CN103130173B - For MEMS chip encapsulation without little island lead frame, array of leadframes and encapsulating structure - Google Patents
For MEMS chip encapsulation without little island lead frame, array of leadframes and encapsulating structure Download PDFInfo
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- CN103130173B CN103130173B CN201110377890.4A CN201110377890A CN103130173B CN 103130173 B CN103130173 B CN 103130173B CN 201110377890 A CN201110377890 A CN 201110377890A CN 103130173 B CN103130173 B CN 103130173B
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Abstract
A kind of for MEMS chip encapsulation without little island lead frame, described lead frame comprises multiple interior pin and adopts the mode of pre-plastic package to encapsulate, make at least to form the first pre-plastic package body and the second pre-plastic package body, described first pre-plastic package body be arranged on described multiple interior pin around central area and described second pre-plastic package body is arranged on the periphery of described multiple interior pin, wherein, MEMS chip is fixed on the horizontal plane that described first pre-plastic package body is combined with described lead frame.The application also each provides a kind of array of leadframes and MEMS package structure.
Description
Technical field
The application relate to for MEMS chip encapsulation lead frame, more particularly, the application relate to for MEMS chip encapsulation, as OCSOP(open type small-sized package), the in line encapsulation of OCDIP(open type biserial) without little island lead frame and encapsulating structure thereof.
Background technology
Encapsulation is a very important step in electronic device manufacture process, by encapsulation process, can draw directly electric for various chip, to be electrically connected with external circuit.To various different chip, the packing forms that it is suitable for usually can be selected.
Example is encapsulated as with MEMS chip conventional on market, generally to lead frame electronickelling porpezite, MEMS chip is seated in and is positioned on the metal island of lead frame middle section, then MEMS chip is connected with the equally distributed interior pin of metal island surrounding by routing, finally adopts the mode of plastics injection moulding to be sealed by chip.Fig. 1 shows traditional lead frame with metal island, and wherein multiple interior pin 110,112,114,116,118,120,122,124 is looped around around metal island 130.
But for the encapsulation of the special MEMS chip (such as MEMS pressure sensor chip) of function, its potting process is different from traditional encapsulation process.First, in the mode of pre-plastic package, plastic casing is made in advance, thus lead frame is the lead frame of band pre-plastic package body, and then loads chip and routing, sensor chip can be avoided like this to suffer the wafer damage after injection moulding and disabler.
But up to the present, not yet someone considers to adopt pre-plastic package technique what kind of can bring affect on leadframe design.
Summary of the invention
Thus, one of the object of the application is to provide a kind of leadframe design taking into full account pre-plastic package technogenic influence.This lead frame is different from other conventional lead frame, is not provided with island thereon.This leadframe design takes full advantage of the feature of pre-plastic package technique, has simplified processing step (the heavy technique of beating such as, for the formation of island region has just no longer needed).
According to an aspect of the application, provide a kind of for MEMS chip encapsulation without little island lead frame, described lead frame comprises multiple interior pin and adopts the mode of pre-plastic package to encapsulate, make at least to form the first pre-plastic package body and the second pre-plastic package body, described first pre-plastic package body be arranged on described multiple interior pin around central area and described second pre-plastic package body is arranged on the periphery of described multiple interior pin, wherein, MEMS chip is fixed on the horizontal plane that described first pre-plastic package body is combined with described lead frame.
Alternatively, before carrying out pre-plastic package, all pins of described lead frame are carried out positive and negative entirely silver-plated to form silver coating above and below lead frame.
Alternatively, before carrying out pre-plastic package, two-sided local silver-plating is carried out to form silver coating above lead frame to all pins of described lead frame.
Alternatively, the thickness of described silver coating is not less than 3 microns.
Alternatively, the width of described interior pin is set to be greater than 1 millimeter and is less than 2 millimeters.
Alternatively, the width of described interior pin is set to 1.5 millimeters.
Alternatively, epoxy molding plastic is adopted to carry out pre-plastic package to described lead frame.
According to another aspect of the application, provide a kind of for MEMS chip encapsulation without island array of leadframes, comprise multiple by row and column arrange the above and any one lead frame.
Alternatively, on the surface of each lead frame in described array of leadframes, in the below of the second pre-plastic package body, be provided with ear structure, so that being separated of each lead frame and described array of leadframes.
Alternatively, on each lead frame, described ear structure comprise by the multiple interior pin of described each lead frame around regional center point centered by and rotational symmetric two L-type structures.
