CN207800552U - A kind of integrated circuit packaging mould that modularization is replaceable - Google Patents
A kind of integrated circuit packaging mould that modularization is replaceable Download PDFInfo
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- CN207800552U CN207800552U CN201820312388.2U CN201820312388U CN207800552U CN 207800552 U CN207800552 U CN 207800552U CN 201820312388 U CN201820312388 U CN 201820312388U CN 207800552 U CN207800552 U CN 207800552U
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- module
- chip
- replaceable
- modularization
- integrated circuit
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 230000000295 complement effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012942 design verification Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of integrated circuit packaging moulds that modularization is replaceable, encapsulating mould includes the first module and the second module, second module is arranged around first module around first module, and the top surface of first module is higher than second module；First module is corresponding with the cavity area of chip package post package body；Second module is corresponding with region of the packaging body in addition to cavity；First module is replaceable, and the shape of shape cavity corresponding with after chip package is complementary.By replacing the first module, the first different module of size shape can be obtained so that encapsulating mould can be used for various chips.It can be adapted for different size of chip by replacing the second module, packaging cost can be effectively reduced.
Description
Technical field
The utility model is related to the replaceable integrated electricity of technical field of semiconductor chip encapsulation more particularly to a kind of modularization
Road encapsulating mould.
Background technology
Each sensor chip since sensor regions domain sizes and position are different, cause to be required for doing when encapsulation it is a set of therewith
The processing charges of the mold to match, usual plastic package die is all more expensive, and the process-cycle is long, leads to packaging cost in this way
It can increase considerably, the launch period can accordingly increase, can not especially for many small-sized sensor chip Chevron Research Company (CRC)s
Encapsulating mould can be all opened when each proofing chip, for this situation, a kind of versatile mould program be proposed, to be suitable for
The design verification of various chips.
Utility model content
The purpose of this utility model is exactly to solve the above-mentioned problems, to provide a kind of integrated circuit that modularization is replaceable envelope
Die-filling tool can obtain corresponding encapsulating mould for different chips by this mold.
To achieve the goals above, the utility model adopts the following technical solution：
A kind of integrated circuit packaging mould that modularization is replaceable, including the first module and the second module, second mould
Block is arranged around first module around first module, and the top surface of first module is higher than second module；
First module is corresponding with the cavity area of chip package post package body；
Second module is corresponding with region of the packaging body in addition to cavity；
First module is replaceable, and the shape of shape cavity corresponding with after chip package is complementary.
Second module is also replaceable.
The top surface of first module is truncated cone-shaped, cuboid or cube shaped higher than the part of second module.
The beneficial effects of the utility model：
1, by replacing the first module, the first different module of size shape can be obtained so that encapsulating mould can be used for
Various chips.
2, it can be adapted for different size of chip by replacing the second module, packaging cost can be effectively reduced.
Description of the drawings
Fig. 1 (a) is the front elevation of chip 1, and Fig. 1 (b) is the sectional view of chip 1；
Fig. 2 (a) is the front elevation of the encapsulating mould of chip 1, and Fig. 2 (b) is the sectional view of the encapsulating mould of chip 1；
Fig. 3 (a) is the front elevation of chip 2, and Fig. 3 (b) is the sectional view of chip 2；
Fig. 4 (a) is the front elevation of the encapsulating mould of chip 2, and Fig. 4 (b) is the sectional view of the encapsulating mould of chip 2；
Fig. 5 is the packaging body front elevation of chip 1；
Fig. 6 is the packaging body front elevation of chip 2.
Wherein, 1. chip, 1 top sensor zone boundary, 2. chip, 1 top sensor region, 101. chip, 1 packaging body
The first module in corresponding mold, the second module in the corresponding mold of 102. chip, 1 packaging body, 103. chip, 2 packaging body
The first module in corresponding mold, the second module in the corresponding mold of 104. chip, 2 packaging body, 3. chip, 2 top sensing
Device zone boundary, 4. chip, 2 top sensor region.
Specific implementation mode
The utility model is described in further detail with embodiment below in conjunction with the accompanying drawings.
A kind of integrated circuit packaging mould that modularization is replaceable, including the first module and the second module, second mould
Block is arranged around first module around first module, and the top surface of first module is higher than second module；
First module is corresponding with the cavity area of chip package post package body；
Second module is corresponding with region of the packaging body in addition to cavity；
First module is replaceable, and the shape of shape cavity corresponding with after chip package is complementary.
Second module is also replaceable.
First module is directly knocked in the second module by the gap very little of the first module and the second module between the two with copper rod
In.
The top surface of first module is truncated cone-shaped, cuboid or cube shaped higher than the part of second module.
As shown in Fig. 1 (a)-Fig. 1 (b), the middle section of chip 1 is 1 top sensor region 2 of chip, and 1 top of chip passes
Sensor region 2 has 1 top sensor zone boundary 1 of chip.
