CN203085493U - SOD123 packaged chip screening and mounting template - Google Patents
SOD123 packaged chip screening and mounting template Download PDFInfo
- Publication number
- CN203085493U CN203085493U CN 201320075637 CN201320075637U CN203085493U CN 203085493 U CN203085493 U CN 203085493U CN 201320075637 CN201320075637 CN 201320075637 CN 201320075637 U CN201320075637 U CN 201320075637U CN 203085493 U CN203085493 U CN 203085493U
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- CN
- China
- Prior art keywords
- wafer
- sod123
- chip
- template
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an SOD123 packaged chip screening and mounting template in the manufacturing field of semiconductor components. The SOD123 packaged chip screening and mounting template comprises a chip screening and mounting tray, a template frame, an air suction hole and positioning holes. The chip screening and mounting tray is fixedly arranged above the template frame. The air suction hole is formed in the side surface of the template frame. The positioning holes are formed on the two sides of the side frame of the upper part of the template frame. The template frame is a closed cavity. Chip positioning seats are arranged on the chip screening and packaging tray. Through holes are formed in the bottoms of the chip positioning seats and are communicated with the closed cavity of the template frame. Vacuum negative pressure of the closed cavity of the template frame enables chips to be fixed in the chip positioning seats. After an air suction vacuum pump is shut down, the chips in the chip positioning seats fall down to the soldering paste points of a lead frame. Compared with the prior art, the SOD123 packaged chip screening and mounting template disclosed by the utility model has the advantages of convenience in operation, high production efficiency, high chip positioning accuracy, excellent product quality and the like.
Description
Technical field
The utility model relates to the production mould that semiconductor components and devices is made the field, and specifically, the utility model is a kind of SOD123 encapsulated wafer sieve decking.
Technical background
Along with development of electronic technology, electronic product develops to the multifunctional small-size direction, the automatic chip mounting components and parts are the electronic component products that meet miniaturization automation development needs, the components and parts of SOD123 encapsulation are exactly the semiconductor element that can be used for automatic chip mounting, in the manufacturing process of the components and parts that SOD123 encapsulates, it is one important procedure in the SOD123 encapsulating products production technology that semiconductor wafer is mounted on the lead frame, being mounted on the lead frame how with the wafer efficiently and accurately, need match with it by the dress mould, to adapt to large-scale industrial production.
Summary of the invention
The purpose of the present utility model is to overcome the deficiencies in the prior art, and a kind of SOD123 of being used for encapsulated wafer sieve decking is provided.
The utility model is achieved through the following technical solutions:
A kind of SOD123 encapsulated wafer sieve decking, comprise the sabot of wafer sieve, pattern plate bolster, suction hole and location hole, the pattern plate bolster top is fixed in the sabot of wafer sieve, pattern plate bolster is a closed cavity, there is suction hole the pattern plate bolster side, suction hole links to each other with vacuum pump by tracheae, make the closed cavity of pattern plate bolster form negative pressure of vacuum, in the sabot of wafer sieve the wafer orientation seat is arranged, the SOD123 encapsulated wafer can be put into the wafer orientation seat in the sabot of wafer sieve, the positioning seat bottom has through hole to communicate with the pattern plate bolster closed cavity, the closed cavity negative pressure of vacuum of pattern plate bolster is fixed in the positioning seat wafer, frame both sides, pattern plate bolster top are with location hole, are used for wafer when in place and the contraposition of lead frame template.
Compared with prior art, the utlity model has following beneficial effect:
1. easy to operate, the production efficiency height;
2. wafer is in place accurately, good product quality.
Description of drawings
Fig. 1 is SOD123 encapsulated wafer sieve decking external form schematic diagram
Among the figure: pattern plate bolster 1, the sabot 2 of wafer sieve, wafer orientation seat 3, suction hole 4 and location hole 5.
Embodiment
Below in conjunction with accompanying drawing and use content of the present utility model is further described:
Be illustrated in figure 1 as a kind of SOD123 encapsulated wafer sieve decking, the manufacturing process that is used for the components and parts of SOD123 encapsulation, semiconductor wafer is mounted on the lead frame, comprise the sabot 2 of wafer sieve, pattern plate bolster 1, suction hole 4 and location hole 5, the sabot 2 of wafer sieve is by being loaded on the pattern plate bolster top, pattern plate bolster is a closed cavity, frame both sides, pattern plate bolster top are with location hole, be used for wafer when in place and the contraposition of lead frame template, there is suction hole the pattern plate bolster side, suction hole links to each other with vacuum pump by tracheae, making pattern plate bolster is that closed cavity forms negative pressure of vacuum, in the sabot of wafer sieve the wafer orientation seat is arranged, and the SOD123 encapsulated wafer can be put into the wafer orientation seat in the sabot of wafer sieve, the positioning seat bottom has through hole to communicate with the pattern plate bolster closed cavity, and the closed cavity negative pressure of vacuum of pattern plate bolster is fixed in the positioning seat wafer;
Concrete using method is as follows:
1. the SOD123 encapsulated wafer is positioned in the sabot of wafer sieve;
2. by shaking encapsulated wafer sieve decking, wafer is fallen in the wafer orientation seat;
3. open air-breathing vacuum pump, form negative pressure of vacuum at the closed cavity of pattern plate bolster wafer is fixed in the positioning seat;
4. be inverted encapsulated wafer sieve decking, make the sabot of wafer sieve corresponding with lead frame;
5. align with lead frame by location hole 5;
6. close air-breathing vacuum pump, the wafer in the wafer orientation seat drops on the soldering paste point of lead frame.
Claims (2)
1. a SOD123 encapsulated wafer sieves decking, comprise the sabot of wafer sieve, pattern plate bolster, suction hole and location hole, the pattern plate bolster top is fixed in the sabot of wafer sieve, there is suction hole the pattern plate bolster side, frame both sides, pattern plate bolster top are with location hole, it is characterized in that: pattern plate bolster is a closed cavity, in the sabot of wafer sieve the wafer orientation seat is arranged, and the positioning seat bottom has through hole to communicate with the pattern plate bolster closed cavity.
2. SOD123 encapsulated wafer sieve decking according to claim 1 is characterized in that: the SOD123 encapsulated wafer can be put into the wafer orientation seat in the sabot of wafer sieve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320075637 CN203085493U (en) | 2013-02-18 | 2013-02-18 | SOD123 packaged chip screening and mounting template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320075637 CN203085493U (en) | 2013-02-18 | 2013-02-18 | SOD123 packaged chip screening and mounting template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203085493U true CN203085493U (en) | 2013-07-24 |
Family
ID=48831308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320075637 Expired - Fee Related CN203085493U (en) | 2013-02-18 | 2013-02-18 | SOD123 packaged chip screening and mounting template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203085493U (en) |
-
2013
- 2013-02-18 CN CN 201320075637 patent/CN203085493U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130724 Termination date: 20200218 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |