CN201893335U - Dual-chip integrated circuit lead frame - Google Patents
Dual-chip integrated circuit lead frame Download PDFInfo
- Publication number
- CN201893335U CN201893335U CN 201020678940 CN201020678940U CN201893335U CN 201893335 U CN201893335 U CN 201893335U CN 201020678940 CN201020678940 CN 201020678940 CN 201020678940 U CN201020678940 U CN 201020678940U CN 201893335 U CN201893335 U CN 201893335U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- pin
- dap
- paddle
- dual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model relates to a dual-chip integrated circuit lead frame, which comprises a Paddle DAP, a small Paddle DAP and pins, wherein a seventh pin and an eighth pin are connected with the Paddle DAP, and at least one locking hole is arranged on the Paddle DAP; and the aperture of each locking hole is 0.7-0.72mm. In the actual production process, since the locking holes are additionally arranged on the Paddle DAP, the bonding force of a plastic-sealed material and the lead frame can be increased, and the layering or cracking of products can be reduced.
Description
Technical field
The utility model relates to a kind of lead frame, is specifically related to a kind of twin-core sheet leads of IC frame.
Background technology
Multicore sheet encapsulation is a unusual hot issue in the market.In the cavity of an integrated circuit, put into more than one chip, can save the application space greatly, make things convenient for the design of complete machine to use.Some device, the technology difference owing to adopting can't realize in a chip in chip manufacturing proces, maybe can't be integrated in the chip.Twin-core sheet encapsulation is exactly to solve the chip of two different manufacturing process to be placed on method in the same circuit.DIP8 twin-core sheet lead frame on present market has many moneys, and during the very big leadframe design of wherein a use amount, 7 pin, 8 pin and Ji Dao connect together, as shown in Figure 1.This lead frame operation product connects together because of 7 pin, 8 pin and Ji Dao, and area is very big, and plastic packaging is when the plastic-sealed body inner frame is stressed in the Trim Molding process, and product is easy to generate layering, even cracking.
Summary of the invention
At above-mentioned problems of the prior art, the purpose of this utility model is to provide a kind of twin-core sheet leads of IC frame, and this lead frame can not produce layering or cracking in the Trim Molding process.
The utility model is the technical scheme that its purpose of realization is taked: a kind of twin-core sheet leads of IC frame, comprise Ji Dao, little Ji Dao and pin, and 7 pin, 8 pin in the described pin link to each other with Ji Dao, establish at least one lock-bit hole on the described Ji Dao.The aperture in described lock-bit hole is 0.7-0.72mm.
The beneficial effects of the utility model: in actual production process,, can increase the adhesion of plastic packaging material and lead frame, reduce product layering or cracking owing to the lock-bit hole that on Ji Dao, increases.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is further specified.
Fig. 1 is DIP8 twin-core sheet lead frame structure figure of the prior art;
Fig. 2 is the utility model structural representation.
Embodiment
Referring to Fig. 1, present embodiment is an example with DIP8 twin-core sheet lead frame, and this lead frame comprises basic island 2, little basic island 3 and pin 1.DIP8 twin-core sheet lead frame contains 8 pins, and wherein 7 pin, 8 pin and basic island 2 link to each other, and establish lock-bit hole 4 on basic island 2.The lock-bit hole can be established 1-3, establishes 2 in this example.The aperture in lock-bit hole is 0.711mm.Owing to the lock-bit hole that on Ji Dao, increases, can increase the adhesion of plastic packaging material and lead frame, reduce the product layering.
Claims (2)
1. a twin-core sheet leads of IC frame comprises Ji Dao, little Ji Dao and pin, and 7 pin, 8 pin in the described pin link to each other with Ji Dao, it is characterized in that: establish at least one lock-bit hole on the described Ji Dao.
2. twin-core sheet leads of IC frame according to claim 1, it is characterized in that: the aperture in described lock-bit hole is 0.7-0.72mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020678940 CN201893335U (en) | 2010-12-24 | 2010-12-24 | Dual-chip integrated circuit lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020678940 CN201893335U (en) | 2010-12-24 | 2010-12-24 | Dual-chip integrated circuit lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201893335U true CN201893335U (en) | 2011-07-06 |
Family
ID=44222805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020678940 Expired - Fee Related CN201893335U (en) | 2010-12-24 | 2010-12-24 | Dual-chip integrated circuit lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201893335U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943593A (en) * | 2014-03-26 | 2014-07-23 | 张轩 | Lead frame with two kinds of chips |
| CN109075151A (en) * | 2016-04-26 | 2018-12-21 | 凌力尔特科技有限责任公司 | The lead frame that mechanical engagement and electrically and thermally for component package circuit conduct |
| US11749576B2 (en) | 2018-03-27 | 2023-09-05 | Analog Devices International Unlimited Company | Stacked circuit package with molded base having laser drilled openings for upper package |
| US11844178B2 (en) | 2020-06-02 | 2023-12-12 | Analog Devices International Unlimited Company | Electronic component |
-
2010
- 2010-12-24 CN CN 201020678940 patent/CN201893335U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943593A (en) * | 2014-03-26 | 2014-07-23 | 张轩 | Lead frame with two kinds of chips |
| CN109075151A (en) * | 2016-04-26 | 2018-12-21 | 凌力尔特科技有限责任公司 | The lead frame that mechanical engagement and electrically and thermally for component package circuit conduct |
| US11749576B2 (en) | 2018-03-27 | 2023-09-05 | Analog Devices International Unlimited Company | Stacked circuit package with molded base having laser drilled openings for upper package |
| US11844178B2 (en) | 2020-06-02 | 2023-12-12 | Analog Devices International Unlimited Company | Electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110706 Termination date: 20141224 |
|
| EXPY | Termination of patent right or utility model |