Alternatively, described array of leadframes is provided with anti-sticking structure, to avoid when carrying out pre-plastic package being stained with undesirable plastic packaging material in described array of leadframes.
Alternatively, described anti-sticking structure comprise be arranged on described array of leadframes two adjacent legs frames between, elongate in shape one or more enter cast gate.
According to another aspect of the application, provide a kind of MEMS package structure, comprise the above and any one lead frame.
Alternatively, described encapsulating structure is used for OCSOP or OCDIP.
Compared with prior art, the application at least tool has the following advantages: the first, in this application, lead frame does not arrange island, has taken into full account the feature of pre-plastic package technique.The second, in this application, before carrying out pre-plastic package, positive and negative silver-plated or two-sided local silver-plating is entirely carried out so that routing bonding to all pins of lead frame.Avoid the harmful effect that tin plating technique may cause MEMS when routine encapsulates.3rd, in order to obtain better bonding, the thickness of silver coating is designed to be not less than 3 microns.4th, the lead frame of the application is provided with anti-sticking structure, is bonded on the lead frame of pre-plastic package to avoid plastic packaging material.5th, consider the feature of pre-plastic package technique, the Frame Design of the application has reserved enough interior pin spaces, makes interior pin to carry out good bonding.6th, the application can use epoxy molding plastic to carry out pre-plastic package technique, and its reliability is higher than common plastics packaged type, avoids backflow high temperature on the impact of circuit.
Accompanying drawing explanation
From following detailed description by reference to the accompanying drawings, above-mentioned and other object of the application and advantage will be more complete, clear.
Fig. 1 is traditional lead frame schematic diagram at middle section with metal island;
Fig. 2 is the part sectioned view encapsulated according to the MEMS chip of an embodiment of the application;
Fig. 3 is the schematic diagram without little island lead frame of an embodiment according to the application;
Fig. 4 is the schematic diagram without island array of leadframes of an embodiment according to the application;
Fig. 5 be according to the embodiment of the application without the plane after little island lead frame plastic packaging.
Detailed description of the invention
What introduce below is that the multiple of the application may some in embodiments, aims to provide the basic understanding to the application, is not intended to confirm key or the conclusive key element of the application or limits claimed scope.Easy understand, according to the technical scheme of the application, under the connotation not changing the application, one of ordinary skill in the art can propose other implementation that can mutually replace.Therefore, following detailed description of the invention and accompanying drawing are only the exemplary illustrations of the technical scheme to the application, and should not be considered as the whole of the application or the restriction be considered as technical scheme or restriction.
Herein, " on " directional terminology of (or " top ") and D score (or " below ") defines with the relative position between lead frame and packed sensor chip.Relative to lead frame, the bearing definition put of sensor chip for " on " side, another contrary orientation is then defined as D score side.Further, be to be understood that, according to the change in the orientation that sensor chip is placed relative to lead frame, the orientation that "up" and "down" is referred to respectively also changes.
Herein, " pre-plastic package " refers to the plastic packaging process before wire bonding, and on the lead frame formed by " pre-plastic package ", the plastic-sealed body of (or under) is defined as " pre-plastic package body ".
With reference to figure 2, illustrated therein is the part sectioned view encapsulated according to the MEMS chip of an embodiment of the application.Multiple pre-plastic package body 240a, 240b and 240c is formed respectively above and below lead frame 220.First pre-plastic package body 240c be arranged on multiple interior pin (not shown) around central area, and the second pre-plastic package body 240a and the 3rd pre-plastic package body 240b is arranged on the periphery of multiple interior pin.MEMS chip 260 is arranged on the first pre-plastic package body 240c, can be filled with sealing silica gel between chip and the first plastic-sealed body.Lid 280 is arranged on the second pre-plastic package body 240a.In fact, as can be seen from Fig. 2, MEMS chip is fixed on the horizontal plane that combined with lead frame by the first pre-plastic package body, and namely this horizontal plane serves the effect supported MEMS chip 260.
Although also it is pointed out that in fig. 2, lead frame 220 is illustrated as downward bending (corresponding to OCDIP), it will be readily apparent to those skilled in the art that lead frame 220 also can upwards bend, such as, cut and be bent to shoulder (corresponding to OCSOP).
With further reference to Fig. 3, it illustrates the schematic diagram without little island lead frame of an embodiment according to the application.Shown in Fig. 3 without in little island lead frame 300, unlike the prior art, among multiple interior pins 310,320,330,340,350,360 encircled area, there is not metal island.Composition graphs 2 easy understand, due in pre-plastic package technique, multiple interior pin around region among be filled with pre-plastic package body (material), and this pre-plastic package body can combine with lead frame the support provided chip, thus also just no longer needs island region.This kind of leadframe design has taken into full account the feature of pre-plastic package technique, simplifies technological process.
