CN209515637U - A kind of power module architectures - Google Patents
A kind of power module architectures Download PDFInfo
- Publication number
- CN209515637U CN209515637U CN201822173324.1U CN201822173324U CN209515637U CN 209515637 U CN209515637 U CN 209515637U CN 201822173324 U CN201822173324 U CN 201822173324U CN 209515637 U CN209515637 U CN 209515637U
- Authority
- CN
- China
- Prior art keywords
- substrate
- chip
- power module
- needle
- needle stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of power module architectures, including substrate, chip and Pin needle, the chip are fixed on substrate, and the position of the fixed Pin needle of the substrate is equipped with the needle stand of tubular structure, and the Pin needle passes through needle stand and is fixed on substrate.The utility model has the advantage of the power module architectures to have higher production compatibility, and it can be produced using arrangement mode, it uses manpower and material resources sparingly, furthermore modular structure avoids the design of plastic package die salient point, entire cavity body of mould is more regular, the design difficulty and manufacturing cost for greatly reducing mold, improve production efficiency.
Description
Technical field
The utility model relates to power module field, a kind of power module architectures and its manufacturing method are provided.
Background technique
As National Industrial is fast-developing and the needs of strategic development, important composition portion of the power module as power electronics
Point, more and more extensive to be applied to the industries such as aviation, new-energy automobile, photovoltaic, wind energy, aviation, industrial frequency conversion, market prospects will more
Come more wide, the power module of different function and packing forms also comes into being.
Such module has corresponding extraction Pin arrangement according to different application schemes currently on the market, corresponding,
The type chamber of plastic package die just needs to design different salient points, could form different vacancy when pressing mold forms to place and weld
Pin needle, according to the design and operating feature of plastic package die, a set of plastic package die can only form a kind of colloid of shape, thus
Different plastic package dies is needed to configure to meet the plastic packaging shape demand of different Pin needle arrangements, how to reduce setting for plastic package die
Meter and manufacture difficulty are effectively compatible with a variety of Pin needle arrangements, realize scale and cost effective volume production is entire power module
Design and the key point of manufacture.
The prior art is to design salient point in mold corresponding position, product is corresponding after compression molding when designing plastic package die
Position just has corresponding pit and generates, and then carries out tin and weldering Pin needle in groove position, is directed to different Pin needles in this way
Arrangement matches corresponding plastic package die and carrys out operation, during molded, the flowing of resin and the folding of mold
Deng can all generate certain frictional force, plastic package die is caused to be easy to produce abrasion, the especially this mold with bump design
It is easier to wear compared with common regular mold, and then influence homework precision causes product bad and mold bulk life time shortens,
The increase of die cost is not only caused, while the switching between different molds also results in the waste in working hour, production UPH is low, frequency
Numerous more mold exchange also has certain influence on product with stable quality.
Utility model content
Technical problem to be solved in the utility model is to realize a kind of power module knot that is structurally reasonable, facilitating production
Structure.
To achieve the goals above, the technical solution adopted in the utility model are as follows: a kind of power module architectures, including base
Plate, chip and Pin needle, the chip are fixed on substrate, and the position of the fixed Pin needle of the substrate is equipped with the needle of tubular structure
Seat, the Pin needle pass through needle stand and are fixed on substrate.
The bottom periphery of the needle stand is by the way that on tin cream welding substrate, the Pin needle is fixed on by putting tin in needle stand
On substrate in needle stand.
The substrate has a resin for having one layer of encapsulating on one side of needle stand, chip and Pin needle, in the resin coating cover substrate
All needle stands and chip, the thickness of the resin are equal to or slightly lower than the height of needle stand.
The susceptor edges are fixed with the frame extended laterally for connecting with other power modules.
The frame, chip, needle stand pass through tin cream and are welded on substrate.
It is electrical using aluminum wire bonding realization according to circuit is pre-designed between chip and substrate between the chip and chip
Performance.
The substrate is ceramic copper-clad base plate.
The utility model has the advantage of power modules to have higher production compatibility, and can be raw using arrangement mode
It produces, uses manpower and material resources sparingly, furthermore modular structure avoids the design of plastic package die salient point, and entire cavity body of mould is more regular, greatly
The design difficulty and manufacturing cost of mold are reduced greatly.
