CN203787414U - Small-power paster lead frame member - Google Patents

Small-power paster lead frame member Download PDF

Info

Publication number
CN203787414U
CN203787414U CN201420207911.7U CN201420207911U CN203787414U CN 203787414 U CN203787414 U CN 203787414U CN 201420207911 U CN201420207911 U CN 201420207911U CN 203787414 U CN203787414 U CN 203787414U
Authority
CN
China
Prior art keywords
lead frame
small
chip area
paster
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420207911.7U
Other languages
Chinese (zh)
Inventor
陈孝龙
陈明明
李靖
商岩冰
袁浩旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO HUALONG ELECTRONICS Co.,Ltd.
Original Assignee
TAIZHOU HUALONG ELECTRONIC CO Ltd
NINGBO HUALONG ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAIZHOU HUALONG ELECTRONIC CO Ltd, NINGBO HUALONG ELECTRONICS CO Ltd filed Critical TAIZHOU HUALONG ELECTRONIC CO Ltd
Priority to CN201420207911.7U priority Critical patent/CN203787414U/en
Application granted granted Critical
Publication of CN203787414U publication Critical patent/CN203787414U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

The utility model discloses a small-power paster lead frame member. The small-power paster lead frame member comprises side bands at the upper side and the lower side and lead frame unit bodies (1) arranged in a matrix way. A connection rib (2) is arranged between rows of lead frame unit bodies (1). Each lead frame unit body (1) comprises a paster region (1.1), a positive pin (1.2), two first side pins (1.3) and two second side pins (1.4). The first side pins (1.3) are located at the same side of the paster region (1.1). The positive pin (1.2) is located between the first side pins (1.3) and is connected with the middle part of the paster region (1.1). The second side pins (1.4) are arranged at the other side of the paster region and are symmetric with the first side pins (1.3). Connection projection strips (4) are arranged in the middle of the left end and the right end of the paster region (1.1). After packaging of the product, a molding compound and the lead frame member are combined firmly, the coplanarity is good, and the structure is simple and small.

Description

Small-power paster lead frame part
Technical field
The utility model relates to a kind of semi-conductor discrete device manufacturing technology field, specifically refers to the small-power paster lead frame part of small-power integrated circuit fields application.
Background technology
Along with scientific and technical fast development, semi-conductor discrete device product is widely used in cell phone type consumer electronics, computer and peripheral hardware, network service, a plurality of fields such as Electronic Special Equipment and instrument and meter, automotive electronics, LED display and electrical lighting; Certainly, semi-conductor discrete device profile and performance requirement in different field application are also different, take lead frame of triode as example, in the lead frame of triode of the product such as network service, instrument and meter, LED display, mobile phone application, require that profile is relatively little, thinner thickness; Simultaneously, because the base material thickness of this type of lead frame is thin, size is little, when being applied to such as automotive electronics, chemical industry, the contour vibration of food, high temperature difference and moist bad border, easily because the bond strength of plastic packaging material and lead frame occurs not, plastic packaging material is heaved at lead frame matrix surface, the phenomenon of layering, the coplanarity of its product, firmness and moisture resistant seal decline greatly, have a strong impact on useful life and the job stability of triode product.
Utility model content
The technical problems to be solved in the utility model is, after a kind of encapsulation is provided, plastic packaging material is combined firmly with lead frame cell cube, the small-power paster lead frame part that lead frame part coplanarity is good and simple in structure, small and exquisite, is applicable to the electronic devices and components field that the products such as network service, instrument and meter, LED display, mobile phone are applied.
For solving the problems of the technologies described above, the technical scheme that the utility model provides is: a kind of small-power paster lead frame part, comprise that the sideband on upper and lower both sides and several are the lead frame cell cube that matrix is arranged, between every line lead frame unit body, be provided with the company's muscle connecting for laterally, described lead frame cell cube comprises Chip Area, a positive pin, two the first side pins and two the second side pins; Described the first side pin is positioned at the same side of Chip Area, positive pin is positioned at the centre of the first side pin and is connected with middle part, Chip Area, the second side pin is positioned at the opposite side of Chip Area and symmetrical with the first side pin, and middle part, two ends, left and right, described Chip Area is provided with connection bump bar.
Compared with prior art, the utility model has the advantage of: the utility model small-power paster lead frame part, in each lead frame cell cube, there are five pins, during use, can select arbitrarily as required three pins for connecing lead-in wire, two other pin is for fixing Chip Area, this structural strengthening the stationarity of Chip Area, increased the coplanarity of lead frame part; Middle part, two ends, left and right, Chip Area is provided with connection bump bar, increased the bonded area between plastic packaging material and lead frame cell cube, greatly increased the adhesion of plastic packaging material and lead frame cell cube, can effectively prevent that plastic packaging material from producing slippage with respect to Chip Area, pin, prevent that plastic packaging material from heaving layering at front or the reverse side of Chip Area, the anti-mechanical shock of finished product and heat-resistant anti-fatigue intensity are obviously improved; This product structure is simple, small and exquisite, is widely used in the electronic devices and components field of the product application such as network service, instrument and meter, LED display, mobile phone.
Described lead frame cell cube length is 4~5 millimeters, and wide is 2~3 millimeters; This product structure is simple, small and exquisite.
Between every two row lead frame cell cubes, by longitudinal bond strip, be connected; This structure facilitates cutting.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model small-power paster lead frame part.
Fig. 2 is the A portion structure for amplifying schematic diagram of Fig. 1.
As shown in the figure: 1, lead frame cell cube, 1.1, Chip Area, 1.2, positive pin, the 1.3, first side pin, the 1.4, second side pin, 2, connect muscle, 3, sideband, 4, connection bump bar, 5, longitudinal bond strip.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As depicted in figs. 1 and 2, a kind of small-power paster lead frame part, comprise that the sideband 3 on upper and lower both sides and several are the lead frame cell cube 1 that matrix is arranged, between every line lead frame unit body 1, be provided with the company's muscle 2 connecting for laterally, described lead frame cell cube 1 comprises the positive pin in Chip Area 1.1,1.2, two the first side pins 1.3 and two the second side pins 1.4; Described the first side pin 1.3 is positioned at the same side of Chip Area 1.1, positive pin 1.2 is positioned at the centre of the first side pin 1.3 and is connected with 1.1 middle parts, Chip Area, the second side pin 1.4 be positioned at Chip Area 1.1 opposite side and with the first side pin 1.3 symmetries, 1.1 middle parts, two ends, left and right, described Chip Area are provided with connection bump bar 4.
The described long L of lead frame cell cube 1 is 4~5 millimeters, and wide D is 2~3 millimeters.
Between every two row lead frame cell cubes 1, by longitudinal bond strip 5, be connected.
The bonding welding ends of the first side pin and the second side pin all and gapped between Chip Area, is not directly connected.
Said in specification and claims " upper and lower, left and right " are all reference with the direction shown in accompanying drawing 1,2.

