CN211194685U - Plastic package mold for rectifier bridge - Google Patents
Plastic package mold for rectifier bridge Download PDFInfo
- Publication number
- CN211194685U CN211194685U CN201922119446.7U CN201922119446U CN211194685U CN 211194685 U CN211194685 U CN 211194685U CN 201922119446 U CN201922119446 U CN 201922119446U CN 211194685 U CN211194685 U CN 211194685U
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- rectifier bridge
- plastic package
- package mold
- frame body
- gate opening
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Abstract
Rectifier bridge plastic envelope mould. The utility model relates to a processing of rectifier bridge especially relates to the structural improvement of rectifier bridge plastic envelope mould. The rectifier bridge plastic package mold is compact in structure and capable of improving the fusion quality of resin. The rectifier bridge module comprises a die frame body and a plurality of rectifier bridge modules; the plurality of rectifier bridge modules are fixedly arranged in the die frame body; a placing groove matched with the connecting bridge is arranged between two adjacent lines of rectifier bridge modules; the rectifier bridge module group comprises a plurality of rectifier bridge single dies which are uniformly distributed and arranged; a pouring liquid inlet is formed in the middle of the die frame body; the gate opening is communicated with the inner cavity of the plastic package mold cavity body and is positioned on the plastic package mold cavity body and close to the edge. The utility model has the characteristics of processing is simple and convenient, the fusion quality of improvement resin etc.
Description
Technical Field
The utility model relates to a processing of rectifier bridge especially relates to rectifier bridge plastic envelope mould's institutional advancement.
Background
The rectifier bridge is formed by sealing and molding a rectifier tube in a shell. The full bridge seals four diodes of the connected bridge rectification circuit together. The external part of a full bridge which is in bridge connection with four rectifier silicon chips is packaged by adopting insulating plastic package.
The gate of the rectifier bridge plastic package mold in the prior art is symmetrically designed on two sides, the gate is located at the central line of the cavity, resin uniformly enters the cavity from the central gate, and finally the resin is connected and closed at the central line of a product, so that welding marks are easily generated at the closed position, and the surface of the product is cracked. Affecting the appearance of the product, resulting in scrap loss.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to above problem, provided compact structure, improved the rectifier bridge plastic envelope mould of the quality of the fusion of resin.
The technical scheme of the utility model is that: the rectifier bridge module comprises a die frame body and a plurality of rectifier bridge modules; the plurality of rectifier bridge modules are fixedly arranged in the die frame body;
a placing groove matched with the connecting bridge is arranged between two adjacent lines of rectifier bridge modules;
the rectifier bridge module group comprises a plurality of rectifier bridge single dies which are uniformly distributed and arranged;
a pouring liquid inlet is formed in the middle of the die frame body;
a plurality of branch runners are arranged on the module body; the rectifier bridge single molds are communicated with the pouring liquid pouring inlet through corresponding branch flow passages, and each rectifier bridge single mold comprises a plastic package mold cavity body and a pouring gate communicated with the corresponding branch flow passages;
the gate opening is communicated with the inner cavity of the plastic package mold cavity body and is positioned on the plastic package mold cavity body and close to the edge.
The gate adopts asymmetric design, forms the backward flow stirring after epoxy pours into the inner chamber into, is favorable to the fusion of resin, avoids the formation of plastic envelope gas pocket and resin weld mark.
The gate opening is arranged on one side, far away from the connecting bridge, of the plastic package mold cavity body.
The gate opening is big end down small-size.
One side of the gate opening is vertically arranged, and the other side of the gate opening is obliquely arranged.
And one side of the inclined arrangement is positioned at one side close to the back of the rectifier bridge.
The utility model discloses a middle rectifier bridge module group comprises a plurality of rectifier bridge single modules which are uniformly distributed and arranged; a pouring liquid inlet is formed in the middle of the die frame body; a plurality of branch runners are arranged on the module body; the rectifier bridge single molds are communicated with the pouring liquid inlet through corresponding branch flow passages, and each rectifier bridge single mold comprises a plastic package mold cavity body and a pouring gate opening communicated with the branch flow passages; the gate opening is communicated with the inner cavity of the plastic package mold cavity body and is positioned on the plastic package mold cavity body and close to the edge. The gate adopts asymmetric design, forms the backward flow stirring after epoxy pours into the inner chamber into, is favorable to the fusion of resin, avoids the formation of plastic envelope gas pocket and resin weld mark. The utility model has the characteristics of processing is simple and convenient, the fusion quality of improvement resin etc.
Drawings
Figure 1 is a schematic structural view of the present invention,
figure 2 is a schematic structural view of a single-piece mold of the rectifier bridge of figure 1,
figure 3 is a schematic side view of the structure of figure 2,
FIG. 4 is a schematic top view of the structure of FIG. 2;
in the figure, 1 is a mould frame body, 2 is a rectifier bridge module, 3 is a rectifier bridge single mould, 31 is a plastic package mould cavity body, 32 is a pouring gate opening, and 4 is a pouring liquid pouring inlet.