In this application, eliminate except metal island in leadframe design except considering the feature of pre-plastic package technique, new demand that the technological process that inventor also contemplates pre-plastic package proposes Frame Design (requirement of not electroplating in such as encapsulating, the requirement of bonding routing, avoid pre-plastic package framework to be stained with the requirement of moulding compound).
The requirement with bonding routing can not be electroplated in encapsulation, before carrying out pre-plastic package, all pins of lead frame be carried out positive and negative entirely silver-plated to form silver coating above and below lead frame.But the processing cost of considering, also can eliminate during large production and adopt whole silver-plated form.In another kind of implementation, before carrying out pre-plastic package, two-sided local silver-plating is carried out to form silver coating above lead frame to all pins of lead frame.In order to better bonding can be carried out in bond sequence, adopt thicker lead frame silver-plated.Such as, in a concrete realization, the thickness of silver coating should be not less than 3 microns.Further, designed lead frame have employed wide interior pin mode.In a concrete realization, the width of interior pin is designed to be greater than 1 millimeter and is less than 2 millimeters.More preferably, the width of interior pin is designed to 1.5 millimeters, and special dies routing ring can be implemented preferably.
Can carry out smoothly to make to cut muscle technique, in the lead frame of Fig. 3, being also provided with two ear structure 370 and 380.Ear structure 370 and 380 is " L " type structure, and they put and Rotational Symmetry centered by the center of multiple interior pin 310,320,330,340,350,360 encircled area.These two ear structure make lead frame after cutting muscle can do last breaking, and meet the technological requirement of cutting muscle.One of ordinary skill in the art will readily recognize that ear structure 370 and 380 can be not limited to " L " type structure, as long as can be convenient to make lead frame 300 be separated with array of leadframes.
Fig. 4 shows the schematic diagram without island array of leadframes 400 of an embodiment according to the application.In array of leadframes 400, comprise multiple lead frame 300a, 300b, 300c and 300d by row and column arrangement.
Between two lead frames be arranged side by side, be provided with one or more anti-sticking structure 420,440 and 460.In a specific embodiment, this anti-sticking structure be elongate in shape one or more enter cast gate, to avoid when carrying out pre-plastic package being stained with undesirable plastic packaging material on lead frame (array).Enter cast gate and be generally designed to circle, and in the present embodiment, will enter gate design is the contact area that strip can increase between pre-plastic package mould and lead frame (array) effectively, thus avoid plastic packaging material to be bonded on lead frame (array).Certainly, it will be appreciated by those skilled in the art that the shape into cast gate is not limited to strip.The cast gate that enters of one or more strip is adopted to propose after having considered following requirement here: increase the contact area between pre-plastic package mould and lead frame (array), ensure the intensity that lead frame is certain and ensure lead frame and enter certain distance between cast gate etc.
Fig. 5 show according to the embodiment of the application without the plane after little island lead frame plastic packaging.Easily find from this figure, region 510 is for placing MEMS chip, and this region is positioned at the central authorities in the region that multiple pin 520 surrounds, and pre-plastic package body (the second pre-plastic package body 240a corresponding in Fig. 2) is then arranged on the periphery of interior pin 520.Thicker silver-plated owing to having carried out lead frame before carrying out pre-plastic package, so the phase does not need externally pin 540 to carry out tin plating technique again after packaging.
Further, in order to encapsulate in universal integrated circuit processing line, the application adopts the mode of epoxy molding plastic to carry out pre-plastic package.Epoxy molding plastic (EMC-EpoxyMoldingCompound) i.e. epoxy molding material is matrix resin by epoxy resin, is curing agent with High Performance Phenolic Resins, and adding silicon powder etc. is filler, and adds the powdery moulding compound of multiple additive mixture.Its reliability is higher than common encapsulated plastic mode, and circuit can be made to avoid the impact of backflow high temperature.Thus, the lead frame of the application can not only meet the feature of MEMS package framework, and can adapt to traditional integrated circuit packaging mould, avoids the investment of the non-universal injection machine of nearly 1,000,000.
Above example mainly describes the lead frame of the application, array of leadframes and encapsulating structure.Although be only described some of them specific embodiment, those of ordinary skill in the art should understand, and the application can implement with other forms many not departing from its purport and scope.Therefore, the example shown and embodiment are regarded as illustrative and not restrictive, and when not departing from the spirit and scope that claim defines, the application may contain various amendments and replacement.