Claims (3)

1. a small-power paster lead frame part, comprise that the sideband (3) on upper and lower both sides and several are the lead frame cell cube (1) that matrix is arranged, between every line lead frame unit body (1), be provided with the company's muscle (2) connecting for laterally, it is characterized in that: described lead frame cell cube (1) comprises Chip Area (1.1), a positive pin (1.2), two the first side pins (1.3) and two the second side pins (1.4); Described the first side pin (1.3) is positioned at the same side of Chip Area (1.1), positive pin (1.2) is positioned at the centre of the first side pin (1.3) and is connected with Chip Area (1.1) middle part, the second side pin (1.4) be positioned at Chip Area (1.1) opposite side and with the first side pin (1.3) symmetry, two ends, left and right, described Chip Area (1.1) middle parts is provided with connection bump bar (4).
2. small-power paster lead frame part according to claim 1, is characterized in that: described lead frame cell cube (1) long (L) is 4~5 millimeters, and wide (D) is 2~3 millimeters.
3. small-power paster lead frame part according to claim 1, is characterized in that: between every two row lead frame cell cubes (1), by longitudinal bond strip (5), be connected.
CN201420207911.7U 2014-04-25 2014-04-25 Small-power paster lead frame member Active CN203787414U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420207911.7U CN203787414U (en) 2014-04-25 2014-04-25 Small-power paster lead frame member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420207911.7U CN203787414U (en) 2014-04-25 2014-04-25 Small-power paster lead frame member

Publications (1)

Publication Number Publication Date
CN203787414U true CN203787414U (en) 2014-08-20

Family

ID=51323571

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420207911.7U Active CN203787414U (en) 2014-04-25 2014-04-25 Small-power paster lead frame member

Country Status (1)

Country Link
CN (1) CN203787414U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106409806A (en) * 2016-12-06 2017-02-15 四川富美达微电子有限公司 IC lead bracket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106409806A (en) * 2016-12-06 2017-02-15 四川富美达微电子有限公司 IC lead bracket

Similar Documents

Publication Publication Date Title
CN203787414U (en) Small-power paster lead frame member
CN203983260U (en) A kind of project organization of the IC device based on QFN, QFP or SOP encapsulation technology
CN203760460U (en) Integrated circuit lead frame board
CN202905705U (en) High-density-arrangement low-power integrated circuit lead frame member
CN202977380U (en) Line type pressure welding clamp used for QFN, DFN integrated circuit packaging
CN202332836U (en) Multi-positioned integrated circuit lead frame plate
CN203617344U (en) Surface mount type LED lead frame
CN102339404A (en) Novel intelligent card module and productive technology thereof
CN204516746U (en) The fingerprint sensor package structure of pluggable FPC
CN203826370U (en) Lead framework for small power device
CN202153516U (en) Dual enhanced integrated circuit lead frame plate
CN203871319U (en) Novel lead frame of chip mounting power device
CN201584405U (en) Lead frame piece of integrated circuit of thansistor
CN202434503U (en) DIP10 integrated circuit device and lead frame, and lead frame matrix
CN201181700Y (en) Wire frame and electric connecting structure
CN204029816U (en) A kind of chip diode
CN204558455U (en) Lead frame structure and chip architecture
CN103700757A (en) Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof
CN203746833U (en) Signal lead for welding used in power semiconductor package
CN201853696U (en) Lead wire frame body for triodes which are arrayed and combined densely and compactly
CN201549494U (en) High-frequency triode lead frame component
CN203826425U (en) Metallic material band, LED support, LED support structure and LED lamp
CN210224022U (en) Integrated chip and integrated frame thereof
CN201584407U (en) Dual-diode lead frame piece
CN203839407U (en) Paster type diode

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20200608

Address after: 315000 No. 68 Changcao Road, Dongqianhu Industrial Zone, Ningbo City, Zhejiang Province

Patentee after: NINGBO HUALONG ELECTRONICS Co.,Ltd.

Address before: 315124 Zhejiang city in Ningbo province Dongqian Lake resort Jiuzhai Village Industrial Park

Co-patentee before: TAIZHOU HUALONG ELECTRONIC Co.,Ltd.

Patentee before: NINGBO HUALONG ELECTRONICS Co.,Ltd.