Detailed Description
The utility model is shown in figures 1-4 and comprises a mould frame body 1 and a plurality of rectifier bridge modules 2; the rectifier bridge modules 2 are fixedly arranged in the die frame body 1;
a placing groove matched with the connecting bridge is arranged between two adjacent rows of the rectifier bridge modules 2; the connecting bridge is placed in the die frame body 1 in advance, then epoxy resin is injected, and after molding, a cutting machine is used for cutting the product into a single finished product;
the rectifier bridge module 2 comprises a plurality of rectifier bridge single dies 3 which are uniformly distributed and arranged;
a pouring liquid pouring inlet 4 is formed in the middle of the die frame body 1;
a plurality of branch runners are arranged on the module body; the rectifier bridge single dies 3 are communicated with the pouring liquid pouring inlet 4 through corresponding branch flow passages, and each rectifier bridge single die 3 comprises a plastic package die cavity body 31 and a pouring gate 32 communicated with the branch flow passages;
the sprue gate 32 is communicated with the inner cavity of the plastic package mold cavity body 31 and is positioned on the plastic package mold cavity body 31 close to the edge.
The sprue gate 32 adopts an asymmetric design, and forms backflow stirring after epoxy resin is injected into the inner cavity, so that the resin fusion is facilitated, and the formation of plastic packaging air holes and resin welding marks is avoided.
The gate opening 32 is arranged on one side of the plastic package mold cavity body 31, which is far away from the connecting bridge.
The gate 32 is large at the top and small at the bottom.
One side of the runner gate 32 is vertically arranged, and the other side is obliquely arranged.
And one side of the inclined arrangement is positioned at one side close to the back of the rectifier bridge. The rear surface of the rectifier bridge is shown in fig. 3, and the upper half is taken as an example, the left side is the rear surface, and the right side is the front surface.
One side of the sprue gate 32 is parallel to the internal frame, and the other side forms an included angle at the thicker side of the cavity, so that resin is injected into the thinner side in an inclined angle manner preferentially, and the injection pressure of the thin side is locally increased; therefore, the flow rate of the thin and thick edges is uniform, the exhaust of the die is balanced, and the gas backflow is avoided to form air holes.
Asymmetric products, the mold design of which is generally such that the thick side is designed below the mold for facilitating demolding and the thin side is designed above the mold; after being injected from the pouring gate, the resin can preferentially flow into the half cavity of the lower thick side under the influence of gravity; meanwhile, due to the fact that the thickness is different, the pressures on the two sides of the cavity are unequal, flow speed difference can be formed after pouring gate injection, the flow speed difference is preferentially injected into the thick side half cavity, and glue injection backflow is extruded to the thin side half cavity, so that air hole backflow is gathered in the thin side half cavity.
The disclosure of the present application also includes the following points:
(1) the drawings of the embodiments disclosed herein only relate to the structures related to the embodiments disclosed herein, and other structures can refer to general designs;
(2) in case of conflict, the embodiments and features of the embodiments disclosed in this application can be combined with each other to arrive at new embodiments;
the above embodiments are only embodiments disclosed in the present disclosure, but the scope of the disclosure is not limited thereto, and the scope of the disclosure should be determined by the scope of the claims.
Claims (5)
1. The rectifier bridge plastic package mold comprises a mold frame body and a plurality of rectifier bridge modules; the plurality of rectifier bridge modules are fixedly arranged in the die frame body;
a placing groove matched with the connecting bridge is arranged between two adjacent lines of rectifier bridge modules;
the rectifier bridge module group comprises a plurality of rectifier bridge single dies which are uniformly distributed and arranged;
a pouring liquid inlet is formed in the middle of the die frame body;
the die frame body is provided with a plurality of branch runners; the rectifier bridge single molds are communicated with the pouring liquid pouring inlet through corresponding branch flow passages, and are characterized in that the rectifier bridge single molds comprise plastic package mold cavity bodies and pouring gate openings communicated with the branch flow passages;
the gate opening is communicated with the inner cavity of the plastic package mold cavity body and is positioned on the plastic package mold cavity body and close to the edge.
2. The rectifier bridge plastic package mold of claim 1, wherein the gate opening is disposed on a side of the plastic package mold cavity body away from the connecting bridge.
3. The rectifier bridge plastic package mold according to claim 1, wherein the gate opening is large at the top and small at the bottom.
4. The rectifier bridge plastic package mold according to claim 1 or 3, wherein one side of the gate opening is vertically arranged, and the other side is obliquely arranged.
5. The rectifier bridge plastic package mold according to claim 4, wherein the side of the gate opening that is disposed obliquely is located at a side close to the back of the rectifier bridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922119446.7U CN211194685U (en) | 2019-11-29 | 2019-11-29 | Plastic package mold for rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922119446.7U CN211194685U (en) | 2019-11-29 | 2019-11-29 | Plastic package mold for rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211194685U true CN211194685U (en) | 2020-08-07 |
Family
ID=71882205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922119446.7U Active CN211194685U (en) | 2019-11-29 | 2019-11-29 | Plastic package mold for rectifier bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211194685U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113451160A (en) * | 2021-06-29 | 2021-09-28 | 扬州虹扬科技发展有限公司 | Multipurpose three-phase rectifier bridge product plastic package mould |
-
2019
- 2019-11-29 CN CN201922119446.7U patent/CN211194685U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113451160A (en) * | 2021-06-29 | 2021-09-28 | 扬州虹扬科技发展有限公司 | Multipurpose three-phase rectifier bridge product plastic package mould |
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