CN213675026U

CN213675026U - Combined packaging mold

Info

Publication number: CN213675026U
Application number: CN202022533334.9U
Authority: CN
Inventors: 王诗雪; 董春红
Original assignee: Anshan Zhongke Hengtai Electronic Technology Co ltd
Current assignee: Anshan Zhongke Hengtai Electronic Technology Co ltd
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-07-13
Anticipated expiration: 2030-11-05

Abstract

The utility model relates to a combined packaging mold, including lower die box, last die box, go up the die body, lower die body, go up the die box and fix at last die body, lower die box connects under on the die body, goes up the die body and sets up with lower die body relatively, still includes the guide pillar, moulds, upper and lower die body on be fixed with a plurality of upper and lower die boxes respectively, be fixed with a plurality of guide pillars on the lower die body, go up the die body and go up the position and be equipped with the locating hole, the guide pillar passes the locating hole and goes up the die body coupling, upper and lower die box all is equipped with the mould of two kinds of above sizes, the intercommunication has the material to say. The advantages are that: adopt composite structure, realize containing the diaphragm capsule and the lead wire box of more than two kinds of sizes in same set of mould, realize obtaining the mould of different encapsulation size appearances with the expense and the time of one set of mould of preparation, reduced the research and development input, also saved the encapsulation time simultaneously.

Description

Combined packaging mold

Technical Field

The utility model relates to a combined packaging mold.

Background

In the process of packaging the diode core, chips with different sizes and parameters need different packaging molds, and each packaging mold comprises an upper mold box, a lower mold box, an upper lead box, a lower lead box, a mold body, a heating hole, a temperature measuring hole, a thermocouple and the like, so that the manufacturing cost is very high. For enterprise research and development products, the investment is large, the risk is high, great waste is caused once the size is not suitable, and more fund and time are spent when the die is re-made, the research and development speed is influenced, and the development of enterprises is not favorable.

Disclosure of Invention

For overcoming the deficiencies of the prior art, the utility model aims at providing a combined packaging mold contains the diaphragm capsule and the lead box of two kinds of above sizes in same set of mould, realizes obtaining different encapsulation size's mould with the expense and the time of the one set of mould of preparation, has reduced the research and development input, has also saved the time simultaneously.

In order to achieve the above object, the utility model discloses a following technical scheme realizes:

the utility model provides a combined packaging mold, includes lower die box, goes up the die body, lower die body, goes up the die box and fixes at last die body, and lower die box is connected under on the die body, goes up the die body and sets up with lower die body is relative, still includes the guide pillar, moulds, upper and lower die body on be fixed with a plurality of upper and lower die box respectively, be fixed with a plurality of guide pillars on the lower die body, go up the die body and go up the position and be equipped with the locating hole that corresponds on, the guide pillar passes the locating hole and goes up the die body coupling, upper and lower die box all is equipped with the mould of more than.

The moulds are symmetrically arranged, the two symmetrically arranged moulds have the same size, and a material channel is communicated between the two moulds.

The mould comprises a mould box and a lead box.

The thermocouple is arranged in the lower die body and extends out of the lower die body from the leading-out opening.

And positioning blocks are fixed on the upper surfaces of the two ends of the lower die box.

Compared with the prior art, the beneficial effects of the utility model are that:

the combined packaging mold adopts a combined structure, realizes that the mold box and the lead box with more than two sizes are contained in the same set of mold, realizes the mold with different packaging size shapes by the cost and time for manufacturing one set of mold, reduces the research and development investment, and saves the packaging time. More than two types of moulds are arranged on the upper mould box and the lower mould box, so that diodes with different sizes can be packaged simultaneously. The combined structure is adopted, the cost for manufacturing the die is saved, the die box is convenient to replace, and the purpose that the same die body is matched with various die boxes is achieved. The lower die box is provided with a positioning block for positioning the upper die box and ensuring that the upper die box can be spliced and positioned with the lower die box. The lower die body is provided with the thermocouple which can be used for detecting the packaging temperature and ensuring the packaging quality.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural view of the lower mold box.

In the figure: 1-an upper die body 2-a lower die body 3-an upper die box 4-a lower die box 5-a thermocouple 6-an outlet 7-a material channel 8-a first mould 9-a positioning hole 10-a second mould 11-a guide post.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings, but it should be noted that the present invention is not limited to the following embodiments.

