CN106711098A - IC plastic packaging structure and production method thereof - Google Patents
IC plastic packaging structure and production method thereof Download PDFInfo
- Publication number
- CN106711098A CN106711098A CN201611133299.3A CN201611133299A CN106711098A CN 106711098 A CN106711098 A CN 106711098A CN 201611133299 A CN201611133299 A CN 201611133299A CN 106711098 A CN106711098 A CN 106711098A
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- Prior art keywords
- lcp
- emc
- layer
- encapsulated
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920003023 plastic Polymers 0.000 title claims abstract description 33
- 239000004033 plastic Substances 0.000 title claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000000465 moulding Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011265 semifinished product Substances 0.000 claims abstract description 3
- 239000000565 sealant Substances 0.000 claims description 23
- 238000002360 preparation method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000000047 product Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 4
- 210000003205 muscle Anatomy 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000011218 segmentation Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 3
- 230000002265 prevention Effects 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 59
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 59
- 238000010586 diagram Methods 0.000 description 10
- 238000003754 machining Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to an IC plastic packaging structure and a production method thereof. The IC plastic packaging structure comprises an LCP substrate, an EMC packaging layer, and an LCP sealing layer. The LCP substrate comprises an LCP pre-molding layer and a lead wire frame, and the upper surface of the LCP substrate is provided with a chip, which is provided with the EMC packaging layer, and the outer part of the EMC packaging layer is provided with the LCP sealing layer in a packaged manner. The production method of the IC plastic packaging structure comprises steps that (1) the lower surface of the lead wire frame adopts an LCP material to produce the LCP substrate; (2) the upper surface of the LCP substrate is provided with a chip; (3)the chip is provided with the EMC packaging layer in a packaged manner; (4) the redundant EMC packaging layer is removed; (5) the outer part of the EMC packaging layer is provided with the LCP sealing layer in a packaged manner; (6) the redundant LCP sealing layer and the redundant LCP pre-molding layer disposed on the lower part of the lead wire frame are removed; (7) a semi-finished product is segmented to form an independent packaging body. The defect of the plastic packaging based on the EMC on a water and gas permeation prevention aspect is improved, and the water and gas permeation prevention performance of the plastic packaging is improved, and therefore the reliability of the plastic packaging is enhanced.
Description
Technical field
The present invention relates to a kind of IC（Integrated circuit）Plastic capsulation structure and preparation method thereof, belongs to IC manufacturing skill
Art field.
Background technology
Plastic Package is better than air-tight packaging in terms of size, weight, performance, cost.Estimate that plastic device accounts for world business
With the 97% of chip package market.But common plasticses encapsulate used encapsulating material predominantly epoxy resin, its anti-entering property of aqueous vapor
Can be poor, failure mechanism such as burn into crackle, interface debonding highly significant that aqueous vapor induces, these deficiencies limit Plastic Package
Application in highly reliable integrated antenna package.
The content of the invention
The purpose of the present invention is to overcome the deficiencies in the prior art, there is provided a kind of IC plastic capsulation structures and its preparation
Method, improves deficiency of the Plastic Package based on EMC in terms of waterproof impervious, lifts the waterproof gas accessibility of Plastic Package
Can, so that the reliability of reinforced plastics encapsulation.
According to the present invention provide technical scheme, a kind of IC plastic capsulation structures, it is characterized in that：Including LCP substrates, EMC
Encapsulated layer and LCP sealants, LCP substrates include LCP pre-moldings layer and are arranged at the lead frame of LCP pre-moldings layer upper surface；
In the upper surface chip of the LCP substrates, chip is packaged in the upper surface of LCP substrates by EMC encapsulated layers, in EMC encapsulatings
One layer of LCP sealant of outer envelope of layer.
The preparation method of the IC plastic capsulation structures, it is characterized in that, comprise the following steps：
（1）LCP substrates are formed by pre-molding using LCP materials in the lower surface of lead frame；
（2）In LCP upper surface of base plate assembling chips；
（3）Chip after assembling is encapsulated using epoxy resin, EMC encapsulated layers are obtained；
（4）Shape, size requirement according to product, removes unnecessary EMC encapsulated layers；
（5）In one layer of LCP material of EMC encapsulated layers outer envelope, LCP sealants are obtained；
（6）Shape, size requirement according to product, removes LCP unnecessary below unnecessary LCP sealants and lead frame pre-
Molding layer；
（7）By step（6）The semi-finished product segmentation for obtaining is shaped to independent packaging body.
Further, load, bonding technology assembling chip are used in the LCP upper surface of base plate.
Further, the chip is encapsulated using compression mould or injection mold technique.
Further, one layer of LCP sealing is encapsulated using the injection molding technique of injection mould outside the EMC encapsulated layers
Layer.
Further, the packaging body that the step is obtained obtains independence through the muscle that hits, deflashing, plating, printing, shaping
Packaging body.
Further, the gross thickness of the EMC encapsulated layers and LCP sealants is 0.25~1.2mm.