Similar, shown in Fig. 3 (a)-Fig. 3 (b), the middle section of chip 2 is 2 top sensor region 4 of chip, chip 2
Top sensor region 4 has 2 top sensor zone boundary 3 of chip.
1 top sensor region of chip, 2 size and shape are all different in 2 top sensor region 4 of chip.
As shown in Fig. 2 (a)-Fig. 2 (b), which includes the first module in the corresponding mold of 1 packaging body of chip
The second module 102 in 101 molds corresponding with 1 packaging body of chip, the second module in the corresponding mold of 1 packaging body of chip
102 are centered around around the first module 101 in the corresponding mold of 1 packaging body of chip, in the corresponding mold of 1 packaging body of chip
First module, 101 top surface is higher than the second module 102 in the corresponding mold of 1 packaging body of chip, the corresponding mold of 1 packaging body of chip
In the first module 101 be process according to the shape and size of the encapsulation post package body cavity body of chip 1.
Comparison sees that as shown in Fig. 4 (a)-Fig. 4 (b), which includes in the corresponding mold of 2 packaging body of chip
The second module 104 in first module 103 mold corresponding with 2 packaging body of chip, in the corresponding mold of 2 packaging body of chip
Two modules 104 are centered around around the first module 103 in the corresponding mold of 2 packaging body of chip.The exposed area of chip 2 it is opposite with
Chip 1 it is small, it is only necessary to the first module 103 in the corresponding mold of 2 packaging body of chip is replaced into the corresponding mould of 1 packaging body of chip
The first module 101 in tool keeps the second module 102 in the corresponding mold of 1 packaging body of chip constant, you can forms one newly
Mold, save packaging cost.
A kind of application method for the integrated circuit packaging mould that modularization is replaceable, including：
Step 1：Corresponding cavity geometry after formed chip exposed area encapsulates is obtained, cavity size is measured；
Step 2：The cavity geometry and size obtained according to step 1 is processed, and obtains the first module；
Step 3, obtains the shape and size of formed chip packaging body other parts in addition to cavity, and is processed, and obtains
Second module；
Step 4 processes the first module corresponding with the chip after variation when the geomery of chip changes,
Replace the first original module.
After 1 top exposed region size of chip changes, it is only necessary to after reacquiring the encapsulation of 2 exposed area of formed chip
Corresponding cavity geometry and size, and be designed and process, to obtain the first module.It only needs to replace the first new module
The first module in the corresponding mold of 1 packaging body of chip can realize the encapsulation of chip 2.
Chip 1 is made using above method and 2 encapsulating mould of chip, obtained packaging body finished product are as shown in Figure 5 and Figure 6.
It is above-mentioned although specific embodiments of the present invention are described with reference to the accompanying drawings, but not to this practicality newly
The limitation of type protection domain, those skilled in the art should understand that, based on the technical solution of the present invention, ability
Field technique personnel need not make the creative labor the various modifications or changes that can be made still in the protection model of the utility model
Within enclosing.
Claims (3)
1. a kind of integrated circuit packaging mould that modularization is replaceable, characterized in that described including the first module and the second module
Second module is arranged around first module around first module, and the top surface of first module is higher than described second
Module；
First module is corresponding with the cavity area of chip package post package body；
Second module is corresponding with region of the packaging body in addition to cavity；
First module is replaceable, and the shape of shape cavity corresponding with after chip package is complementary.
2. a kind of integrated circuit packaging mould that modularization is replaceable as described in claim 1, characterized in that second module
Also it is replaceable.
3. a kind of integrated circuit packaging mould that modularization is replaceable as described in claim 1, characterized in that first module
Top surface higher than second module part be truncated cone-shaped, cuboid or cube shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820312388.2U CN207800552U (en) | 2018-03-07 | 2018-03-07 | A kind of integrated circuit packaging mould that modularization is replaceable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820312388.2U CN207800552U (en) | 2018-03-07 | 2018-03-07 | A kind of integrated circuit packaging mould that modularization is replaceable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207800552U true CN207800552U (en) | 2018-08-31 |
Family
ID=63275936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820312388.2U Expired - Fee Related CN207800552U (en) | 2018-03-07 | 2018-03-07 | A kind of integrated circuit packaging mould that modularization is replaceable |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207800552U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231610A (en) * | 2018-03-07 | 2018-06-29 | 山东盛品电子技术有限公司 | A kind of replaceable integrated circuit packaging mould of modularization and application method |
-
2018
- 2018-03-07 CN CN201820312388.2U patent/CN207800552U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231610A (en) * | 2018-03-07 | 2018-06-29 | 山东盛品电子技术有限公司 | A kind of replaceable integrated circuit packaging mould of modularization and application method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180831 |
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| CF01 | Termination of patent right due to non-payment of annual fee |