CN103646940A - TO-220 waterproof sealing lead frame - Google Patents
TO-220 waterproof sealing lead frame Download PDFInfo
- Publication number
- CN103646940A CN103646940A CN201310671975.2A CN201310671975A CN103646940A CN 103646940 A CN103646940 A CN 103646940A CN 201310671975 A CN201310671975 A CN 201310671975A CN 103646940 A CN103646940 A CN 103646940A
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- waterproof
- groove
- waterproof sealing
- sealing groove
- slide holder
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Abstract
The invention relates to a TO-220 waterproof sealing lead frame which comprises a chip carrier platform. One end of the chip carrier platform is connected with a heat radiation piece which is provided with a mounting hole, and the other end of the chip carrier platform is provided with a frame lead welded part. The top of the chip carrier platform is provided with a first waterproof sealing groove, the left side of the chip carrier platform is provided with a second waterproof sealing groove, and the right side of the chip carrier platform is provided with a third waterproof sealing groove. A connection part is arranged between the chip carrier platform and the heat radiation piece. The connection part is provided with a waterproof groove with the width of 0.7 mm to 0.9mm, and the center of the bottom of the waterproof groove is provided with a dovetail groove. The upper surface of the bottom of the dovetail groove is uniformly provided with concave and convex structures. The bottom of the chip carrier platform is provided with a pin. A fourth waterproof sealing groove is arranged at connection part of the pin and the frame lead welded part. The TO-220 waterproof sealing lead frame has the advantages of good air tightness and strong shock resistance.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to a kind of TO-220 waterproof sealed lead wire frame.
Background technology
In adopting the process of lead-frame packages semiconductor device, after being placed on the chip section of lead frame, chip needs to carry out plastic packaging, in order to make the semiconductor device after plastic packaging there is stronger air-tightness, current lead frame offers groove at the edge of chip section conventionally, and be provided with seal groove in groove inner side, groove and seal groove the bond strength that can strengthen lead frame and plastic packaging material is set, thereby make semiconductor device there is certain air-tightness.But the lead frame that changes profile generally designing at present, the surface of capillary groove is smooth plane, the adhesion of plastic packaging material and lead frame is insecure, air-tightness is good not, in operations such as immersion, plating and Trim Moldings, maintain and do not there is better anti-impact force, can not effectively guarantee the reliability of product.
Summary of the invention
In view of the above-mentioned problems in the prior art, the object of the invention is to address the deficiencies of the prior art, the TO-220 that a kind of waterproof sealing is good and anti-impact force is strong waterproof sealed lead wire frame is provided.
The invention provides a kind of TO-220 waterproof sealed lead wire frame, comprise chip slide holder, one end of described chip slide holder is connected with fin, on described fin, be provided with installing hole, the other end is provided with support lead weld part, the top of described chip slide holder is provided with the first waterproof sealing groove, the left side of described chip slide holder is provided with the second waterproof sealing groove, the right side of described chip slide holder is provided with the 3rd waterproof sealing groove, between described chip slide holder and described fin, be provided with connecting portion, on described connecting portion, being provided with width is the waterproof groove of 0.7～0.9mm, the bottom centre of described waterproof groove is provided with dove-tail form groove, the upper base surface of described dove-tail form groove is evenly set to concaveconvex structure, the bottom of described chip slide holder is provided with pin, the junction of described pin and described support lead weld part is provided with the 4th waterproof sealing groove.
Further, described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove form the waterproof construction of a sealing.
Further, the width of described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove is 0.10～0.16mm.
Further, the width of described waterproof groove is 0.8mm, and the degree of depth of described waterproof groove is 0.3mm.
Further, the degree of depth of described dove-tail form groove is 0.15mm.
Further, described for concaveconvex structure is wavy shaped configuration, in order to increase the area of described dove-tail form trench bottom upper surface.
Further, the width of described the 4th waterproof sealing groove is 0.06～0.10mm.
The advantage that the present invention has and beneficial effect are: the TO-220 waterproof sealed lead wire frame of the present embodiment is provided with the first waterproof sealing groove, the second waterproof sealing groove, the 3rd waterproof sealing groove and the 4th waterproof sealing groove, makes the air-tightness of this lead frame more excellent; Between described chip slide holder and described fin, be provided with connecting portion simultaneously, on described connecting portion, being provided with width is the waterproof groove of 0.7～0.9mm, the bottom centre of described waterproof groove is provided with dove-tail form groove, the upper base surface of described dove-tail form groove is evenly set to concaveconvex structure, strengthen the contact area of plastic packaging material and this TO-220 waterproof sealed lead wire frame, improved the impact resistance of this TO-220 waterproof sealed lead wire frame.