Compared with the prior art the present invention has advantages below：Plastic Package of the present invention using LCP materials substrate with
EMC is encapsulated in inside by LCP outer containment layers, compared with existing all EMC materials are encapsulated, encapsulating structure tool of the invention
There is stronger waterproof gas infiltration capability.
Brief description of the drawings
Fig. 1 is the schematic diagram of IC plastic capsulation structures of the present invention.
Fig. 2-1~Fig. 2-9 is the flow chart of the preparation method for stating IC plastic capsulation structures of the invention.Wherein：
Fig. 2-1 is the schematic diagram of the LCP substrates.
Fig. 2-2 is the schematic diagram in LCP substrate surface assembling chips.
Fig. 2-3 is the schematic diagram that chip is encapsulated using epoxy resin.
Fig. 2-4 is the schematic diagram of EMC encapsulated layer redundances.
Fig. 2-5 is the schematic diagram of the unnecessary EMC encapsulated layers of removal.
Fig. 2-6 is the schematic diagram in EMC encapsulated layer outer envelope LCP sealants.
Fig. 2-7 is the schematic diagram of redundance in LCP sealants and LCP pre-moldings layer.
Fig. 2-8 is the unnecessary LCP sealants of removal and the schematic diagram of LCP pre-moldings layer.
Fig. 2-9 is the schematic diagram for obtaining individual packages body.
Label in figure：Lead frame 1, LCP pre-moldings layer 2, EMC encapsulated layers 3, LCP sealants 4, chip 5.
Specific embodiment
With reference to specific accompanying drawing, the invention will be further described.
As shown in Figure 1：IC plastic capsulation structures of the present invention, including LCP substrates, EMC encapsulated layers 3 and LCP sealants
4, LCP substrates include LCP pre-moldings layer 2 and are arranged at the lead frame 1 of 2 upper surface of LCP pre-moldings layer；In the LCP substrates
Upper surface chip 5, chip 5 is packaged in the upper surface of LCP substrates by EMC encapsulated layers 3, in the outside bag of EMC encapsulated layers 3
One layer of LCP sealant 4 of envelope.
The preparation method of the IC plastic capsulation structures, comprises the following steps：
（1）As shown in Fig. 2-1, LCP substrates are formed by pre-molding using LCP materials in the lower surface of lead frame 1；
（2）As shown in Fig. 2-2, using the load of standard, bonding technology in LCP upper surface of base plate assembling chip 5；
（3）As Figure 2-3, using compression mould or injection mold technique, will be wrapped using epoxy resin on the chip 5 after assembling
Envelope, obtains EMC encapsulated layers 3；
（4）Shape, size requirement according to product, to step（3）The packaging body of EMC encapsulatings is completed, unnecessary EMC is calculated
The position of encapsulated layer 3；As in Figure 2-4, the part in EMC encapsulated layers 3 beyond dotted line is unnecessary part；
（5）As shown in Figure 2-5, using machining process, EMC encapsulated layers 3 unnecessary beyond dotted line in Fig. 2-4 are removed；
（6）As shown in figures 2-6, using the injection molding technique of injection mould, in EMC encapsulated layers 3 outer envelope, one layer of LCP material,
Obtain LCP sealants 4；
（7）As illustrated in figs. 2-7, according to product shape, size requirement, the packaging body to having completed LCP sealants 4 are calculated
Obtain the position of unnecessary LCP materials；In Fig. 2-7, the part in LCP sealants 4 and LCP pre-moldings layer 2 beyond dotted line is many
Remaining part；
（8）As illustrated in figs. 2 through 8, using machining process, it is unnecessary below unnecessary LCP sealants 4 and lead frame 1 to remove
LCP pre-moldings layer 2；
（9）As shown in figs. 2-9, by the conventional muscle that hits, deflashing, plating, printing, forming method by step（8）Half for obtaining
Finished product segmentation is shaped to independent packaging body.
In actual applications, the gross thickness of EMC encapsulated layers 3 and LCP sealants 4 is usually the EMC bags in 0.25~1.2mm
The thickness of sealing 3 is limited to the thickness of its inside chip, and the thickness of LCP sealants 4 is received to be flowed in weaker under LCP molten conditions
Property, both thickness are not associated necessarily apparently at present.
IC plastic capsulation structures of the present invention, on the lead frames using LCP（Liquid crystal polymer）By pre-molding shape
Into substrate as integrated circuit package substrate, on the substrate complete load, bonding after, using EMC（Epoxy resin）Pass through
Compress mould or be encapsulated for chip and bonding wire by injection mold technique, and primary is carried out by the way of machining and be processed into
Type EMC epoxy resin, then covered epoxy resin using LCP, then by LCP unnecessary around pin by machining
Method carry out post forming to LCP liquid crystal polymers, remove LCP unnecessary around pin, finally by the muscle that hits, go to fly
Side, plating, shaping, form a complete independent plastic packaging body.The present invention can solve LCP materials can not directly to lead key
The problem that the IC of conjunction is encapsulated, because it has the ability that the erosions such as aqueous vapor are more preferably resisted than common EMC materials, so as in height
There is preferable application prospect in reliable Plastic Package product.
