CN203521396U - Copper-free flat packaging piece of AAQFN frame product - Google Patents
Copper-free flat packaging piece of AAQFN frame product Download PDFInfo
- Publication number
- CN203521396U CN203521396U CN201320598278.4U CN201320598278U CN203521396U CN 203521396 U CN203521396 U CN 203521396U CN 201320598278 U CN201320598278 U CN 201320598278U CN 203521396 U CN203521396 U CN 203521396U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- electrosilvering
- chip
- circuit
- aaqfn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a copper-free flat packaging piece of an AAQFN frame product. The packaging piece is mainly formed by a lead frame, electrosilvering circuits, a chip, bonding wires, a plastic package body and a green oil coating layer. The electrosilvering circuits are silver layers formed on the lead frame through electroplating; the chip is connected with the lead frame through adhesive tape; the bonding wires are connected with the electrosilvering circuits on the lead frame directly from the chip; the plastic package body surrounds the lead frame, the electrosilvering circuits, the chip and the bonding wires; the green oil coating layer coats the etched back face of the lead frame; and the chip, the bonding wires and the electrosilvering circuits form a power supply and signal channel. According to the copper-free flat packaging piece, packaging reliability of the product is directly improved, and cost is reduced to a certain degree.
Description
Technical field
The utility model belongs to integrated antenna package technical field, in the design basis of common AAQFN Feng Installed part, the electrosilvering of usining replaces copper as a kind of novel NCAAQFN(Non-Copper AAQFN of circuit) encapsulation, specifically a kind of AAQFN shell frame products is without copper flat packaging part.
background technology
Integrated circuit is the core of information industry and new and high technology, is the basis of economic development.Integrated antenna package is the chief component of IC industry, and its development is accompanied by the increase of its function and device count always and strides forward.From the nineties in 20th century, it has entered the development track of many number of pins, thin space, small-sized slimming.Carrier-free Background Grid array packages (being AAQFN) is for adapting to the fast-developing a kind of new packing forms being born of electronic product, is that complete electronic set is realized microminaturization, lightweight, the requisite product of networking.
Carrier-free Background Grid array packages element, bottom does not have soldered ball, during welding, pin is directly connected with pcb board, with the electric and mechanical connection of PCB be by Printing Paste on PCB pad, the solder joint that coordinates SMT reflow soldering process to form is realized.This technology encapsulation can realize many pins, high density, small-sized slimming encapsulation under same size condition, has the features such as thermal diffusivity, electrical property and coplanarity are good.
AAQFN encapsulating products is applicable on a large scale, the encapsulation of very lagre scale integrated circuit (VLSIC).The device great majority of AAQFN encapsulation are for high-grade consumer goods markets such as mobile phone, network and communications equipment, digital camera, microcomputer, notebook computer and various types of flat panel displays.Grasp its core technology, possess mass production capabilities, will greatly dwindle the gap of domestic IC industry and international most advanced level, this product has wide market application foreground.
But due to restrictions such as technical difficulty, the popularization of AAQFN product on market at present acquires a certain degree of difficulty, and especially, aspect reliability, directly affects use and the life-span of product, become the research of technique difficult point of AAQFN packaging part.
Utility model content
The problem existing in order to overcome above-mentioned prior art, the utility model provides a kind of AAQFN shell frame products without copper flat packaging part, and it uses electrosilvering to replace copper as circuit, directly improves the package reliability of product, and reduces costs to a certain extent.
A kind of AAQFN shell frame products is mainly comprised of lead frame, electrosilvering circuit, chip, bonding line, plastic-sealed body and green oil coat without copper flat packaging part.Described electrosilvering circuit is on lead frame, to electroplate the silver layer forming, chip is connected by bonding die glue with lead frame, bonding line is the electrosilvering connection from chip and lead frame directly, plastic-sealed body has surrounded lead frame, electrosilvering circuit, chip and bonding line, green oil coat is coated on the back side after lead frame etching, and chip, bonding line and electrosilvering circuit have formed power supply and the signalling channel of circuit.
Plastic-sealed body has played support and protective effect to chip and bonding line, and lead frame is just as the carrier in process.
A kind of AAQFN shell frame products is as follows without the technological process of the manufacture craft of copper flat packaging part: wafer attenuate → scribing → lead frame powers on, and silver-plated circuit → above core (bonding die) → pressure welding → plastic packaging → rear solidify → framework back etched → green oil applies → prints → cut → check → packing → warehouse-in.
