CN203871321U - Packaging structure of integrated drive circuit of brushless direct current motor - Google Patents
Packaging structure of integrated drive circuit of brushless direct current motor Download PDFInfo
- Publication number
- CN203871321U CN203871321U CN201420259045.6U CN201420259045U CN203871321U CN 203871321 U CN203871321 U CN 203871321U CN 201420259045 U CN201420259045 U CN 201420259045U CN 203871321 U CN203871321 U CN 203871321U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- integrated drive
- chip
- effect transistor
- field effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 230000005669 field effect Effects 0.000 claims abstract description 28
- 239000004033 plastic Substances 0.000 claims abstract description 9
- 229920003023 plastic Polymers 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000012216 screening Methods 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 210000003205 muscle Anatomy 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a packaging structure of an integrated drive circuit of a brushless direct current motor. The package structure includes a lead frame, a plurality of chips are adhered to a base island of the lead frame and electrically connected with the lead frame, and the chips and the lead frame are packaged through packaging plastic and then solidified. According to the package structure in the utility model, three IC chips and six field-effect tubes are packaged in the same circuit, and thus the integrated drive circuit of the brushless direct current motor is obtained, thereby greatly simplifying design of an application circuit, improving the integration level of the application circuit, improving stability and reliability of the application circuit, and decreasing the volume of the drive circuit. According to the package structure of the integrated drive circuit of the brushless direct current motor in the utility model, screening of electrical parameters of a device is not needed, cost can be reduced obviously, and production efficiency can be improved.
Description
Technical field
The utility model relates to integrated antenna package technical field, especially a kind of encapsulating structure of brshless DC motor integrated drive electronics.
Background technology
At present, the most of discrete device that adopts of brushless direct current motor drive circuit combines, adopt the brushless direct current motor drive circuit of discrete device design, exist following two problems: first, integrated level is low, circuit structure relative complex, reliability is low, as shown in Figure 1, 3 IC chips, the electrical quantity of 6 field effect transistor requires relatively consistent, circuit ability reliability service like this, so, in the time making pcb board, must test pairing to the electrical quantity of IC chip and field effect transistor, test more complicated, time-consuming, so not only reduce production efficiency, also increased production cost simultaneously, the second, adopt the brushless direct current motor drive circuit volume of discrete device design larger, be unfavorable for the miniaturization of product.
Utility model content
The purpose of this utility model is to provide the encapsulating structure that a kind of volume is little, can greatly simplify application circuit design, the lifting integrated level of circuit and the brshless DC motor integrated drive electronics of reliability.
For achieving the above object, the utility model has adopted following technical scheme: a kind of encapsulating structure of brshless DC motor integrated drive electronics, comprise lead frame, multiple die bondings are electrically connected on lead frame Ji island and with lead frame, and chip and lead frame solidify afterwards by sealing plastic encapsulation again.
Described chip comprises three IC chips and six field effect transistor, arranges for IC die bonding San Geji island in a side of described lead frame, arranges for the bonding Liu Geji of field effect transistor island on the opposite side of lead frame, and the periphery of Ji Dao arranges multiple pins.
The described plastics of sealing adopt epoxy resin.
Between described IC chip and the pin of lead frame, between IC chip and field effect transistor, be all connected by bonding lead between field effect transistor and the pin of lead frame.
Described IC chip, field effect transistor are all bonded on lead frame Ji island by die adhesive, and described die adhesive is elargol.
Described bonding lead adopts gold thread or copper cash.
As shown from the above technical solution, the utility model is encapsulated in 3 IC chips and 6 field effect transistor in same circuit, obtains a brshless DC motor integrated drive electronics, has greatly simplified application circuit design, is suitable for large scale application; Due to 3 IC chips and 6 field effect transistor are encapsulated in same circuit, first promote the integrated level of application circuit, next has improved stability and the reliability of application circuit, moreover has reduced the volume of drive circuit, is conducive to the miniaturization of product.The utility model, without device is carried out to electrical quantity screening, can be significantly reduced to this in the time of application, enhances productivity.
Brief description of the drawings
Fig. 1 is the brushless direct current motor drive circuit figure that prior art adopts discrete device design;
Fig. 2 is the structural representation of lead frame in the utility model;
Fig. 3 is that in the utility model, IC chip and field effect transistor are bonded in the schematic diagram after lead frame;
Fig. 4 is bonding routing schematic diagram of the present utility model;
Fig. 5 is encapsulation external form vertical view of the present utility model;
Fig. 6 is encapsulation external form end view of the present utility model.
Embodiment
A kind of encapsulating structure of brshless DC motor integrated drive electronics, comprise lead frame 1, multiple die bondings are electrically connected on lead frame 1 Ji island 2 and with lead frame 1, and chip and lead frame 1 solidify by sealing plastic encapsulation, as shown in Fig. 2,3,4,5,6.