Detailed description of the invention
Below to width attached drawing every in the utility model specification expression content and figure in label be briefly described:
Fig. 1 is power module architectures schematic diagram；
Label in above-mentioned figure is equal are as follows: 1, needle stand；2, Pin needle；3, chip；4, substrate；5, resin；6, frame.
Specific embodiment
As shown in Figure 1, power module architectures are mainly by needle stand 1, Pin needle 2, chip 3,6 structure of substrate 4, resin 5 and frame
At substrate 4 (DBC) can use ceramic copper-clad base plate, and resin 5 is layer structure, general to use for encapsulating entire power module
Epoxy resin.
Chip 3 and needle stand 1 are welded on substrate 4 by tin cream, and the welding position of chip 3 and needle stand 1 is according to being pre-designed
Circuit depending on, electric property passes through aluminum wire bonding and realizes between chip 3 and chip 3 and between chip 3 and substrate 4, needle stand 1
It is fixed on the position that substrate 4 is pre-designed installation Pin needle 2 vertically, needle stand 1 is tubular structure and both ends open, the internal diameter of needle stand 1
Slightly larger than 2 outer diameter of Pin needle, needle stand 1 capable of being passed through for Pin needle 2 and being fixed on substrate 4, Pin needle 2 is solid by putting tin in needle stand 1
It is scheduled on the substrate 4 in needle stand 1, by the fixed Pin needle 2 of intermediate needle stand 1, can guarantee the fixed reliability of Pin needle 2, it should
Structure can help to reduce die change frequency, improve product with stable quality, improve production UPH.
Substrate 4 has the resin 5 for having one layer of encapsulating on one side of needle stand 1, chip 3 and Pin needle 2, and resin 5 covers on substrate 4
All needle stands 1 and chip 3, the thickness of resin 5 are equal to or slightly lower than the height of needle stand 1, and resin 5 can insulate to device
With sealing, guarantee the reliability of power module work.
Frame 6 is welded on the edge of substrate 4 by tin cream, and frame 6 extends laterally for connecting with other power modules, leads to
It crosses and multiple frames 6 is connected, it can be when processing each process, the multiple modules of simultaneous processing or power module continuously connect
It connects, successively passes through production equipment, made one by one, realize the continuity of production, help to improve production efficiency.In addition, frame
When frame 6 also facilitates production staff hold, power module of taking.
The manufacturing method of above-mentioned power module architectures is as follows:
Step 1 passes through tin cream welding manner fixed frame 6, chip 3, needle stand 1 on substrate 4, and welding position is according to design
Depending on drawing；
Step 2, basis are pre-designed circuit, using aluminum wire bonding chip 3 and chip 3, chip 3 and substrate 4, realize power
The electric property of module；
Step 3 is encapsulated on 4 surface of substrate by resin 5 using equipment, forms Resin Wrappage for all components for needle
Seat 1 seals, and 1 design height of needle stand is consistent with the height that resin 5 seals or needle stand 1 is slightly above the height that resin 5 is encapsulated, into
Row resin 5 carries out adhesive-spill-preventing operation to needle stand 1 before encapsulating, and removes anti-overflow plastic structure after resin 5 is encapsulated, to guarantee
When 5 press mold of resin forms, resin 5 be may not flow into 2 hole of Pin needle, it is ensured that the electrical output of Pin needle 2；
Pin needle 2 is inserted into needle stand 1 in 1 inner hole point tin of needle stand by step 4；
If step 5, muti-piece power module are connected by frame, need to cut frame, separates power module.
The processing of power module is completed since then.
The utility model is exemplarily described above in conjunction with attached drawing, it is clear that the utility model specific implementation not by
The limitation of aforesaid way, as long as the various unsubstantialities carried out using the method concept and technical solution of the utility model change
Into, or it is not improved the conception and technical scheme of the utility model are directly applied into other occasions, in the utility model
Protection scope within.
Claims (7)
1. a kind of power module architectures, including substrate, chip and Pin needle, the chip are fixed on substrate, it is characterised in that:
The position of the fixed Pin needle of the substrate is equipped with the needle stand of tubular structure, and the Pin needle passes through needle stand and is fixed on substrate.