Accompanying drawing explanation
Fig. 1 lead frame profile;
Product profile after core on Fig. 2;
Product profile after Fig. 3 pressure welding;
Fig. 4 plastic packaged products profile;
Product profile after Fig. 5 framework back etched;
Product section after Fig. 6 green oil applies.
In figure, 1 is lead frame, and 2 is electrosilvering circuit, and 3 is chip, and 4 is bonding line, and 5 is plastic-sealed body, and 6 is green oil coat.
Embodiment
As shown in the figure, a kind of AAQFN shell frame products is mainly comprised of lead frame 1, electrosilvering circuit 2, chip 3, bonding line 4, plastic-sealed body 5 and green oil coat 6 without copper flat packaging part.Described electrosilvering circuit 2 is on lead frame 1, to electroplate the silver layer forming, chip 3 is connected by bonding die glue with lead frame 1, bonding line 4 is directly connected with the electrosilvering circuit 2 lead frame from chip 3, plastic-sealed body 5 has surrounded lead frame 1, electrosilvering circuit 2, chip 3 and bonding line 4, green oil coat 6 is coated on the back side after lead frame 1 etching, and chip 3, bonding line 4 and electrosilvering circuit 2 have formed power supply and the signalling channel of circuit.
5 pairs of chips 3 of plastic-sealed body and bonding line 4 have played support and protective effect, and lead frame 1 is just as the carrier in process.
A kind of AAQFN shell frame products is as follows without the technological process of the manufacture craft of copper flat packaging part: wafer attenuate → scribing → lead frame powers on, and silver-plated circuit → above core (bonding die) → pressure welding → plastic packaging → rear solidify → framework back etched → green oil applies → prints → cut → check → packing → warehouse-in.
As shown in the figure, a kind of AAQFN shell frame products carries out according to following concrete steps without the manufacture craft of copper flat packaging part:
The first step: wafer attenuate: thickness thinning 50 μ m～200 μ m, roughness Ra 0.10mm～0.05mm;
Second step: scribing: the above wafer of 150 μ m is with common Q FN scribing process, but thickness is at the following wafer of 150 μ m, uses double-pole scribing machine and technique thereof;
The 3rd step: the lead frame silver-plated circuit that powers on;
The 4th step: upper core (bonding die): not only can adopt bonding die glue but also can adopt the upper core of glue film (DAF);
The 5th step: pressure welding: pressure welding is identical with conventional AAQFN technique;
The 6th step: plastic packaging: carry out plastic packaging with traditional plastic packaging material (as 9220);
The 7th step: rear curing process is with conventional AAQFN technique;
The 8th step: framework back etched groove, all etches away all copper on framework back-side unit product with liquor ferri trichloridi;
The 9th step: green oil technique is identical with conventional AAQFN technique;
The tenth step: printing, cutting, check, packing etc. are all identical with conventional AAQFN technique.
Claims (1)
1. AAQFN shell frame products, without a copper flat packaging part, is characterized in that: described packaging part is mainly comprised of lead frame (1), electrosilvering circuit (2), chip (3), bonding line (4), plastic-sealed body (5) and green oil coat (6); Described electrosilvering circuit (2) is at the upper silver layer forming of electroplating of lead frame (1), chip (3) is connected by bonding die glue with lead frame (1), bonding line (4) is directly connected with the electrosilvering circuit (2) lead frame from chip (3), plastic-sealed body (5) has surrounded lead frame (1), electrosilvering circuit (2), chip (3) and bonding line (4), green oil coat (6) is coated on the back side after lead frame (1) etching, and chip (3), bonding line (4) and electrosilvering circuit (2) have formed power supply and the signalling channel of circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320598278.4U CN203521396U (en) | 2013-09-27 | 2013-09-27 | Copper-free flat packaging piece of AAQFN frame product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320598278.4U CN203521396U (en) | 2013-09-27 | 2013-09-27 | Copper-free flat packaging piece of AAQFN frame product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203521396U true CN203521396U (en) | 2014-04-02 |
Family
ID=50380286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320598278.4U Expired - Lifetime CN203521396U (en) | 2013-09-27 | 2013-09-27 | Copper-free flat packaging piece of AAQFN frame product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203521396U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474406A (en) * | 2013-09-27 | 2013-12-25 | 华天科技（西安）有限公司 | Copper-free flat packaging piece of AAQFN frame product and manufacturing process thereof |
-
2013
- 2013-09-27 CN CN201320598278.4U patent/CN203521396U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474406A (en) * | 2013-09-27 | 2013-12-25 | 华天科技（西安）有限公司 | Copper-free flat packaging piece of AAQFN frame product and manufacturing process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |
|
| CX01 | Expiry of patent term |