As shown in Figure 2,3, described chip comprises three IC chips 3 and six field effect transistor 4, in one side of described lead frame 1, arrange for IC chip 3 bonding San Geji islands 2, arrange for the bonding Liu Geji of field effect transistor 4 island 2 on the opposite side of lead frame 1, the periphery on base island 2 arranges multiple pins 5.Described IC chip 3, field effect transistor 4 are all bonded on lead frame 1 Ji island 2 by die adhesive, and described die adhesive is elargol.To carry out altogether bonding die twice, by chip attach agent, three IC chips 3 are bonded on lead frame 1 Ji island 2 for the first time; By die adhesive, six field effect transistor 4 are bonded on lead frame 1 Ji island 2 more for the second time.
As shown in Figure 4, between described IC chip 3 and the pin 5 of lead frame 1, between IC chip 3 and field effect transistor 4, be all connected by bonding lead between field effect transistor 4 and the pin 5 of lead frame 1, described bonding lead adopts gold thread or copper cash.
The utility model, in the time of encapsulation, first, utilizes automatic die Bonder that three IC chips 3 and six field effect transistor 4 are bonded on lead frame 1 Ji island 2 by die adhesive; The lead frame 1 of bonding IC chip 3 and field effect transistor 4 is put into the baking oven that is filled with nitrogen and carry out high-temperature baking, condition is 175 DEG C, 1 hour, die adhesive is solidified, then carry out automated bonding; Recycling automated bonding machine makes between IC chip 3 and lead frame 1, between IC chip 3 and field effect transistor 4, electric connection between field effect transistor 4 and lead frame 1; Finally, utilize injection press seal and solidify being afterwards bonded with the lead frame 1 of IC chip 3 and field effect transistor 4, the described plastics of sealing adopt epoxy resin, encapsulating material in the utility model is the KL4000-1TF model plastic packaging material of Henkel Hua Wei, the rear curing temperature of this plastic packaging material is 175 DEG C, need to heat 4 hours; After solidifying after sealing, utilize electroplating machine that the pin 5 in lead frame 1 outside is plated to tin layer, tin thickness is 5～15um, and the zinc-plated terminal client of being convenient to uses; By automatic laser marking machine, stamp the information such as product type, lot number on plastic-sealed body surface; By automatically cutting muscle bending machine, whole encapsulating structure is cut to the muscle moulding of bending.
In sum, the utility model is encapsulated in 3 and 6 field effect transistor 4 of 3 IC chips in same circuit, obtain a brshless DC motor integrated drive electronics, greatly simplify application circuit design, promote the integrated level of application circuit, improve stability and the reliability of application circuit, reduced the volume of drive circuit.The utility model, without device is carried out to electrical quantity screening, can be significantly reduced to this, enhances productivity.
Claims (6)
1. the encapsulating structure of a brshless DC motor integrated drive electronics, it is characterized in that: comprise lead frame (1), multiple die bondings above and with lead frame (1) are electrically connected on lead frame (1) Ji island (2), and chip and lead frame (1) solidify afterwards by sealing plastic encapsulation again.
2. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 1, it is characterized in that: described chip comprises three IC chips (3) and six field effect transistor (4), in one side of described lead frame (1), arrange for the bonding San Geji of IC chip (3) island (2), on the opposite side of lead frame (1), arrange for the bonding Liu Geji of field effect transistor (4) island (2), the periphery of Ji Dao (2) arranges multiple pins (5).
3. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 1, is characterized in that: described in seal plastics adopt epoxy resin.
4. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 2, is characterized in that: between described IC chip (3) and the pin (5) of lead frame (1), between IC chip (3) and field effect transistor (4), be all connected by bonding lead between field effect transistor (4) and the pin (5) of lead frame (1).
5. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 2, it is characterized in that: it is upper that described IC chip (3), field effect transistor (4) are all bonded in lead frame (1) Ji island (2) by die adhesive, and described die adhesive is elargol.
6. the encapsulating structure of brshless DC motor integrated drive electronics according to claim 4, is characterized in that: described bonding lead adopts gold thread or copper cash.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420259045.6U CN203871321U (en) | 2014-05-20 | 2014-05-20 | Packaging structure of integrated drive circuit of brushless direct current motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420259045.6U CN203871321U (en) | 2014-05-20 | 2014-05-20 | Packaging structure of integrated drive circuit of brushless direct current motor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203871321U true CN203871321U (en) | 2014-10-08 |
Family
ID=51652246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420259045.6U Expired - Fee Related CN203871321U (en) | 2014-05-20 | 2014-05-20 | Packaging structure of integrated drive circuit of brushless direct current motor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203871321U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985693A (en) * | 2014-05-20 | 2014-08-13 | 安徽国晶微电子有限公司 | Packaging structure of brushless direct-current motor integrated drive circuit and packaging method thereof |
-
2014
- 2014-05-20 CN CN201420259045.6U patent/CN203871321U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985693A (en) * | 2014-05-20 | 2014-08-13 | 安徽国晶微电子有限公司 | Packaging structure of brushless direct-current motor integrated drive circuit and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141008 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |