CN103137593A - Lead frame for packaging integrated circuit and corresponding packaging components - Google Patents
Lead frame for packaging integrated circuit and corresponding packaging components Download PDFInfo
- Publication number
- CN103137593A CN103137593A CN2011103946670A CN201110394667A CN103137593A CN 103137593 A CN103137593 A CN 103137593A CN 2011103946670 A CN2011103946670 A CN 2011103946670A CN 201110394667 A CN201110394667 A CN 201110394667A CN 103137593 A CN103137593 A CN 103137593A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- island
- pins
- crystal oscillator
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention provides a lead frame for packaging an integrated circuit. The lead frame comprises a small island, a plurality of pins around the small island, and connecting ribs extending out of the small island. The lead frame is characterized in that two pins in the plurality of pins are provided with widened parts, and end portions of the connecting ribs form bifurcate structures. The lead frame can be used for packaging a chip and a crystal oscillator in a packaging body.
Description
Technical field
The present invention relates to chip encapsulation technology, relate in particular to the technology that chip and crystal oscillator is encapsulated in a packaging body.
Background technology
People to electronic equipment frivolous little pursuit make industry to device blocksization in other words integrated level have higher requirement.Except the continuous chip package process that improves makes the device after encapsulation thinner and little, more device packages being formed laminate packaging (package on package) according to circuit function in a plastic-sealed body is also one of means of reaching above-mentioned purpose, and it is an example that chip and crystal oscillator are encapsulated in a plastic-sealed body.
Conventional integrated circuit only encapsulates one or more chips in a plastic-sealed body, seldom chip and crystal oscillator is packaged together, and this is mainly that conventional lead frame can't satisfy the demands because the three-dimensional volume that crystal oscillator occupies when encapsulation is larger.Fig. 1 is the structural representation of little outline packages (SOP) lead frame with 8 pins of routine.As shown in the figure, this lead frame comprises island 120, is arranged on island 8 interior pins 111～118 on every side, and wherein island 120 is to form by beating recessed technique.If do not consider the volume of crystal oscillator, utilize lead frame illustrated in Figure 1 with chip and the crystal oscillator still existing problems that are packaged together, existing in conjunction with Fig. 2 explanation.Fig. 2 is the cross section structure signal when utilizing lead frame illustrated in Figure 1 to encapsulate simultaneously crystal oscillator and chip.As figure, semiconductor chip 40 is placed in the below of island 120, and crystal oscillator 50 is placed in the top of island 120.Carry out the bonding routing and namely form lead-in wire 60 between chip 40 and pin 110.In this structure, lead-in wire 60 middle part is easy to contact with the edge 1201 of island 120, thereby causes the short circuit inefficacy or produce the problem of other reliability.Because the difference in height between pin 110 and chip 40 is larger, the problem that the middle part of lead-in wire contacts with the edge of island more easily occurs in the transverse width of island 120 wider the time.
China patent CN200920286409.9 discloses a kind of lead frame that can be encapsulated in chip 40 and crystal oscillator 50 in a plastic-sealed body and can avoid the problems referred to above.
Summary of the invention
In view of this, the invention provides a kind of lead frame for integrated antenna package, comprise island, be looped around around island some pins and from the extended dowel of described island, it is characterized in that, on two pins in described some pins, be provided with those widened sections, the end of described dowel forms bifurcation structure.
Preferably, described lead frame is used for packaged chip and crystal oscillator simultaneously, the first surface of described island is used for arranging chip, the second surface relative with described first surface is used for arranging crystal oscillator, the all or part of bonding of described chip and described some pins, described crystal oscillator and two pin bondings that are provided with described those widened sections.
The present invention also provides a kind of array of leadframes for integrated antenna package, described array is comprised of a plurality of lead frames, described lead frame comprises island, be looped around around island some pins and from the extended dowel of described island, wherein, on two pins in described some pins, be provided with those widened sections, the end of described dowel forms bifurcation structure.
Preferably, described lead frame is used for packaged chip and crystal oscillator simultaneously, the first surface of described island is used for arranging chip, the second surface relative with described first surface is used for arranging crystal oscillator, the all or part of bonding of described chip and described some pins, described crystal oscillator and two pin bondings that are provided with described those widened sections.
Preferably, be formed with some circular grooves on the muscle line cutting of described dowel.
The present invention also provides a kind of packaging, described packaging comprises lead frame, chip, crystal oscillator and the packaging body that is complementary with described lead frame, wherein, described lead frame comprises island, be looped around around island some pins and from the extended dowel of described island, on two pins in described some pins, be provided with those widened sections, the end of described dowel forms bifurcation structure, described chip is arranged on the first surface of described island, and described crystal oscillator is arranged on the second surface relative with the first surface of described island.