In sum, the lead frame of the application does not arrange island, take into full account the feature of pre-plastic package technique.Secondly, the application's lead frame carried out positive and negative silver-plated or two-sided local silver-plating entirely so that routing bonding to its all pin before carrying out pre-plastic package.Avoid the harmful effect that tin plating technique may cause MEMS when routine encapsulates.Moreover the lead frame of the application is provided with anti-sticking structure, be bonded on the lead frame of pre-plastic package to avoid plastic packaging material.Consider again the feature of pre-plastic package technique, the lead frame of the application has reserved enough interior pin spaces, makes interior pin to carry out good bonding.Finally, the application can use epoxy molding plastic to carry out pre-plastic package technique to lead frame, and its reliability is higher than common plastics packaged type, avoids backflow high temperature on the impact of circuit.
Claims (15)
1. one kind for MEMS chip encapsulation without little island lead frame, described lead frame comprises multiple interior pin and adopts the mode of pre-plastic package to encapsulate, make at least to form the first pre-plastic package body and the second pre-plastic package body, described first pre-plastic package body be arranged on described multiple interior pin around central area and described second pre-plastic package body is arranged on the periphery of described multiple interior pin, wherein
MEMS chip is fixed on the horizontal plane that described first pre-plastic package body is combined with described lead frame, and wherein, described pre-plastic package body by the plastic packaging process before wire bonding on lead frame or below formed.
2. lead frame as claimed in claim 1, wherein, before carrying out pre-plastic package, carries out positive and negative entirely silver-plated to form silver coating above and below lead frame to all pins of described lead frame.
3. lead frame as claimed in claim 1, wherein, before carrying out pre-plastic package, carries out two-sided local silver-plating to form silver coating above lead frame to all pins of described lead frame.
4. lead frame as claimed in claim 2 or claim 3, wherein, the thickness of described silver coating is not less than 3 microns.
5. lead frame as claimed in claim 1, wherein, the width of described interior pin is set to be greater than 1 millimeter and is less than 2 millimeters.
6. lead frame as claimed in claim 5, wherein, the width of described interior pin is set to 1.5 millimeters.
7. lead frame as claimed in claim 1, wherein, adopts epoxy molding plastic to carry out pre-plastic package to described lead frame.
8. for MEMS chip encapsulation without an island array of leadframes, comprise multiple by row and column arrange the lead frame according to any one of claim 1 to 7.
9. array of leadframes as claimed in claim 8, wherein, is provided with ear structure on the surface of each lead frame in described array of leadframes, in the below of the second pre-plastic package body, so that being separated of each lead frame and described array of leadframes.
10. array of leadframes as claimed in claim 9, wherein, on each lead frame, described ear structure comprise by the multiple interior pin of described each lead frame around regional center point centered by and rotational symmetric two L-type structures.
11. array of leadframes as claimed in claim 8, wherein, described array of leadframes is provided with anti-sticking structure, to avoid when carrying out pre-plastic package being stained with undesirable plastic packaging material in described array of leadframes.
12. array of leadframes as claimed in claim 11, wherein, described anti-sticking structure comprise be arranged on described array of leadframes two adjacent legs frames between, elongate in shape one or more enter cast gate.
13. 1 kinds of MEMS package structures, comprise the lead frame according to any one of claim 1 to 7.
14. MEMS package structures as claimed in claim 13, wherein said encapsulating structure is used for OCSOP.
15. MEMS package structures as claimed in claim 13, wherein said encapsulating structure is used for OCDIP.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110377890.4A CN103130173B (en) | 2011-11-24 | 2011-11-24 | For MEMS chip encapsulation without little island lead frame, array of leadframes and encapsulating structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110377890.4A CN103130173B (en) | 2011-11-24 | 2011-11-24 | For MEMS chip encapsulation without little island lead frame, array of leadframes and encapsulating structure |
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| CN103130173A CN103130173A (en) | 2013-06-05 |
| CN103130173B true CN103130173B (en) | 2015-11-25 |
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| US6541832B2 (en) * | 2000-01-31 | 2003-04-01 | Texas Instruments Incorporated | Plastic package for micromechanical devices |
| US6437447B1 (en) * | 2000-09-06 | 2002-08-20 | Siliconware Precision Industries Co., Ltd. | Dual-sided chip package without a die pad |
| CN1901146A (en) * | 2005-07-19 | 2007-01-24 | 富士通株式会社 | Semiconductor device and manufacturing method of the same |
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