit layer 5, a conductive column 6, a metal column 7 and fluorescent glue 8.
Detailed Description
For better understanding of the purpose, structure and function of the present application, a structure, a process and a light emitting chip device of a stacked package proposed in the present application are described in detail below with reference to fig. 1 to 4.
Referring to fig. 1, fig. 1 is a cross-sectional view of a stacked package structure and a product of a light emitting chip device according to the present invention, which includes a package 1, and the package 1 respectively encapsulates:
the bottom of the pin 2 is exposed out of the package body 1, the pin 2 is formed by electroplating and used for leading out the electrical property of the package body 1, and a bonding pad is arranged at one end of the pin 2, which is exposed out of the package body 1, in an electroplating way;
the terminal of the control chip 3 faces the pin 2 and is pasted on the pin 2, namely the control chip 3 is inversely pasted on the pin 2;
the light emitting chip 4 is stacked above the control chip 3, a light emitting surface of the light emitting chip 4 is exposed out of the package body 1, a terminal of the light emitting chip 4 faces the control chip 3 and is arranged above the control chip 3 in an inverted mode, and the package body structure further comprises a fluorescent glue 8 which is packaged on the light emitting chip 4;
the circuit layer 5 is used for electrically connecting the light-emitting chip 4, the control chip 3 and the pin 2, the circuit layer 5 comprises a conductive column 6, a redistribution layer and a metal column 7, the redistribution layer leads out the electrical property of the control chip 3 to realize redistribution, and the metal column 7 and the conductive column 6 are respectively electrically connected with the light-emitting chip 4 and the pin 2 through the redistribution layer.
A stacking type light-emitting chip device comprises the stacking type packaging body structure.
With the encapsulation of control chip 3 and luminous chip 4 adoption upper and lower pile up class structure, both reduced the structure, shortened the circuit, reduced resistance, the circuit is more stable, all adopts the mode paster of flip-chip with control chip 3 and luminous chip 4, and encapsulation size further control, control chip 3 or luminous chip 4 are not once to encapsulate, can unpack apart alone when damaging, reduce the damage of other parts.
Referring to fig. 2 to fig. 4, the steps of the packaging process for the stacked package according to the present invention are schematically illustrated, and the process includes the following steps:
a first packaging step: the control chip 3 is inversely mounted on the pin 2, the conductive column 6 is electroplated on the pin 2, and then the pin is packaged for the first time and the top surface of the coplanar conductive column 6 is exposed by grinding;
a line layer 5 forming step: forming a redistribution layer on the surface of the package body 1 to electrically connect the top surfaces of the conductive posts 6, and forming metal posts 7 on the redistribution layer;
and a second packaging step: then, the circuit layer 5 is encapsulated by the second packaging, the top surface of the metal column 7 is exposed by grinding, and then the light-emitting chip 4 is pasted with the metal column 7 correspondingly;
referring to fig. 2 and the first packaging step, a substrate is provided, pins 2 are plated on the substrate, terminals of a control chip 3 face the pins 2 and are inversely mounted with the control chip 3, conductive posts 6 are plated on other pins 2, then the coplanar conductive posts 6 are packaged and ground for the first time, the height of the conductive posts 6 after the first packaging is larger than the sum of the height of the control chip 3, the height of the terminals of the control chip 3 and the height of the pins 2, the control chip 3 is mounted in an inverted manner, the back surface of the control chip 3 is a passive surface, the functional surface of the control chip 3 after the inversion is an inverted active surface, and the conductive posts 6 and the pins 2 are electrically connected, so that the back surface of the control chip can be ground to a small thickness after packaging, even the thickness can reach more than 50 μm, and the requirement of ultra-thin thickness is met, the thickness size is further reduced compared with other stacked packaging structures, the substrate is peeled off after the first packaging, the bottoms of the pins 2 are exposed out of the packaging body 1, and the circuit of the packaging body 1 can be led out.
Referring to fig. 3 and the step of forming the circuit layer 5, a redistribution layer electrically connected to the top surface of the exposed conductive pillar 6 is ground, and a metal pillar 7 is formed at a specific position of the redistribution layer, where the specific position is determined according to actual production requirements, so as to facilitate subsequent mounting.
Referring to fig. 4 and the second packaging step, the circuit layer 5 is packaged by the second packaging, the top surface of the metal pillar 7 is ground and exposed, the active surface of the light emitting chip 4 faces the metal pillar 7, i.e., the flip chip is mounted, the light emitting surface of the light emitting chip 4 is the surface far away from the active surface and exposed out of the package body 1, and the fluorescent glue 8 is packaged at the corresponding position of the light emitting chip 4 of the package body 1, so as to ensure the whole sealing performance of the package body 1 and ensure the normal light emission of the light emitting chip 4.
