CN204516746U - The fingerprint sensor package structure of pluggable FPC - Google Patents
The fingerprint sensor package structure of pluggable FPC Download PDFInfo
- Publication number
- CN204516746U CN204516746U CN201520100606.2U CN201520100606U CN204516746U CN 204516746 U CN204516746 U CN 204516746U CN 201520100606 U CN201520100606 U CN 201520100606U CN 204516746 U CN204516746 U CN 204516746U
- Authority
- CN
- China
- Prior art keywords
- fpc
- substrate
- fingerprint sensor
- pluggable
- package structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The utility model relates to the fingerprint sensor package structure of a kind of pluggable FPC, it comprises substrate (8), described substrate (8) front is provided with induction chip (2), be connected by bonding wire (1) between described induction chip (2) front with substrate (8) front, described substrate (8) back side is provided with control chip (5) and FPC socket (7), described induction chip (2) and control chip (5) periphery are encapsulated with plastic packaging material (3), described substrate (8) periphery is provided with becket (9), the base plate of described becket (9) offers FPC socket hole (6), described FPC socket (7) is positioned at FPC socket hole (6).The fingerprint sensor package structure of a kind of pluggable FPC of the utility model, it is by integrated FPC socket on PCB, and realize the corresponding different FPC of a kind of package assembly and connect, FPC socket is integrated in below PCB, and its integrated level improves, and simplifies the assembling flow path of module.
Description
Technical field
The utility model relates to a kind of pluggable FPC(flexible PCB) fingerprint sensor package structure, belong to technical field of semiconductor encapsulation.
Background technology
FPC(flexible PCB after existing fingerprint sensor package) assembling be generally pressure welding or surface mounting technology, fingerprint encapsulation FPC pressure welding or surface mount assembling there is following shortcoming:
1, by PCB and the FPC that pressure welding or surface mount are assembled, its structure one to one, cannot realize a kind of PCB to multiple FPC structure;
2, by PCB and the FPC that pressure welding or surface mount are assembled, complex process, manufacturing cost is high, complex structure, and integrated level is low.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, the fingerprint sensor package structure of a kind of pluggable FPC is provided, it is by integrated FPC socket on PCB, realize the corresponding different FPC of a kind of package assembly to connect, FPC socket is integrated in below the PCB of fingerprint sensor composition, its integrated level improves, and simplifies the assembling flow path of module.
The purpose of this utility model is achieved in that the fingerprint sensor package structure of a kind of pluggable FPC, it comprises substrate, described substrate front side is provided with induction chip and components and parts, described induction chip front is connected by bonding wire with between substrate front side, described substrate back is provided with control chip and FPC socket, described induction chip, components and parts and control chip periphery are encapsulated with plastic packaging material, described substrate peripheral is provided with becket, the base plate of described becket offers FPC socket hole, described FPC socket is positioned at FPC socket hole.
Compared with prior art, the utility model has following beneficial effect:
The fingerprint sensor package structure of a kind of pluggable FPC of the utility model, it is by integrated FPC socket on PCB, and realize the corresponding different FPC of a kind of package assembly and connect, FPC socket is integrated in below the PCB of fingerprint sensor composition, its integrated level improves, and simplifies the assembling flow path of module.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the fingerprint sensor package structure of a kind of pluggable FPC of the utility model.
Wherein:
Bonding wire 1
Induction chip 2
Plastic packaging material 3
Components and parts 4
Control chip 5
FPC socket hole 6
FPC socket 7
Substrate 8
Becket 9.
Embodiment
See Fig. 1, the fingerprint sensor package structure of a kind of pluggable FPC of the utility model, it comprises substrate 8, described substrate 8 front is provided with induction chip 2 and components and parts 4, described induction chip 2 front is connected by bonding wire 1 with between substrate 8 front, described substrate 8 back side is provided with control chip 5 and FPC socket 7, described induction chip 2, components and parts 4 and control chip 5 periphery are encapsulated with plastic packaging material 3, described substrate 8 periphery is provided with becket 9, the base plate of described becket 9 offers FPC socket hole 6, described FPC socket 7 is positioned at FPC socket hole 6.
Claims (2)
1. the fingerprint sensor package structure of a pluggable FPC, it is characterized in that: it comprises substrate (8), described substrate (8) front is provided with induction chip (2), be connected by bonding wire (1) between described induction chip (2) front with substrate (8) front, described substrate (8) back side is provided with control chip (5) and FPC socket (7), described induction chip (2) and control chip (5) periphery are encapsulated with plastic packaging material (3), described substrate (8) periphery is provided with becket (9), the base plate of described becket (9) offers FPC socket hole (6), described FPC socket (7) is positioned at FPC socket hole (6).
2. the fingerprint sensor package structure of a kind of pluggable FPC according to claim 1, is characterized in that: described substrate (8) front is provided with components and parts (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520100606.2U CN204516746U (en) | 2015-02-12 | 2015-02-12 | The fingerprint sensor package structure of pluggable FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520100606.2U CN204516746U (en) | 2015-02-12 | 2015-02-12 | The fingerprint sensor package structure of pluggable FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204516746U true CN204516746U (en) | 2015-07-29 |
Family
ID=53714693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520100606.2U Active CN204516746U (en) | 2015-02-12 | 2015-02-12 | The fingerprint sensor package structure of pluggable FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204516746U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105547950A (en) * | 2016-01-31 | 2016-05-04 | 浙江智源办公设备制造有限公司 | Air quality detector |
| CN106022312A (en) * | 2016-06-15 | 2016-10-12 | 深圳信炜科技有限公司 | Fingerprint sensors and electronic device |
-
2015
- 2015-02-12 CN CN201520100606.2U patent/CN204516746U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105547950A (en) * | 2016-01-31 | 2016-05-04 | 浙江智源办公设备制造有限公司 | Air quality detector |
| CN105547950B (en) * | 2016-01-31 | 2018-08-03 | 浙江智源办公设备制造有限公司 | A kind of air quality detector |
| CN106022312A (en) * | 2016-06-15 | 2016-10-12 | 深圳信炜科技有限公司 | Fingerprint sensors and electronic device |
| WO2017215561A1 (en) * | 2016-06-15 | 2017-12-21 | 深圳信炜科技有限公司 | Fingerprint sensor and electronic device |
| CN106022312B (en) * | 2016-06-15 | 2019-09-27 | 深圳信炜科技有限公司 | Fingerprint sensor and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |