CN204088305U - Novel high-density can stack package structure - Google Patents
Novel high-density can stack package structure Download PDFInfo
- Publication number
- CN204088305U CN204088305U CN201420355574.6U CN201420355574U CN204088305U CN 204088305 U CN204088305 U CN 204088305U CN 201420355574 U CN201420355574 U CN 201420355574U CN 204088305 U CN204088305 U CN 204088305U
- Authority
- CN
- China
- Prior art keywords
- post
- substrate
- tin
- chip
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000005022 packaging material Substances 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 9
- 238000007747 plating Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a kind of novel high-density can stack package structure and manufacture method, described encapsulating structure comprises metal lead wire frame or substrate (5), described metal lead wire frame or substrate (5) front are pasted with chip (3), described chip (3) is provided with copper post (2) around, described copper post (2) top is provided with tin post (4), described copper post (2), chip (3) and tin post (4) outer peripheral areas are encapsulated with plastic packaging material (1), the height of described plastic packaging material (1) exceedes the height of tin post (4), described tin post (4) top area offers installing hole (6).The beneficial effects of the utility model are: it combinationally uses plating and laser drill mode improves the precision of substrate design and manufacture, can realize Finepitch(thin space) packaging body stacking, improve the safety and reliability of packaging body.
Description
Technical field
The present invention relates to a kind of novel high-density can stack package structure, belongs to technical field of semiconductor encapsulation.
Background technology
As shown in figure 12, the mainly stacking top layer substrate encapsulation on Lower level logical substrate of its manufacture craft, utilizes the metallic copper post on underlying substrate to realize the stacking of two packaging bodies with electrically interconnected by the attachment of soldered ball, Reflow Soldering to the packing forms of current PoP.
Above-mentioned PoP(packaging body stacked package body) encapsulating structure has the following disadvantages:
1, the electric connection copper post of bottom substrate is by the restriction of height with diameter dimension in electroplating manufacturing process, cannot accomplish high density designs and manufacture;
2, interconnected by the metallic tin ball of the outer pin of top layer packaging body between bottom package body and glob top, after Reflow Soldering, metallic tin club produces thermal deformation, top layer packaging solder ball spacing can than little before Reflow Soldering, for avoiding the short circuit between soldered ball, so top layer can not be adopted to be encapsulated as Fine Pitch(thin space) encapsulation stacking;
If 3, substrate package body is stacking adopt that many little metallic tin balls are stacking to carry out interconnected for reducing sphere gap, in the process that attachment is stacking, contraposition difficulty, easily causes accuracy error or upper sphere landing, causes open circuit or Effect of Short Circuit attachment yield.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, there is provided a kind of novel high-density can stack package structure and manufacture method, it combinationally uses plating and laser drill mode improves the precision of substrate design and manufacture, Fine pitch(thin space can be realized) packaging body stacking, improve the safety and reliability of packaging body.
The object of the present invention is achieved like this: a kind of novel high-density can stack package structure, it comprises metal lead wire frame or substrate, described metal lead wire frame or substrate front side are pasted with chip, described chip circumference is provided with copper post, described copper column top is provided with tin post, described copper post, chip and tin post outer peripheral areas are encapsulated with plastic packaging material, and the height of described plastic packaging material exceedes the height of tin post, and region, described tin column top offers installing hole.
Compared with prior art, the present invention has following beneficial effect:
1, the metallic circuit that is electrically connected between substrate uses plating and laser drill mode to make, and two kinds of process matching composition complementaries can avoid Direct Electroplating metal column cannot reach Fine pitch(thin space) problem, realize the design and manufaction of high-density line;
2, plating makes the connection metal line layer of high-density base board is copper, tin, and in the stacking process of packaging body, tin and metallic tin ball directly reflux and combine, and reduce the stability that production difficulty improves technique;
3, during bumps melt, tin, by staying in ring-type copper post metal column or being full of annular metal post to alleviate the subside spilling of salient point in reflux course, avoids short circuit;
4, in the stacking process of packaging body, electrotinning is directly combined closely with layers of copper and metallic tin sphere, and compactness is better than the combination of layers of copper and metallic tin ball, substantially increases the reliability of stacked package body.
Accompanying drawing explanation
Fig. 1 ~ Figure 10 is that a kind of novel high-density of the present invention can each operation schematic diagram of manufacture method of stack package structure.
Figure 11 is that a kind of novel high-density of the present invention can the structural representation of stacked package body on stack package structure.
Figure 12 is the structural representation of current POP packing forms.
Wherein:
Plastic packaging material 1
Copper post 2
Chip 3
Tin post 4
Metal lead wire frame or substrate 5
Installing hole 6.
Embodiment
See Figure 10, a kind of novel high-density of the present invention can stack package structure, it comprises metal lead wire frame or substrate 5, described metal lead wire frame or substrate 5 front are pasted with chip 3, be provided with copper post 2 around described chip 3, described copper post 2 top is provided with tin post 4, and described copper post 2, chip 3 and tin post 4 outer peripheral areas are encapsulated with plastic packaging material 1, the height of described plastic packaging material 1 exceedes the height of tin post 4, and described tin post 4 top area offers installing hole 6.