2. power module architectures according to claim 1, it is characterised in that: the bottom periphery of the needle stand is welded by tin cream
It connects on substrate, the Pin needle is fixed on the substrate in needle stand by putting tin in needle stand.
3. power module architectures according to claim 2, it is characterised in that: the substrate has needle stand, chip and Pin needle
The resin for having one layer of encapsulating on one side, all needle stand and chip, the thickness of the resin are equal in the resin coating cover substrate
Or the height of slightly below needle stand.
4. power module architectures according to claim 3, it is characterised in that: the substrate edges, which are fixed with, extends laterally use
In the frame being connect with other power modules.
5. power module architectures according to claim 4, it is characterised in that: the frame, chip, needle stand pass through tin cream
It is welded on substrate.
6. any power module architectures in -5 according to claim 1, it is characterised in that: between the chip and chip,
Basis is pre-designed circuit and realizes electric property using aluminum wire bonding mode between chip and substrate.
7. power module architectures according to claim 6, it is characterised in that: the substrate is ceramic copper-clad base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822173324.1U CN209515637U (en) | 2018-12-24 | 2018-12-24 | A kind of power module architectures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822173324.1U CN209515637U (en) | 2018-12-24 | 2018-12-24 | A kind of power module architectures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209515637U true CN209515637U (en) | 2019-10-18 |
Family
ID=68196570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822173324.1U Active CN209515637U (en) | 2018-12-24 | 2018-12-24 | A kind of power module architectures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209515637U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545759A (en) * | 2018-12-24 | 2019-03-29 | 芜湖启迪半导体有限公司 | A kind of power module architectures and its manufacturing method |
-
2018
- 2018-12-24 CN CN201822173324.1U patent/CN209515637U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545759A (en) * | 2018-12-24 | 2019-03-29 | 芜湖启迪半导体有限公司 | A kind of power module architectures and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104934405B (en) | Lead frame based on DIP Duo Ji islands and manufacture the method for packaging part with it | |
| CN106847800A (en) | QFN surface-adhered types RGB LED encapsulation modules and its manufacture method | |
| CN103985692A (en) | Encapsulating structure for AC-DC power circuit and encapsulating method thereof | |
| CN209515637U (en) | A kind of power module architectures | |
| CN109545759A (en) | A kind of power module architectures and its manufacturing method | |
| CN103606539A (en) | Frame-based flat package adopting opening-optimization technology and manufacturing process thereof | |
| CN106711098B (en) | IC plastic capsulation structure and preparation method thereof | |
| CN203871320U (en) | Packaging structure of AC-DC power supply circuit | |
| CN202034361U (en) | Semiconductor packaging structure | |
| CN103985693A (en) | Packaging structure of brushless direct-current motor integrated drive circuit and packaging method thereof | |
| CN212587519U (en) | LED wafer packaging structure | |
| CN204596785U (en) | Based on the lead frame on DIP Duo Ji island | |
| CN201629329U (en) | Lead frame | |
| CN203871321U (en) | Packaging structure of integrated drive circuit of brushless direct current motor | |
| CN209232767U (en) | A kind of novel semi-conductor encapsulating structure | |
| CN203254606U (en) | DIP (dual-in-line package) lead frame plastic package mold | |
| CN102738009A (en) | Manufacturing process of flat packaging piece of AAQFN framework product based on brushing | |
| CN203103286U (en) | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor | |
| CN202549827U (en) | Lead frame | |
| CN207651475U (en) | A kind of chip encapsulation assembly | |
| CN218827099U (en) | Lead frame structure and packaging structure | |
| CN110600447A (en) | Novel lead frame structure and packaging structure | |
| CN103130173B (en) | For MEMS chip encapsulation without little island lead frame, array of leadframes and encapsulating structure | |
| CN203077507U (en) | SOD123 packaging element assembly jig | |
| CN201118432Y (en) | Plastic three-phase bridge commutator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 241000 1803, building 3, service outsourcing park, Wuhu high tech Industrial Development Zone, Anhui Province Patentee after: Anhui Changfei Advanced Semiconductor Co.,Ltd. Address before: 241000 1803, building 3, service outsourcing park, high tech Industrial Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee before: WUHU QIDI SEMICONDUCTOR Co.,Ltd. |
|
| CP03 | Change of name, title or address |