CN203481191U - Frame-based AAQFN package adopting pre-plastic-package optimization technology - Google Patents
Frame-based AAQFN package adopting pre-plastic-package optimization technology Download PDFInfo
- Publication number
- CN203481191U CN203481191U CN201320536954.5U CN201320536954U CN203481191U CN 203481191 U CN203481191 U CN 203481191U CN 201320536954 U CN201320536954 U CN 201320536954U CN 203481191 U CN203481191 U CN 203481191U
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- China
- Prior art keywords
- chip
- lead frame
- etching
- package
- aaqfn
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a frame-based AAQFN package adopting a pre-plastic-package optimization technology. The package is mainly composed of a lead frame, chip adhering glue, a chip, bonding wires, etching bumps and a plastic body. The lead frame and the chip are connected through the chip adhering glue, the etching bumps are etched on the front and the back of the lead frame, and the bonding wires are connected from the chip to the lead frame. The plastic body surrounds the lead frame, the chip adhering glue, the chip, the bonding wires and the etching bumps. The chip, the bonding wires, the etching bumps and the lead frame constitute a power and signal channel of a circuit. The frame-based AAQFN package can be applied to a thin frame, the thickness of the product is greatly reduced, the design and process difficulty is reduced, the product processing cycle is accelerated, and the production efficiency and the product reliability are improved.
Description
Technical field
The utility model belongs to integrated antenna package technical field, is specifically related to a kind of AAQFN packaging part and manufacture craft thereof that adopts pre-plastic packaging optimisation technique based on framework.
Background technology
Integrated circuit is the core of information industry and new and high technology, is the basis of economic development.Integrated antenna package is the chief component of IC industry, and its development is accompanied by the increase of its function and device count always and strides forward.From the nineties in 20th century, it has entered the development track of many number of pins, thin space, small-sized slimming.Carrier-free Background Grid array packages (being AAQFN) is for adapting to the fast-developing a kind of new packing forms being born of electronic product, is that complete electronic set is realized microminaturization, lightweight, the requisite product of networking.
Carrier-free Background Grid array packages element, bottom does not have soldered ball, during welding, pin is directly connected with pcb board, with the electric and mechanical connection of PCB be by Printing Paste on PCB pad, the solder joint that coordinates SMT reflow soldering process to form is realized.This technology encapsulation can realize many pins, high density, small-sized slimming encapsulation under same size condition, has the features such as thermal diffusivity, electrical property and coplanarity are good.
AAQFN encapsulating products is applicable on a large scale, the encapsulation of very lagre scale integrated circuit (VLSIC).The device great majority of AAQFN encapsulation are for high-grade consumer goods markets such as mobile phone, network and communications equipment, digital camera, microcomputer, notebook computer and various types of flat panel displays.Grasp its core technology, possess mass production capabilities, will greatly dwindle the gap of domestic IC industry and international most advanced level, this product has wide market application foreground.
But due to restrictions such as technical difficulty, the popularization of AAQFN product on market at present acquires a certain degree of difficulty, and especially, aspect reliability, directly affects use and the life-span of product, become the research of technique difficult point of AAQFN packaging part.
Utility model content
Large in order to solve AAQFN product design and technology difficulty, make long problem of construction cycle, the utility model adopts a kind of AAQFN packaging part that adopts pre-plastic packaging optimisation technique based on framework, by the etching period before pre-plastic packaging and pre-plastic packaging, at the product back side, by etching, carry out figure, carry out again conventional packaging technology, chip is connected with pin with bonding line, thereby it is whole to form circuit.
Based on framework, adopt an AAQFN packaging part for pre-plastic packaging optimisation technique, described packaging part is mainly comprised of lead frame, bonding die glue, chip, bonding line, etching salient point and plastic-sealed body.Described lead frame is connected by bonding die glue with chip, and the front and back etching of lead frame has etching salient point, and bonding line is connected to lead frame from chip.Plastic-sealed body has surrounded lead frame, bonding die glue, chip, bonding line and etching salient point, and chip, bonding line, etching salient point, lead frame have formed power supply and the signalling channel of circuit.
A kind of fabrication processing of the AAQFN packaging part that adopts pre-plastic packaging optimisation technique based on framework is as follows: the framework back side is done after Etching salient point → etching the back side and carried out pre-plastic packaging → framework front and do Etching salient point → wafer attenuate → scribing → upper core (bonding die) → pressure welding → plastic packaging → rear solidify → printing → separation of products → check → packing → warehouse-in.
This utility model can have the thickness that significantly reduces product, effectively reduces design and technology difficulty, and the production cycle of having improved product, weight reduction also improves packaging part reliability.