Its manufacture method is as follows:
Step one, get metal lead wire frame or substrate surface and paste photoresistance film operation
See Fig. 1, get the suitable metal lead wire frame of a slice thickness or substrate sticks the photoresistance film can carrying out exposure imaging respectively in front and the back side, described photoresistance film can adopt wet type photoresistance film or dry type photoresistance film;
Step 2, metal lead wire frame or substrate front side removal unit divide photoresistance film
See Fig. 2, the metal lead wire frame utilizing exposure imaging equipment step one to be completed to paste photoresistance film operation or substrate front side are carried out graph exposure, development and removal unit and are divided figure photoresistance film, to expose the regional graphics that metal lead wire frame or the follow-up needs of substrate front side carry out electroplating;
Step 3, electro-coppering post
See Fig. 3, in step 2, metal lead wire frame or substrate front side removal unit divide electric plated with copper post in the region of photoresistance film, and metal column can play the effect carrying out with other packaging body being electrically connected;
Step 4, electrotinning post
See Fig. 4, region, the copper column top electrotinning post in step 3;
Step 5, removal photoresistance film
See Fig. 5, remove the photoresistance film of metal lead wire frame or substrate surface;
Step 6, organic layer are protected
See Fig. 6, carry out the protection of metal organic layer at metal lead wire frame or substrate surface;
Step 7, pasting chip
See Fig. 7, pasting chip on metal lead wire frame or substrate, pasting chip can adopt formal dress, upside-down mounting, mode such as some glue, plumber's solder etc.;
Step 8, encapsulating
See Fig. 8, plastic packaging material is adopted to carry out plastic packaging at metal lead wire frame or substrate front side;
Step 9, laser beam drilling
See Fig. 9, in corresponding step 8, the tin columnar region of metal lead wire frame or substrate front side carries out laser beam drilling, to expose the tin post be embedded in plastic packaging material;
Step 10, cutting finished product
See Figure 10, semi-finished product step 9 being completed perforate carry out cutting operation, make originally to integrate in array aggregate mode and the plastic-sealed body module more than contain chip is cut independent.
Claims (1)
1. a novel high-density can stack package structure, it is characterized in that: it comprises metal lead wire frame or substrate (5), described metal lead wire frame or substrate (5) front are pasted with chip (3), described chip (3) is provided with copper post (2) around, described copper post (2) top is provided with tin post (4), described copper post (2), chip (3) and tin post (4) outer peripheral areas are encapsulated with plastic packaging material (1), the height of described plastic packaging material (1) exceedes the height of tin post (4), and described tin post (4) top area offers installing hole (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420355574.6U CN204088305U (en) | 2014-06-30 | 2014-06-30 | Novel high-density can stack package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420355574.6U CN204088305U (en) | 2014-06-30 | 2014-06-30 | Novel high-density can stack package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204088305U true CN204088305U (en) | 2015-01-07 |
Family
ID=52180985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420355574.6U Expired - Lifetime CN204088305U (en) | 2014-06-30 | 2014-06-30 | Novel high-density can stack package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204088305U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051443A (en) * | 2014-06-30 | 2014-09-17 | 江苏长电科技股份有限公司 | Novel high-density stackable packaging structure and manufacturing method thereof |
| CN106505045A (en) * | 2015-09-08 | 2017-03-15 | 艾马克科技公司 | There is the semiconductor packages and method that can route the conductive substrate being encapsulated |
| CN111584478A (en) * | 2020-05-22 | 2020-08-25 | 甬矽电子(宁波)股份有限公司 | Laminated chip packaging structure and laminated chip packaging method |
-
2014
- 2014-06-30 CN CN201420355574.6U patent/CN204088305U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051443A (en) * | 2014-06-30 | 2014-09-17 | 江苏长电科技股份有限公司 | Novel high-density stackable packaging structure and manufacturing method thereof |
| CN104051443B (en) * | 2014-06-30 | 2017-02-01 | 江阴芯智联电子科技有限公司 | High-density stackable packaging structure and manufacturing method thereof |
| CN106505045A (en) * | 2015-09-08 | 2017-03-15 | 艾马克科技公司 | There is the semiconductor packages and method that can route the conductive substrate being encapsulated |
| CN106505045B (en) * | 2015-09-08 | 2021-10-29 | 艾马克科技公司 | Semiconductor package with routable encapsulated conductive substrate and method |
| CN111584478A (en) * | 2020-05-22 | 2020-08-25 | 甬矽电子(宁波)股份有限公司 | Laminated chip packaging structure and laminated chip packaging method |
| CN111584478B (en) * | 2020-05-22 | 2022-02-18 | 甬矽电子(宁波)股份有限公司 | Laminated chip packaging structure and laminated chip packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160429 Address after: 214434 Jiangyin, Jiangsu, Chengjiang city street, Long Hill Road, No. 78 Patentee after: Jiangsu Changjiang Electronics Technology Co., Ltd. Address before: 214434 Jiangyin, Jiangsu Province, Chengjiang Mayor Hill Road, No. 78, No. Patentee before: Jiangsu Changjiang Electronics Technology Co., Ltd. |