CN202231006U - SMA integrated circuit punching moulded product and SMA multi-row lead frame - Google Patents
SMA integrated circuit punching moulded product and SMA multi-row lead frame Download PDFInfo
- Publication number
- CN202231006U CN202231006U CN 201120362077 CN201120362077U CN202231006U CN 202231006 U CN202231006 U CN 202231006U CN 201120362077 CN201120362077 CN 201120362077 CN 201120362077 U CN201120362077 U CN 201120362077U CN 202231006 U CN202231006 U CN 202231006U
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- CN
- China
- Prior art keywords
- sma
- pin
- lead frame
- chip
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses an SMA integrated circuit punching moulded product and a SMA multi-row lead frame. The SMA integrated circuit punching moulded product includes a pin [1], a chip [2] which is arranged on the pin [1], and a plastic-sealed body [3] which packages the pin and the chip. The SMA integrated circuit punching moulded product is characterized in that the pin [1] is formed by jointing ends of two unconnected copper sheets; a jointing end of the cooper sheet on one side is recessed downward to form a concave stage, and the chip [2] is arranged on the concave stage; the plastic-sealed body [3] packages the copper sheets and the chip; and extending ends of the two copper sheets form the pin. The SMA integrated circuit punching moulded product dose not need to be welded, so the product qualified rate is improved, the lead frame can be arranged into an array, and the product quantity is increased.
Description
Technical field
The utility model relates to lead frame, especially SMA IC punching shaped article and SMA multi-row lead frame shelf structure.
Background technology
The IC punching shaped article is widely used in the e-leadership field, and single IC punching shaped article generally comprises pin, chip and plastic-sealed body.SMA IC punching shaped article is a kind of of IC punching shaped article, and SMA IC punching shaped article is English simple title of surface adhesive integrated circuit punching molding product.At present; The pin of the SMA IC punching shaped article that on market, uses is welded to form by two frames; The lead frame that forms is single lead frame, and is to be welded to form by two frames, is prone to during owing to welding and departs from; Make the lead frame that is welded to form on precision, can not satisfy instructions for use, reduced the qualification rate of product.Secondly SMA series is a kind of lead frame of miscellaneous goods encapsulation, and the output of single lead-frame packages can not satisfy the demand in market, has seriously restricted production capacity.
The utility model content
The purpose of the utility model be exactly the pin that solves the SMA lead frame be that two frames are welded to form, make product percent of pass low, the problem of restriction production capacity.
The technical scheme that the utility model adopts is: a kind of SMA IC punching shaped article; It comprises pin, be positioned at chip and the plastic-sealed body of packaging pin and chip on the pin; It is characterized in that described pin is made up of two disjunct copper sheet butt-end, the copper sheet butt end of a side goes out to form concave station to recessed, and chip is positioned on the concave station; Plastic-sealed body encapsulation copper sheet and chip, the external part of two copper sheets constitutes pin.
Adopt technique scheme, need not welding, therefore improved the qualification rate of product greatly owing to constitute two copper sheets of pin.
A kind of SMA multi-row lead frame frame, it is to be made up of several SMA IC punching shaped article pin array.Because pin is made up of two disjunct copper sheet butt-end, the copper sheet on the lead frame gets final product array like this, forms lead frame, thereby reaches increase efficient, improves the purpose of output.
The utility model beneficial effect is: because the pin of the utility model need not weld, therefore improved the qualification rate of product greatly, because the lead frame of the utility model can array, so production efficiency improves greatly.
Description of drawings
Fig. 1 is the utility model SMA IC punching shaped article sketch map.
Fig. 2 is a SMA multi-row lead frame frame sketch map.
Fig. 3 is the vertical view of Fig. 2.
Fig. 4 is an A part enlarged drawing among Fig. 3.
The end view of Fig. 4 of Fig. 5.
Among the figure, 1, pin, 2, chip, 3, plastic-sealed body, 4, lead frame.
Embodiment
A kind of SMA IC punching shaped article; As shown in Figure 1, it comprises pin 1, be positioned at chip 2 and the plastic-sealed body 3 of packaging pin and chip on the pin 1, and pin 1 is made up of two disjunct copper sheet butt-end; The copper sheet butt end of one side goes out to form concave station to recessed; Chip 2 is positioned on the concave station, plastic-sealed body 3 encapsulation copper sheet and chips, and the external part of two copper sheets constitutes pin.
A kind of SMA multi-row lead frame frame, like Fig. 2, shown in Figure 3, it is to constitute lead frame 4 by several SMA IC punching shaped article pin array.Fig. 4 is the A part enlarged drawing of Fig. 3, and 1 among the figure is pin, because therefore copper sheet can realize that array forms the lead frame frame, thereby increases production efficiency.
The utility model changes the pin of Type of Welding about the former SMA IC punching shaped article laterally into; After can laterally arranging on the lead frame, vertically array is 12 rows again, has 216 products on this SMA series of products multi-row lead frame shelf structure more like this; Traditional single lead frame structure is 24 products; On SMA series of products multi-row lead frame shelf structure, be designed to the MGP encapsulating mould of four diaphragm capsules, be total to 12X18X2X4=1728 product, single lead frame structure is designed to traditional single cylinder mould of ten groups of diaphragm capsules; With four, be total to 24X4X10=960 product on one group of diaphragm capsule.
Claims (2)
1. SMA IC punching shaped article; It comprises pin [1], be positioned at chip [2] and the plastic-sealed body [3] of packaging pin and chip on the pin [1]; It is characterized in that described pin [1] is made up of two disjunct copper sheet butt-end, the copper sheet butt end of a side goes out to form concave station to recessed, and chip [2] is positioned on the concave station; Plastic-sealed body [3] encapsulation copper sheet and chip, the external part of two copper sheets constitutes pin.
2. a SMA multi-row lead frame frame is characterized in that it is to be made up of several SMA IC punching shaped article pin array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120362077 CN202231006U (en) | 2011-09-26 | 2011-09-26 | SMA integrated circuit punching moulded product and SMA multi-row lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120362077 CN202231006U (en) | 2011-09-26 | 2011-09-26 | SMA integrated circuit punching moulded product and SMA multi-row lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202231006U true CN202231006U (en) | 2012-05-23 |
Family
ID=46081584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120362077 Expired - Fee Related CN202231006U (en) | 2011-09-26 | 2011-09-26 | SMA integrated circuit punching moulded product and SMA multi-row lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202231006U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290396A (en) * | 2011-09-26 | 2011-12-21 | 铜陵三佳山田科技有限公司 | SMA (surface-mounted assembly) integrated circuit punching formed product and SMA multi-row lead wire framework |
-
2011
- 2011-09-26 CN CN 201120362077 patent/CN202231006U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290396A (en) * | 2011-09-26 | 2011-12-21 | 铜陵三佳山田科技有限公司 | SMA (surface-mounted assembly) integrated circuit punching formed product and SMA multi-row lead wire framework |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120523 Termination date: 20150926 |
|
| EXPY | Termination of patent right or utility model |