Referring to fig. 1 and 2, a combined packaging mold comprises a lower mold box 4, an upper mold box 3, an upper mold body 1 and a lower mold body 2, wherein a plurality of upper mold boxes 3 are fixed on the upper mold body 1, a plurality of lower mold boxes 4 are connected on the lower mold body 2, the upper mold body 1 and the lower mold body 2 are arranged oppositely, the upper mold boxes 3 and the lower mold boxes 3 are in one-to-one correspondence, the upper mold box 3 falls behind, and the lower mold boxes 4 are buckled with the upper mold boxes 3 to realize diode packaging; this packaging mold still includes guide pillar 11, is fixed with a plurality of guide pillars 11 on the lower die body 2, and guide pillar 11 is used for and goes up die body 1 location, goes up the die body and goes up the corresponding position and be equipped with locating hole 9, also is equipped with locating hole 9 on the corresponding lower mould box 4, and guide pillar 11 passes locating hole 9 and last die body coupling, and upper and

lower die box

3, 4 all are equipped with the mould of size more than two kinds, and the intercommunication has the material to say 7 between the mould. In addition, more than two upper and lower mold boxes 4 can be installed on one lower mold body 2, and the simultaneous packaging of a plurality of diodes is realized as far as possible.

The moulds are symmetrically arranged, the two symmetrically arranged moulds have the same size, and a material channel 7 is communicated between the two moulds. The mould comprises a mould box and a lead box, the mould box and the lead box are connected with each other, and the lead box is arranged outside the mould box.

The packaging mold further comprises a thermocouple 5, wherein a leading-out opening 6 is formed in the edge of the lower mold body 2, and the thermocouple 5 is arranged in the lower mold body 2 and extends out of the lower mold body from the leading-out opening 6 to be used for detecting the packaging temperature.

The upper surfaces of the two ends of the lower die box 4 are fixed with positioning blocks, and the corresponding upper die box 3 is provided with holes matched with the positioning blocks and used for positioning the upper die box 3 to ensure that the upper die box and the lower die box are buckled accurately.

The utility model discloses a modular structure realizes containing the diaphragm capsule and the lead box of two kinds of above sizes in same set of mould, realizes obtaining the mould of different encapsulation size appearances with the expense and the time of the one set of mould of preparation, has reduced the research and development input, has also saved the encapsulated time simultaneously. More than two types of moulds are arranged on the upper mould body and the lower mould body, so that diodes with different sizes can be packaged simultaneously. The combined structure is adopted, so that the cost for manufacturing the die is saved; the upper die body and the lower die body are positioned by the guide pillar 11, so that the same lower die body 2 is matched with various lower die boxes 4. The lower die box 4 is provided with a positioning block for positioning the upper die box 3, so that the upper die box 3 can be inserted and positioned with the lower die box 4. The lower die body 2 is provided with the thermocouple 5 which can be used for detecting the packaging temperature and improving the packaging quality.

Claims

1. The utility model provides a combined packaging mold, includes lower die box, goes up the die body, lower die body, goes up the die box and fixes on last die body, and lower die box connects on lower die body, goes up the die body and sets up with lower die body is relative, its characterized in that still includes the guide pillar, moulds, upper and lower die body on be fixed with a plurality of upper and lower die boxes respectively, be fixed with a plurality of guide pillars on the lower die body, upward correspond the position on the die body and be equipped with the locating hole, the guide pillar passes the locating hole and goes up the die body coupling, upper and lower die box all is equipped with the mould of more than two kinds of sizes, the intercommunication has.

2. The mold assembly as claimed in claim 1, wherein the molds are symmetrically disposed, and the two symmetrically disposed molds have the same size and have a material passage communicating therebetween.

3. The mold assembly of claim 1, wherein the mold comprises a mold box and a lead box.

4. The combination type package mold of claim 1, further comprising a thermocouple, wherein the lower mold body is provided at an edge thereof with an outlet, and the thermocouple is disposed in the lower mold body and protrudes to the outside through the outlet.

5. The mold assembly as claimed in claim 1, wherein positioning blocks are fixed to upper surfaces of both ends of the lower mold casing.