Preferably, all or part of bonding of described chip and described some pins, described crystal oscillator and two pin bondings that are provided with described those widened sections.
Lead frame of the present invention, it can weld crystal oscillator and chip simultaneously.In addition, due to the pin of crystal oscillator bonding on want at least the part of bonding crystal oscillator to be broadened, therefore guaranteed the reliability of crystal oscillator welding.
Description of drawings
Fig. 1 is the structural representation of little outline packages (SOP) lead frame with 8 pins of routine.
Fig. 2 is the cross section structure signal when utilizing lead frame illustrated in Figure 1 to encapsulate simultaneously crystal oscillator and chip.
Fig. 3 is the schematic diagram of the lead frame of integrated circuit package structure according to an illustrative embodiment of the invention.
Fig. 4 is that the lead frame shown in Fig. 3 comprises interior pin 307 and 308 and the partial schematic diagram of the A part of the second end 321 of dowel.
Fig. 5 is provided with the schematic diagram of crystal oscillator and chip on lead frame shown in Figure 3, its chips does not illustrate.
Fig. 6 is the schematic diagram according to the array of leadframes that is formed by lead frame of the present invention.
Embodiment
Further set forth the present invention below with reference to accompanying drawing.Accompanying drawing only is signal, not in order to limit wherein concrete shape and the size of each parts.
Explanation is in advance, although following explanation describes as an example of the lead frame of plane frame structure example, not as restriction.In practical application, the present invention also can be applicable to the on-plane surface frame structure.At this, term " plane frame structure " refers to island, interior pin and dowel in the lead frame structure on same plane.
Fig. 3 is the schematic diagram of the lead frame that is used for integrated antenna package of an example shape embodiment according to the present invention.This lead frame 3 comprises island 30, is arranged on island 30 some interior pin on every side, and dowel 32.In this example, lead frame 3 comprises 16 interior pins, is respectively 300,301,302,303,304,305,306,307,308,309,3010,3011,3012,3013,3014 and 3015.In practical application, the quantity of interior pin is as limit, can be 8 or 24 etc.Dowel 32 is respectively first end 320 and the second end 321 in the part of island 30 both sides.According to the present embodiment, first end 320 and the second end 321 stretch out from island 30 respectively, and at distance island 30 a distance formation bifurcation structures, this bifurcation structure can be for example herringbone structure.
According to the present invention, be used for the interior pin of bonding crystal oscillator, its part that is used for bonding chip arranges widelyr to the major general, more surplus can be arranged when guaranteeing follow-up crystal oscillator welding.In the present embodiment, exemplarily, with pin 307 and 308 bonding crystal oscillators, and extend extension 3071 from pin 307, extend extension 3081 from pin 308, make the part of pin 307 and 308 bonding crystal oscillators widen.
As shown in Figure 3, carry out plastic packaging when processing after the different surfaces that chip and crystal oscillator is installed to island, can be with plastic packaging material from the first opening 320a of the herringbone structure of the first end 320 of dowel with the second opening 320b pours into and/or pour into from the first opening 321a and the second opening 321b of the herringbone structure of the second end 321 of dowel.
Carried out after plastic packaging processes, can downcut along cutting the chip that muscle line 34 will encapsulate.In the exemplary embodiment, along plastic-sealed body cut muscle line 34(that is, pull apart part when cutting off dowel on the plastic-sealed body exposed parts), a plurality of small cylindrical tanks 400 can be set, damage with the resinite that weakens or plastic packaging is formed when avoiding follow-up cut-out dowel (that is, plastic-sealed body).In this example, can on dowel 32, small cylindrical tank be set along cutting muscle line 34, can on interior pin 307 and 308, small cylindrical tank be set along cutting muscle line 34 simultaneously, so form some small cylindrical tanks 400.
Fig. 4 is that the lead frame shown in Fig. 3 comprises interior pin 307 and 308 and the partial schematic diagram of the A part of the second end 321 of dowel.As seen from Figure 4, be provided with small cylindrical tank 4001,4002,4003 and 4004 along cutting muscle line 34 on dowel 32 in this example, and be provided with small cylindrical tank 4005 and 4006 along cutting muscle line 34 on interior pin 307 and 308 simultaneously.
Fig. 5 is provided with the schematic diagram of crystal oscillator and chip on lead frame shown in Figure 3, its chips does not illustrate.First surface (not indicating) at lead frame 3 arranges chip, and second surface 36 arranges crystal oscillator, and in this example, the first surface of island refers to that face relative with second surface.In the present embodiment, chip is close to the first surface that is arranged on island 30, and by the inner lead bonding of bonding gold wire (in the drawings not shown) with lead frame.Need to prove, depend on chip with the interior pin number of chip bonding, although lead frame 3 has 16 interior pins, is not that 16 interior pins all need and chip bonding.In this example, chip is bonded to interior pin 301,302,303,304,307,308,309,310,313 and 314 by bonding gold wire.
