CN203077507U - SOD123 packaging element assembly jig - Google Patents
SOD123 packaging element assembly jig Download PDFInfo
- Publication number
- CN203077507U CN203077507U CN 201320075557 CN201320075557U CN203077507U CN 203077507 U CN203077507 U CN 203077507U CN 201320075557 CN201320075557 CN 201320075557 CN 201320075557 U CN201320075557 U CN 201320075557U CN 203077507 U CN203077507 U CN 203077507U
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- sod123
- jig
- assembly jig
- lead
- packaging
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Abstract
The utility model discloses an SOD123 packaging element assembly jig for manufacturing semiconductor packaging elements. The assembly jig is used for installing and filling an SOD123 packaging lead framework and is formed by combining an upper jig and a lower jig; the SOD123 packaging element assembly jig is prepared from graphite materials; the assembly jig prepared from the graphite materials can adapt to the subsequent high-temperature welding working procedure, and the upper jig and the lower jig are in mirror symmetry; a plurality of SOD123 packaging lead framework fixing grooves are arrayed horizontally in the jig; the fixing grooves are provided with SOD123 packaging lead framework positioning columns; the positioning columns are corresponding to positioning holes in a lead framework; the upper jig is used for fixing an SOD123 packaging lead upper framework, and the lower jig is used for fixing an SOD123 packaging lead lower framework. Compared with the prior art, the SOD123 packaging element assembly jig has the advantages of easiness in lead framework installation and filling, stable product quality, high production efficiency and the like.
Description
Technical field
The utility model relates to a kind of semiconductor encapsulated element manufacturing, relates in particular to a kind of SOD123 potted element assembly jig.
Background technology
Along with development of electronic technology; electronic product develops to the multifunctional small-size direction; the automatic chip mounting components and parts are the electronic component products that meet miniaturization automation development needs; the components and parts of SOD123 encapsulation are exactly the semiconductor components and devices that can be used for automatic chip mounting; the manufacturing process of semiconductor industry is divided into before the chip manufacturing operation two big production systems after the operation and chip packaging and testing; two main fundamental structure classifications of semiconductor packages are encapsulation of lead frame posture and substrate-type encapsulation; the effect of protection chip is played in encapsulation; the product type of wire frame is dominate in semiconductor industry still; the major function of lead frame is the carrier that mechanical support is provided for chip; and form pathway for electrical signals as connecting chip circuit inside and outside the conducting medium; lead frame carries out the assembling welding of chip by being fixed on assembly jig; design improvement along with lead frame; need the assembly jig that matches with it, to adapt to large-scale industrial production.
Summary of the invention
The purpose of the present utility model is to overcome the deficiencies in the prior art, and a kind of assembly jig that is complementary with the SOD123 encapsulating lead is provided.
The utility model is achieved through the following technical solutions:
A kind of assembly jig that is used for the manufacturing of semiconductor SOD123 potted element, this assembly jig is used to load the SOD123 encapsulating lead, assembly jig is combined by mold and bed die, SOD123 potted element assembly jig is made by graphite material, the assembly jig that graphite material is made can adapt to follow-up high-temperature soldering operation, mold and bed die are the minute surface symmetry, horizontally-arranged has several SOD123 encapsulating lead holddown grooves on the mould, holddown groove has SOD123 encapsulating lead reference column, reference column is corresponding with the locating hole on the lead frame, mold is SOD123 package lead upper frame fixedly, and bed die is SOD123 package lead underframe fixedly.
The utility model compared with prior art has following beneficial effect:
1. the lead frame filling is easy, constant product quality;
2. production efficiency height.
Description of drawings:
Fig. 1 is a SOD123 potted element assembling mold structure schematic diagram;
Among the figure: assembly jig 1, holddown groove 2 and reference column 3.
The specific embodiment
Below in conjunction with accompanying drawing and technology content of the present utility model is further described:
Accompanying drawing is depicted as SOD123 potted element assembling mold structure schematic diagram, assembly jig 1 has several SOD123 encapsulating lead holddown grooves 2, holddown groove 2 has SOD123 encapsulating lead reference column 3, reference column 3 is corresponding with the locating hole on the lead frame, SOD123 potted element assembly jig is made by graphite material, assembly jig is combined by mold and bed die, mold and bed die are the minute surface symmetry, specifically in the technological process of production, at first SOD123 package lead underframe is seated in the bed die holddown groove of assembly jig, locating hole on the lead-in wire underframe embeds in the holddown groove reference column 3, press dress place spot printing soldering paste at lead-in wire underframe wafer, then the wafer sieve is contained on the soldering paste, then SOD123 package lead upper frame is seated in the mold holddown groove of assembly jig, mould matched moulds up and down then, make lead-in wire up and down the wafer point of framework lump together, assembly jig behind the matched moulds advances to weld in the reflow ovens to be fixed, and the welding back forms the semi-finished product of SOD123 element.
Claims (4)
1. SOD123 potted element assembly jig, it is characterized in that: assembly jig is combined by mold and bed die, mold and bed die are the minute surface symmetry, and horizontally-arranged has several SOD123 encapsulating lead holddown grooves on the mould, and holddown groove has SOD123 encapsulating lead reference column.
2. a kind of SOD123 potted element assembly jig according to claim 1, it is characterized in that: mold is SOD123 package lead upper frame fixedly.
3. a kind of SOD123 potted element assembly jig according to claim 1, it is characterized in that: bed die is SOD123 package lead underframe fixedly.
4. a kind of SOD123 potted element assembly jig according to claim 1, it is characterized in that: SOD123 potted element assembly jig is made by graphite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320075557 CN203077507U (en) | 2013-02-18 | 2013-02-18 | SOD123 packaging element assembly jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320075557 CN203077507U (en) | 2013-02-18 | 2013-02-18 | SOD123 packaging element assembly jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203077507U true CN203077507U (en) | 2013-07-24 |
Family
ID=48823376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320075557 Expired - Fee Related CN203077507U (en) | 2013-02-18 | 2013-02-18 | SOD123 packaging element assembly jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203077507U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115440607A (en) * | 2022-10-13 | 2022-12-06 | 德欧泰克半导体(上海)有限公司 | Semiconductor packaging process and graphite boat structure applied to same |
-
2013
- 2013-02-18 CN CN 201320075557 patent/CN203077507U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115440607A (en) * | 2022-10-13 | 2022-12-06 | 德欧泰克半导体(上海)有限公司 | Semiconductor packaging process and graphite boat structure applied to same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130724 Termination date: 20200218 |