CN202120901U - Impermeable anticracking direct inserting type triode lead framework board - Google Patents
Impermeable anticracking direct inserting type triode lead framework board Download PDFInfo
- Publication number
- CN202120901U CN202120901U CN201120295997XU CN201120295997U CN202120901U CN 202120901 U CN202120901 U CN 202120901U CN 201120295997X U CN201120295997X U CN 201120295997XU CN 201120295997 U CN201120295997 U CN 201120295997U CN 202120901 U CN202120901 U CN 202120901U
- Authority
- CN
- China
- Prior art keywords
- triode
- anticracking
- pin
- impermeable
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses an impermeable anticracking direct inserting type triode lead framework board, which overcomes the defects that the current similar products are easy to crack after vibration and impact, and a damp short circuit can be caused. The triode lead wire framework broad comprises a lead framework, the bottom sidebands of which are transversely and continuously arranged, wherein the lead framework is provided with a chip zone for bearing a triode tube core, an intermediate pin and two side pins, the intermediate pin is connected with the chip zone, connecting sheets are arranged between the side pins and the intermediate pin, a rectangular groove is arranged in a central area of the chip zone, the cross section of the groove is a triangle, two side edges of the chip zone are provided with acute angle and right angle recessed benches, and a root welding zone edge of each side pin is provided with a notch. Compared with the traditional products, the triode lead framework board has an improved impermeable performance, an improved anticracking performance and an improved moistureproof performance, is useful for improving service life and work stability of crystal triode products, and is particularly suitable for matching application of miniature and thin type electronic products.
Description
Technical field
The utility model relates to the manufacturing technology field of semiconductor electronic components and parts, especially refers to a kind of antiseepage anticracking structure of SMD lead frame of triode.
Background technology
Transistor is the extremely wide electronic devices and components of a kind of range of application, and it is used for all kinds of electric fields such as electricity-saving lamp, charger, power transmission and transformation, Switching Power Supply, household electrical appliance and automotive electronics in a large number; Particularly occurred in succession on the market in recent years such as various informative telecommunications and 3G network products such as iphone, ipad, brought new fast happy enjoyment to people's life.But the industry personage also finds, because the miniaturization just day by day of transistor components and parts, slimming situation that numerous areas is used, so also miniaturization day by day, slimming of the leadframe parts that matches with it; In the past, this series products improves the bond strength of envelope material through suppress the pit mode at the matrix back side, but limited by packaging technology, can only suppress pit overleaf, so double-edged strength character differs greatly; The people was arranged afterwards through the adhesion that step ledge improves matrix and plastics envelope material is set at the matrix side; But still can't eradicate the envelope material disadvantage of slippage up and down fully; So series products is after using a period of time; Lamination happens occasionally, and very easily causes make moist short trouble and can't operate as normal of discrete device.Under the situation about further dwindle in profile, thickness further reducing; How to strengthen plastic packaging material and lead frame matrix bond firmness, stop plastic packaging material and heave cracking, strengthen the waterproof sealing performance, become the important leverage of guaranteeing microelectronics communication product reliability and useful life.
The utility model content
The technical problem that the utility model will solve is that the lead frame matrix and the plastic packaging material binding site that overcome existing like product existence are vibrated and impact back easy to crack; Thereby have a strong impact on barrier performance, cause the defective and the deficiency of the short circuit of making moist; Provide a kind of lead frame matrix to combine SMD lead frame of triode product firm, the antiseepage anticracking with the envelope material to society, satisfy the transistor components and parts of miniaturization, the application of slimming microelectronic and make required.
The utility model solves the technical scheme that its technical problem adopted: the direct insertion lead frame of triode version of antiseepage anticracking; Comprise the lead frame of laterally arranging continuously by the bottom sideband; Said lead frame is provided with chip region, middle pin and two the side pins that carry triode core, and said middle pin is connected with said chip region; Being provided with brace between said side pin and the middle pin is connected; Said chip region central area is provided with the groove of rectangle, and the cross section of said groove is a triangle; The both sides of the edge of said chip region are provided with acute angle and right angle concave station.The root welding zone edge of said side pin is provided with cutting.
After the direct insertion lead frame of triode version of the utility model antiseepage anticracking is packaged into the triode finished product; Plastic packaging material is filled and is coated in the acute angle and concave station zone, right angle of chip region both sides of the edge; Thereby increased both bonded areas greatly, and prevented that effectively tube core from producing horizontal slippage with respect to chip region; In view of same reason; Plastic packaging material after the encapsulation is filled in rectangle groove and multiple tracks cutting inner chamber respectively; Not only increased the bonded area of plastic packaging material and matrix; Prevent plastic packaging material and lead frame matrix delamination splitting, and can improve antiseepage, humidity resistance greatly, finally help improving the useful life and the job stability of transistor product.Be particularly conducive to supporting application small-sized, slim electronic product.
Description of drawings
Fig. 1 is the utility model product structure sketch map.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is that the A-A of Fig. 1 is to the structure for amplifying sketch map.