Accompanying drawing explanation
Fig. 1 is the structural representation of the TO-220 waterproof sealed lead wire frame of the present embodiment;
Fig. 2 is that the A-A of Fig. 1 cuts open structural representation enlarged drawing;
Fig. 3 is that the B-B of Fig. 1 cuts open structural representation enlarged drawing.
Embodiment
The present invention is further illustrated with specific embodiment below with reference to accompanying drawings.
As Fig. 1, shown in Fig. 2 and Fig. 3: a kind of TO-220 waterproof sealed lead wire frame of the embodiment of the present invention comprises a plurality of separate units 1, each separate unit 1 comprises chip slide holder 106, one end of described chip slide holder 106 is connected with fin 100, on described fin 100, be provided with installing hole 101, the other end is provided with support lead weld part 107, the top of described chip slide holder 106 is provided with the first waterproof sealing groove 103, the left side of described chip slide holder 106 is provided with the second waterproof sealing groove 105, the right side of described chip slide holder 106 is provided with the 3rd waterproof sealing groove 104, between described chip slide holder 106 and described fin 100, be provided with connecting portion, on described connecting portion 102, being provided with width is the waterproof groove 1021 of 0.7～0.9mm, the bottom centre of described waterproof groove 1021 is provided with dove-tail form groove 1022, the upper base surface of described dove-tail form groove 1022 is evenly set to concaveconvex structure, the bottom of described chip slide holder 106 is provided with pin one 09, described pin one 09 is provided with the 4th waterproof sealing groove 108 with the junction of described support lead weld part 107, described the first waterproof sealing groove 103, described the second waterproof sealing groove 105, the setting of described the 3rd waterproof sealing groove 104 and described the 4th waterproof sealing groove 108 makes the air-tightness of described TO-220 waterproof sealed lead wire frame better, reach the object of more excellent water resistance.
Preferred implementation as above-described embodiment, described the first waterproof sealing groove 103, described the second waterproof sealing groove 105 and described the 3rd waterproof sealing groove 104 form the waterproof construction of a sealing, the water resistance of chip slide holder 106 is got a promotion, and setting is more safe and reliable with the chip on it.
As the preferred implementation of above-described embodiment, the width of described the first waterproof sealing groove 103, described the second waterproof sealing groove 105 and described the 3rd waterproof sealing groove 104 is 0.10～0.16mm.
As the preferred implementation of above-described embodiment, the width of described waterproof groove 1021 is 0.8mm, and the degree of depth of described waterproof groove 1021 is 0.3mm.
As the preferred implementation of above-described embodiment, the degree of depth of described dove-tail form groove 1022 is 0.15mm.
Preferred implementation as above-described embodiment, described for concaveconvex structure be wavy shaped configuration, in order to increase the area of described dove-tail form groove 1022 upper base surface, to increase the contact area of plastic packaging material and described dove-tail form groove 1022, the snap close coupling mechanism force forming be thus intrinsic 3-5 doubly, so the adhesion of plastic packaging material and framework is better when encapsulation, air-tightness is better, in operations such as immersion, plating, Trim Moldings, maintain better anti-impact force, can effectively guarantee the reliability of product.
As the preferred implementation of above-described embodiment, the width of described the 4th waterproof sealing groove 108 is 0.06～0.10mm.
Finally it should be noted that: above-described each embodiment, only for technical scheme of the present invention is described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record previous embodiment is modified, or to wherein partly or entirely technical characterictic be equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (7)
1. a TO-220 waterproof sealed lead wire frame, comprise chip slide holder, one end of described chip slide holder is connected with fin, on described fin, be provided with installing hole, the other end is provided with support lead weld part, it is characterized in that: the top of described chip slide holder is provided with the first waterproof sealing groove, the left side of described chip slide holder is provided with the second waterproof sealing groove, the right side of described chip slide holder is provided with the 3rd waterproof sealing groove, between described chip slide holder and described fin, be provided with connecting portion, on described connecting portion, being provided with width is the waterproof groove of 0.7～0.9mm, the bottom centre of described waterproof groove is provided with dove-tail form groove, the upper base surface of described dove-tail form groove is evenly set to concaveconvex structure, the bottom of described chip slide holder is provided with pin, the junction of described pin and described support lead weld part is provided with the 4th waterproof sealing groove.
2. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove form the waterproof construction of a sealing.