This application is with control chip 3 and the encapsulation of the class structure of piling up about the luminous chip 4 adoption, both reduce the structure, shorten the circuit, reduce resistance, the circuit is more stable, all adopt the mode paster of flip-chip with control chip 3 and luminous chip 4, encapsulation size further control, can satisfy the production requirement of ultra-thin type chip, and connect the tiled chip and change into and pile up the class chip and connect, control chip 3 or luminous chip 4 do not once encapsulate, can unpack apart alone during the damage, reduce the damage of other parts.
All steps that use electroplating process of this application, all be earlier through exposure, the photoetching technique of development at the surface formation electroplating protection, later rethread sputtering or the mode of heavy copper is waiting to electroplate regional formation metal seed layer, what the metal seed layer of this application adopted is the copper product matter, and the metal seed layer is in order to guarantee the cohesion between the metal of follow-up electroplating and the plastic envelope material, provides the adnexed surface of conductive ion for electroplating simultaneously, guarantees to electroplate the effect.
All steps of using the packaging process are formed by using a plastic packaging material injection molding mode to match with molding to form packaging, and the plastic packaging material adopted by the method is an epoxy resin plastic packaging material, so that the method is low in cost and good in curing performance.
It is to be understood that the present application is described with respect to certain embodiments, and it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present application. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its spirit or scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (11)
1. A stack package structure comprises a package body, wherein the package body is respectively encapsulated with:
the bottom of the pin is exposed out of the packaging body;
the terminal of the control chip faces the pin and is pasted on the pin;
the light-emitting chip is stacked above the control chip, and the light-emitting surface of the light-emitting chip is exposed out of the packaging body;
and the circuit layer is used for electrically connecting the light-emitting chip, the control chip and the pins.
2. The package on package structure of claim 1, wherein the leads are formed by electroplating for electrically leading out the package, and pads are electroplated on the ends of the leads exposed out of the package.
3. The package on package structure of claim 2, wherein the circuit layer comprises a conductive pillar, a redistribution layer and a metal pillar, the redistribution layer electrically leads out the control chip to implement redistribution, and the metal pillar and the conductive pillar are electrically connected to the light emitting chip and the pin through the redistribution layer, respectively.
4. The package on package structure of claim 3, wherein the terminals of the light emitting chip are flip-chip disposed above the control chip towards the control chip.
5. The package on package structure of claim 4, further comprising a fluorescent glue encapsulated on the light emitting chip.
6. A stacked light emitting chip device, comprising the stacked package structure of any one of claims 1 to 5.
7. A packaging process of a stack type packaging body is characterized by comprising the following steps:
a first packaging step: mounting a control chip on the pins in an inverted manner, plating a conductive column on the pins, and then packaging for the first time and grinding to expose the top surfaces of the coplanar conductive columns;
a circuit layer forming step: forming a redistribution layer on the surface of the package body to realize the electrical connection of the top surface of the conductive column, and forming a metal column on the redistribution layer;
and a second packaging step: and then packaging the circuit layer for the second packaging, grinding the top surface of the exposed metal column, and then pasting the light-emitting chip corresponding to the metal column.
8. The method of claim 7, wherein the leads are formed by electroplating to electrically lead out the package, and the ends of the leads exposed out of the package are provided with pads by electroplating.
9. The method for packaging the rf chip module according to claim 7, wherein the circuit layer includes a conductive pillar, a redistribution layer, and a metal pillar, the redistribution layer electrically leads out the control chip to implement redistribution, and the metal pillar and the conductive pillar are electrically connected to the light emitting chip and the pin through the redistribution layer, respectively.
10. The packaging method of the radio frequency chip module according to claim 8, wherein the terminals of the light emitting chip are flip-chip disposed above the control chip towards the control chip.
11. The method of claim 9, wherein the package structure further comprises encapsulating a fluorescent glue on the light emitting chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211690826.6A CN115832147A (en) | 2022-12-28 | 2022-12-28 | Stack type packaging body structure, process and light-emitting chip device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211690826.6A CN115832147A (en) | 2022-12-28 | 2022-12-28 | Stack type packaging body structure, process and light-emitting chip device |
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| CN115832147A true CN115832147A (en) | 2023-03-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117498825A (en) * | 2023-12-29 | 2024-02-02 | 合肥矽迈微电子科技有限公司 | Semiconductor packaging structure and packaging method |
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- 2022-12-28 CN CN202211690826.6A patent/CN115832147A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117498825A (en) * | 2023-12-29 | 2024-02-02 | 合肥矽迈微电子科技有限公司 | Semiconductor packaging structure and packaging method |
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