Fig. 4 is the B portion structure for amplifying sketch map of Fig. 2.
Embodiment
As shown in Figure 1, the direct insertion lead frame of triode version of the utility model antiseepage anticracking comprises the lead frame of laterally being arranged continuously by bottom sideband 21, and said lead frame 1 is provided with chip region 6, middle pin 4 and two the side pins 3 that carry triode core; Pin 4 is connected with said chip region 6 in the middle of said; Be provided with brace 5 and said sideband 2 corresponding connections between said side pin 3 and the middle pin 4.
As shown in figures 1 and 3, said chip region 6 central areas are provided with the groove 8 of rectangle, and the both sides of the edge of said chip region 6 are provided with acute angle 9 nibs and right angle concave station 10; The cross section of said groove 8 is a triangle.
Like Fig. 2 and shown in Figure 4, root welding zone 7 edges of said side pin 3 are provided with cutting 11; Said cutting 11 can be together, also can be multiple tracks.
Continue to combine accompanying drawing below, the operation principle of summary the utility model product.After using the encapsulation of this product, plastic packaging material is filled and is coated in acute angle 9 nibs and right angle concave station 10 zones of chip region 6 both sides of the edge, thereby has increased both bonded areas greatly, and has prevented that effectively tube core from producing horizontal slippage with respect to chip region 6; In view of same reason; Plastic packaging material after the encapsulation is filled in rectangle groove 8 and multiple tracks cutting 11 inner chambers respectively; Not only increased the bonded area of plastic packaging material and matrix; Prevent plastic packaging material and lead frame matrix delamination splitting, and can improve antiseepage, humidity resistance greatly, finally help improving the useful life and the job stability of transistor product.
Claims (2)
1. the direct insertion lead frame of triode version of an antiseepage anticracking; Comprise the lead frame of laterally arranging continuously by bottom sideband (2) (1); Said lead frame (1) is provided with chip region (6), middle pin (4) and two the side pins (3) that carry triode core, and said middle pin (4) is connected with said chip region (6); Being provided with brace (5) between said side pin (3) and the middle pin (4) is connected; It is characterized in that: said chip region (6) central area is provided with the groove (8) of rectangle, and the cross section of said groove (8) is a triangle; The both sides of the edge of said chip region (6) are provided with acute angle (9) nib and right angle concave station (10).
2. the direct insertion lead frame of triode version of antiseepage anticracking according to claim 1, it is characterized in that: root welding zone (7) edge of said side pin (3) is provided with cutting (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120295997XU CN202120901U (en) | 2011-08-12 | 2011-08-12 | Impermeable anticracking direct inserting type triode lead framework board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120295997XU CN202120901U (en) | 2011-08-12 | 2011-08-12 | Impermeable anticracking direct inserting type triode lead framework board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202120901U true CN202120901U (en) | 2012-01-18 |
Family
ID=45461942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120295997XU Expired - Lifetime CN202120901U (en) | 2011-08-12 | 2011-08-12 | Impermeable anticracking direct inserting type triode lead framework board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202120901U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
-
2011
- 2011-08-12 CN CN201120295997XU patent/CN202120901U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200620587A (en) | Package structure with embedded chip and method for fabricating the same | |
| WO2014060355A3 (en) | Method for producing a multiplicity of optoelectronic semiconductor components | |
| RU2009138474A (en) | TOUCH PANEL AND METHOD FOR ITS PRODUCTION | |
| CN103985692A (en) | Encapsulating structure for AC-DC power circuit and encapsulating method thereof | |
| CN201215803Y (en) | Double-row double-column transistor lead frame plate piece | |
| CN201150132Y (en) | PCB flexible plate integrated encapsulation silicon microphone | |
| CN202120901U (en) | Impermeable anticracking direct inserting type triode lead framework board | |
| WO2006138492A3 (en) | Post & penetration interconnection | |
| CN202332836U (en) | Multi-positioned integrated circuit lead frame plate | |
| CN209487524U (en) | Photovoltaic module | |
| CN202153516U (en) | Dual enhanced integrated circuit lead frame plate | |
| CN203760460U (en) | Integrated circuit lead frame board | |
| CN201829490U (en) | Chip area punching integrated circuit lead frame | |
| CN202678303U (en) | Lead frame | |
| CN109545759A (en) | A kind of power module architectures and its manufacturing method | |
| CN203774321U (en) | Duodiode packaging structure applied in SOT23 semiconductor | |
| CN103296153A (en) | Encapsulating method for LED chips | |
| CN203617344U (en) | Surface mount type LED lead frame | |
| CN203536411U (en) | Semiconductor packaging structure | |
| CN203260633U (en) | LED package structure requiring no welding line | |
| CN206003767U (en) | A kind of Ultrathin packaging device | |
| CN106079627B (en) | A kind of preparation method of demixing plate | |
| CN203690342U (en) | Outdoor SMD full color LED lamp bead | |
| CN204271072U (en) | Lead-frame packages structure | |
| CN203787414U (en) | Small-power paster lead frame member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120118 |
|
| CX01 | Expiry of patent term |