CN202084532U

CN202084532U - TO92 model encapsulation box and supporting moulds

Info

Publication number: CN202084532U
Application number: CN 201120043729
Authority: CN
Inventors: 周志刚
Original assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Current assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Priority date: 2011-02-22
Filing date: 2011-02-22
Publication date: 2011-12-21
Anticipated expiration: 2021-02-22

Abstract

The utility model relates to a TO92 model encapsulation box and supporting moulds. The TO92 model encapsulation box comprises a lead frame, a pin, connecting pads, positioning holes, a metal lead and a sealed shell, wherein the connecting pads are arranged on a small island of the head of the lead frame; the pin is connected to the downside of the connecting pad through the metal lead; the whole small island is sealed through the sealed shell; on the lead frame, the numbers of the positioning holes and the connecting pads are respectively 60 and 35; the thickness of the lead frame is 0.3mm; the width of the lead frame is 17.1mm; and the sealed shell is hemispheric. The moulds for supporting TO92 encapsulation are correspondingly provided. The number of the moulds is 1,460. Rubber runners of the moulds are narrow. The encapsulation frame and the corresponding mould are improved; each piece of equipment and raw materials for production are fully used; the equipment is better, more quickly and more accurately operated; and more products are produced under the condition of same number.

Description

TO92 model enclosure and matching die

Technical field

The utility model relates to a kind of semiconductor packages of TO92 model, especially relates to the improvement and the matching die of TO92 model enclosure.

Background technology

Semiconductor packages is meant and will obtains the process of individual chips according to the processing of product type functional requirement by the wafer of test; the encapsulation of semiconductor chip is with diced wafer; fasten with glue on the island of lead frame; with the superfine metal lead wiring pad of wafer is connected to the respective pins of substrate again; then; independently wafer is with can close and protect in addition; what model was that the enclosure of the semiconductor packages of TO92 adopts is single 50; 25 is main; thickness is 0.38mm; width is the structure of 23.8mm; and what corresponding supporting mould adopted is that a mould is 1200 a version; like this, on raw-material employing and production efficiency, all be subjected to restriction to a certain degree.Summary of the invention

Technical problem to be solved in the utility model provides a kind of TO92 model enclosure and matching die that can reduce raw material and boost productivity.

The technical scheme in the invention for solving the technical problem is: a kind of model is TO92 model enclosure and matching die, comprise lead frame, pin, connection pad, location hole, metal lead wire and can, in the sky circle of on the island of lead frame head, offering connection pad is housed, the connection pad below is connecting pin with metal lead wire, outside at whole island is sealed with a can, on lead frame, location hole and connection pad are respectively single 60 and 35, and the thickness of lead frame is that 0.3mm, width are 17.1mm.

In order to save raw material, the thickness of described lead frame is that 0.3mm, width are 17.1mm.

For saving under the raw-material situation, can reach the effect of boosting productivity, described lead frame adopts the version of single 60 location holes and 35 connection pads.

Fastening in order to seal, distinguish model, the shape of described can be present hemispheric.

For in conjunction with the production that improves back model TO92, corresponding matching die adopts the version of 1460 of moulds, and mould colloid runner is narrow shape.

After adopting the version of above-mentioned model, each equipment on producing and raw material use have obtained perfect, reduced the wasting of resources, be in a ratio of under the state before improving raw material and can under situation, produce more products in the use with quantity, the production time also corresponding the shortening.

Description of drawings:

Further specify below in conjunction with accompanying drawing with to the utility model.

Fig. 1 is the improvement figure of the utility model structural framing;

Fig. 2 is the left view of the utility model structural framing;

Fig. 3 is the front view behind the utility model plastic packaging;

Fig. 4 is the left view behind the utility model plastic packaging;

Fig. 5 is the front view of can;

1, lead frame 2, pin 3, wafer 31, location hole 32, connection pad 4, metal lead wire 5, can

Embodiment:

The enclosure of Fig. 1, TO92 model shown in Figure 2, comprise lead frame 1, pin 2, connection pad 32, location hole 31, metal lead wire 4, in the sky circle of on the island of lead frame 1 head, offering connection pad 32 is housed, connection pad 32 belows are connecting pin 2 with metal lead wire 4, on lead frame 1, described location hole 31 and connection pad 32 are respectively single 60 and 35, the thickness of described lead frame 1 is that 0.3mm, width are 17.1mm, adopting increases location hole count and connection pad number, and the effect of boosting productivity is arranged on prouctiveness.

After Fig. 3, TO92 model shown in Figure 4 add wafer 3 plastic packagings, can 5 on the enclosure, outside at the whole island of lead frame 1 head is sealed with a can 5, corresponding matching die adopts 1440 of moulds, mould colloid runner adopts narrow shape, its effect is, at the same time between in produce more products, saved more materials.

The hemispheric can 5 of employing shown in Figure 5, its effect are in order to strengthen the sealing of wafer on island, and distinguish the encapsulation model.

The encapsulation of semiconductor chip is the wafer 3 with well cutting; fasten with glue on the island of lead frame 1; be connected to the respective pins 2 of substrate again with superfine metal lead-in wire 4 wiring pads with wafer 3; then; independently wafer is with can 5 close and protect in addition; what model was that the enclosure of the semiconductor packages of TO92 adopts is single 60; 35 is main; thickness is 0.3mm; width is the structure of 17.1mm; and what corresponding supporting mould adopted is that a mould is 1460 a version; mould colloid runner also adopts narrow shape, like this, has obtained perfect on each equipment on producing and raw material use; make the equipment can be better faster more accurate aspect operation, be in a ratio of that raw material in the use can be in production more products under the square one under the state before improving.

All equivalences of being done according to the utility model content change or modify, and all should be encompassed within the protection range of the present utility model.

Claims

1. TO92 model enclosure, comprise lead frame (1), pin (2), connection pad (32), location hole (31), metal lead wire (4) and can (5), connection pad (32) is housed in the sky circle of offering on the island of lead frame (1) head, connection pad (32) below is connecting pin (2) with metal lead wire (4), outside at whole island is sealed with a can (5), it is characterized in that: on lead frame (1), location hole (31) and connection pad (32) are respectively single 60 and 35, and the thickness of lead frame (1) is 0.3mm, width is 17.1mm.

2. TO92 model enclosure according to claim 1 is characterized in that: the shape of described can (5) be present hemispheric.

3. a kind of matching die of corresponding TO 92 model enclosure is characterized in that: the mould of corresponding supporting TO92 encapsulation, a mould is 1460.

4. the matching die of TO92 model enclosure according to claim 3 is characterized in that: mould colloid runner is narrow shape.