Accompanying drawing explanation
Fig. 1 is lead frame profile;
Fig. 2 is that profile after Etching is done at the lead frame back side;
Fig. 3 is the lead frame back side preformed profile of being honored as a queen;
Fig. 4 is that profile after Etching is done in lead frame front;
Fig. 5 is product profile after upper core;
Fig. 6 is product profile after pressure welding;
Fig. 7 is plastic packaged products profile;
Fig. 8 is product profile after rear solidifying;
Fig. 9 is finished product profile.
In figure, 1 is lead frame, and 2 is bonding die glue, and 3 is chip, and 4 is bonding line, and 5 is etching salient point, and 6 is plastic-sealed body.
Embodiment
Below in conjunction with accompanying drawing, this utility model is described further.
As shown in Figure 9, a kind ofly based on framework, adopt the AAQFN packaging part of pre-plastic packaging optimisation technique mainly by lead frame 1, bonding die glue 2, chip 3, bonding line 4, etching salient point 5 and plastic-sealed body 6, to be formed.Described lead frame 1 is connected by bonding die glue 2 with chip 3, and the front and back etching of lead frame 1 has etching salient point 5, and bonding line 4 is connected to lead frame 1 from chip 3.Plastic-sealed body 6 has surrounded lead frame 1, bonding die glue 2, chip 3, bonding line 4 and etching salient point 5, and chip 3, bonding line 4, etching salient point 5, lead frame 1 have formed power supply and the signalling channel of circuit.
If Fig. 1 is to as shown in Fig. 9, a manufacture craft that adopts the AAQFN packaging part of pre-plastic packaging optimisation technique based on framework, technical process is as follows: the framework back side is done after Etching salient point → etching the back side and carried out pre-plastic packaging → framework front and do Etching salient point → wafer attenuate → scribing → upper core (bonding die) → pressure welding → plastic packaging → rear solidify → printing → separation of products → check → packing → warehouse-in.
As shown in the figure, a kind of manufacture craft that adopts the AAQFN packaging part of pre-plastic packaging optimisation technique based on framework, according to following concrete steps, carry out:
1, Etching salient point 5 is done at lead frame 1 back side, and after etching, pre-plastic packaging is carried out at the back side, and then Etching salient point 5 is done in lead frame 1 front.
This method can realize the application on slim framework, has significantly reduced the thickness of product, reduces design and technology difficulty, accelerates the product process-cycle, enhances productivity and product reliability.
Figure is carried out in lead frame 1 front after carrying out figure and etching and completing in lead frame 1 back side, carries out etching, can carry out encapsulation flow process according to common process.
2, attenuate, scribing: wafer thickness thinning 50 μ m～200 μ m, the above wafer of 150 μ m is with common AAQFN scribing process, but thickness is at the following wafer of 150 μ m, uses double-pole scribing machine and technique thereof.
3, upper core (bonding die): adopt bonding die glue 2 that chip 3 is connected with lead frame 1, the connection of forming circuit.
4, pressure welding: pressure welding is identical with conventional AAQFN technique.
5, plastic packaging, solidify afterwards, printing, separation of products, check, packing etc. are all identical with conventional AAQFN technique.
Claims (1)
1. based on framework, adopt an AAQFN packaging part for pre-plastic packaging optimisation technique, it is characterized in that: described packaging part is mainly comprised of lead frame (1), bonding die glue (2), chip (3), bonding line (4), etching salient point (5) and plastic-sealed body (6); Described lead frame (1) is connected by bonding die glue (2) with chip (3), and the front and back etching of lead frame (1) has etching salient point (5), and bonding line (4) is connected to lead frame (1) from chip (3); Plastic-sealed body (6) has surrounded lead frame (1), bonding die glue (2), chip (3), bonding line (4) and etching salient point (5), and chip (3), bonding line (4), etching salient point (5), lead frame (1) have formed power supply and the signalling channel of circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320536954.5U CN203481191U (en) | 2013-08-31 | 2013-08-31 | Frame-based AAQFN package adopting pre-plastic-package optimization technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320536954.5U CN203481191U (en) | 2013-08-31 | 2013-08-31 | Frame-based AAQFN package adopting pre-plastic-package optimization technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203481191U true CN203481191U (en) | 2014-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320536954.5U Expired - Lifetime CN203481191U (en) | 2013-08-31 | 2013-08-31 | Frame-based AAQFN package adopting pre-plastic-package optimization technology |
Country Status (1)
| Country | Link |
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| CN (1) | CN203481191U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489795A (en) * | 2013-08-31 | 2014-01-01 | 华天科技（西安）有限公司 | Frame-based AAQFN package with frame pre-plastic-package optimization technique adopted and manufacturing technique thereof |
-
2013
- 2013-08-31 CN CN201320536954.5U patent/CN203481191U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489795A (en) * | 2013-08-31 | 2014-01-01 | 华天科技（西安）有限公司 | Frame-based AAQFN package with frame pre-plastic-package optimization technique adopted and manufacturing technique thereof |
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| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140312 |