3. TO-220 waterproof sealed lead wire frame according to claim 2, is characterized in that, the width of described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove is 0.10～0.16mm.
4. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, the width of described waterproof groove is 0.8mm, and the degree of depth of described waterproof groove is 0.3mm.
5. TO-220 waterproof sealed lead wire frame according to claim 3, is characterized in that, the degree of depth of described dove-tail form groove is 0.15mm.
6. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, described for concaveconvex structure is wavy shaped configuration, in order to increase the area of described dove-tail form trench bottom upper surface.
7. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, the width of described the 4th waterproof sealing groove is 0.06～0.10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310671975.2A CN103646940A (en) | 2013-12-12 | 2013-12-12 | TO-220 waterproof sealing lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310671975.2A CN103646940A (en) | 2013-12-12 | 2013-12-12 | TO-220 waterproof sealing lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103646940A true CN103646940A (en) | 2014-03-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310671975.2A Pending CN103646940A (en) | 2013-12-12 | 2013-12-12 | TO-220 waterproof sealing lead frame |
Country Status (1)
| Country | Link |
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| CN (1) | CN103646940A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
| CN108807326A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of improved overloading type 3PF lead frames |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732658A (en) * | 1980-08-05 | 1982-02-22 | Nec Corp | Resin sealing type semiconductor device with radiator plate |
| US6114750A (en) * | 1996-10-01 | 2000-09-05 | International Rectifier Corp. | Surface mount TO-220 package and process for the manufacture thereof |
| CN201549496U (en) * | 2009-12-22 | 2010-08-11 | 宁波华龙电子股份有限公司 | High-power patch-type lead frame |
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
| CN201853698U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Short-pin triode lead frame |
| CN102184907A (en) * | 2011-04-19 | 2011-09-14 | 无锡红光微电子有限公司 | To3p waterproof sealing lead frame |
| CN202094114U (en) * | 2011-01-28 | 2011-12-28 | 四川立泰电子有限公司 | Enhancement type high-reliability anti-penetration lead frame |
| CN202120901U (en) * | 2011-08-12 | 2012-01-18 | 宁波华龙电子股份有限公司 | Impermeable anticracking direct inserting type triode lead framework board |
| CN202384322U (en) * | 2011-12-21 | 2012-08-15 | 福建福顺半导体制造有限公司 | Large-current transistor packaging structure |
| CN202977409U (en) * | 2012-12-13 | 2013-06-05 | 深圳深爱半导体股份有限公司 | Waterproof lead frame |
| CN203085518U (en) * | 2013-01-14 | 2013-07-24 | 无锡市玉祁红光电子有限公司 | A leading wire frame |
| CN203733781U (en) * | 2013-12-12 | 2014-07-23 | 南通华隆微电子有限公司 | TO-220 waterproof seal lead frame |
-
2013
- 2013-12-12 CN CN201310671975.2A patent/CN103646940A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732658A (en) * | 1980-08-05 | 1982-02-22 | Nec Corp | Resin sealing type semiconductor device with radiator plate |
| US6114750A (en) * | 1996-10-01 | 2000-09-05 | International Rectifier Corp. | Surface mount TO-220 package and process for the manufacture thereof |
| CN201549496U (en) * | 2009-12-22 | 2010-08-11 | 宁波华龙电子股份有限公司 | High-power patch-type lead frame |
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
| CN201853698U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Short-pin triode lead frame |
| CN202094114U (en) * | 2011-01-28 | 2011-12-28 | 四川立泰电子有限公司 | Enhancement type high-reliability anti-penetration lead frame |
| CN102184907A (en) * | 2011-04-19 | 2011-09-14 | 无锡红光微电子有限公司 | To3p waterproof sealing lead frame |
| CN202120901U (en) * | 2011-08-12 | 2012-01-18 | 宁波华龙电子股份有限公司 | Impermeable anticracking direct inserting type triode lead framework board |
| CN202384322U (en) * | 2011-12-21 | 2012-08-15 | 福建福顺半导体制造有限公司 | Large-current transistor packaging structure |
| CN202977409U (en) * | 2012-12-13 | 2013-06-05 | 深圳深爱半导体股份有限公司 | Waterproof lead frame |
| CN203085518U (en) * | 2013-01-14 | 2013-07-24 | 无锡市玉祁红光电子有限公司 | A leading wire frame |
| CN203733781U (en) * | 2013-12-12 | 2014-07-23 | 南通华隆微电子有限公司 | TO-220 waterproof seal lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
| CN108807326A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of improved overloading type 3PF lead frames |
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Application publication date: 20140319 |
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