Claims (7)
1. a kind of IC plastic capsulation structures, it is characterized in that：Including LCP substrates, EMC encapsulated layers（3）With LCP sealants（4）, LCP
Substrate includes LCP pre-moldings layer（2）Be arranged at LCP pre-moldings layer（2）The lead frame of upper surface（1）；In the LCP substrates
Upper surface chip（5）, chip（5）By EMC encapsulated layers（3）The upper surface of LCP substrates is packaged in, in EMC encapsulated layers（3）
One layer of LCP sealant of outer envelope（4）.
2. a kind of preparation method of IC plastic capsulation structures, it is characterized in that, comprise the following steps：
（1）In lead frame（1）Lower surface using LCP materials by pre-molding formation LCP substrates；
（2）In LCP upper surface of base plate assembling chips（5）；
（3）By the chip after assembling（5）Encapsulated using epoxy resin, obtained EMC encapsulated layers（3）；
（4）Shape, size requirement according to product, removes unnecessary EMC encapsulated layers（3）；
（5）In EMC encapsulated layers（3）One layer of LCP material of outer envelope, obtains LCP sealants（4）；
（6）Shape, size requirement according to product, removes unnecessary LCP sealants（4）And lead frame（1）Lower section is unnecessary
LCP pre-moldings layer（2）；
（7）By step（6）The semi-finished product segmentation for obtaining is shaped to independent packaging body.
3. the preparation method of IC plastic capsulation structures as claimed in claim 2, it is characterized in that：In the LCP upper surface of base plate
Using load, bonding technology assembling chip（5）.
4. the preparation method of IC plastic capsulation structures as claimed in claim 2, it is characterized in that：The chip（5）Using compression
Mould or injection mold technique are encapsulated.
5. the preparation method of IC plastic capsulation structures as claimed in claim 2, it is characterized in that：In the EMC encapsulated layers（3）Outward
Portion one layer of LCP sealant is encapsulated using the injection molding technique of injection mould（4）.
6. the preparation method of IC plastic capsulation structures as claimed in claim 2, it is characterized in that：The step（6）The envelope for obtaining
Dress body obtains independent packaging body through the muscle that hits, deflashing, plating, printing, shaping.
7. the preparation method of IC plastic capsulation structures as claimed in claim 2, it is characterized in that：The EMC encapsulated layers（3）With
LCP sealants（4）Gross thickness be 0.25~1.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611133299.3A CN106711098B (en) | 2016-12-10 | 2016-12-10 | IC plastic capsulation structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611133299.3A CN106711098B (en) | 2016-12-10 | 2016-12-10 | IC plastic capsulation structure and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711098A true CN106711098A (en) | 2017-05-24 |
| CN106711098B CN106711098B (en) | 2019-04-12 |
Family
ID=58936941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611133299.3A Active CN106711098B (en) | 2016-12-10 | 2016-12-10 | IC plastic capsulation structure and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106711098B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878299A (en) * | 2018-02-23 | 2018-11-23 | 无锡中微高科电子有限公司 | The preparation method of frame clsss integrated circuit Plastic Package is carried out by laser |
| CN108899306A (en) * | 2018-07-13 | 2018-11-27 | 中国电子科技集团公司第五十八研究所 | A kind of integrated circuit plastics seal structure and preparation method thereof |
| CN110739277A (en) * | 2019-09-11 | 2020-01-31 | 珠海格力电器股份有限公司 | kinds of packaging structure and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0927573A (en) * | 1995-07-13 | 1997-01-28 | Mitsubishi Electric Corp | Semiconductor device |
| JP2003335365A (en) * | 2002-05-17 | 2003-11-25 | Sumitomo Chem Co Ltd | Press-through-pack package |
| CN103208488A (en) * | 2012-01-12 | 2013-07-17 | 盈胜科技股份有限公司 | Thin-type multilayer array type light-emitting diode optical engine |
-
2016
- 2016-12-10 CN CN201611133299.3A patent/CN106711098B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0927573A (en) * | 1995-07-13 | 1997-01-28 | Mitsubishi Electric Corp | Semiconductor device |
| JP2003335365A (en) * | 2002-05-17 | 2003-11-25 | Sumitomo Chem Co Ltd | Press-through-pack package |
| CN103208488A (en) * | 2012-01-12 | 2013-07-17 | 盈胜科技股份有限公司 | Thin-type multilayer array type light-emitting diode optical engine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878299A (en) * | 2018-02-23 | 2018-11-23 | 无锡中微高科电子有限公司 | The preparation method of frame clsss integrated circuit Plastic Package is carried out by laser |
| CN108899306A (en) * | 2018-07-13 | 2018-11-27 | 中国电子科技集团公司第五十八研究所 | A kind of integrated circuit plastics seal structure and preparation method thereof |
| CN110739277A (en) * | 2019-09-11 | 2020-01-31 | 珠海格力电器股份有限公司 | kinds of packaging structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106711098B (en) | 2019-04-12 |
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