After chip is adjacent to the first surface that is arranged on island, crystal oscillator 46 is arranged on the second surface 36 of island.Particularly, arrive interior pin 307 and 308 by bonding gold thread 467 and 468 two pin bondings with crystal oscillator respectively.According to the present embodiment, bonding gold thread 468 and 469 is the interior pin 307 of bonding and 308 extended extensions 3071 and 3081 respectively.
As indicated above, after plastic packaging is completed, can cut off dowel along cutting muscle line 34, that is cut muscle along cutting muscle line 34.Because the connection root at plastic-sealed body is provided with some small cylindrical tanks 400, make the resin that to avoid plastic packaging is formed when cutting off dowel damage.
After plastic packaging is completed and carried out cutting muscle, be deformed into the packaging that comprises chip and crystal oscillator.
In above description taken in conjunction with the accompanying drawings, it is all the elaboration of carrying out as example with a lead frame, but in encapsulation process, a plurality of above-mentioned lead frames can be arranged the formation array of leadframes, are illustrated in figure 6 as the schematic diagram according to the array of leadframes that is formed by lead frame of the present invention.
Lead frame of the present invention can adopt the A42 iron-nickel alloy, and in alloy surface copper facing, thereby it is silver-plated to weld the part of crystal oscillator at needs, has reduced thus the cost of framework.
to sum up, lead frame of the present invention, the end of its dowel is bifurcation structure, make when carrying out lower plastic-sealed body plastic packaging, two entrances (being the first opening 320a of first end 320 and the first port 321a and the second port 321b of the second opening 320b and the second end 321) of 320 and 321 enter plastic packaging material from dowel two ends respectively, slowed down thus the pressure that produces in the plastic packaging material injection process, thereby having avoided the excessive bonding gold thread to chip of pressure to produce to impact causes its disconnection to cause open circuit, thereby or contact with adjacent gold thread the problem that causes short circuit.Lead frame of the present invention, the pin of itself and crystal oscillator bonding is wanted at least the part of bonding crystal oscillator to be broadened, thereby has been guaranteed the reliability of crystal oscillator welding.In addition, lead frame of the present invention is in its manufacture process, also cut on muscle line (sometimes also referred to as the plastic-sealed body object line) at the plastic-sealed body that cuts off dowel and optionally be provided with small cylindrical tank, thereby make the cut-out dowel become more easy and do not damage plastic-sealed body when cutting off.
Although with reference to above-mentioned embodiment, the present invention has been carried out detailed elaboration; but those of ordinary skill in the art is to be understood that; can modify or the part technical characterictic is equal to replacement the specific embodiment of the present invention; and under the spirit that does not break away from technical scheme of the present invention, it all should be encompassed in the middle of the technical scheme scope that the present invention asks for protection.
Claims (8)
1. lead frame that is used for integrated antenna package, comprise island, be looped around around island some pins and from the extended dowel of described island, it is characterized in that, on two pins in described some pins, be provided with those widened sections, the end of described dowel forms bifurcation structure.
2. lead frame according to claim 1, it is characterized in that, described lead frame is used for packaged chip and crystal oscillator simultaneously, the first surface of described island is used for arranging chip, the second surface relative with described first surface is used for arranging crystal oscillator, the all or part of bonding of described chip and described some pins, described crystal oscillator and two pin bondings that are provided with described those widened sections.
3. lead frame according to claim 1 and 2, is characterized in that, is formed with some circular grooves on the muscle line cutting of described dowel.
4. array of leadframes that is used for integrated antenna package, it is characterized in that, described array is comprised of a plurality of lead frames, described lead frame comprises island, be looped around around island some pins and from the extended dowel of described island, on two pins in described some pins, be provided with those widened sections, the end of described dowel forms bifurcation structure.
5. array of leadframes according to claim 4, it is characterized in that, described lead frame is used for packaged chip and crystal oscillator simultaneously, the first surface of described island is used for arranging chip, the second surface relative with described first surface is used for arranging crystal oscillator, the all or part of bonding of described chip and described some pins, described crystal oscillator and two pin bondings that are provided with described those widened sections.
6. according to claim 4 or 5 described array of leadframes, is characterized in that, is formed with some circular grooves on the muscle line cutting of described dowel.
7. packaging, it is characterized in that, described packaging comprises lead frame, chip, crystal oscillator and the packaging body that is complementary with described lead frame, wherein, described lead frame comprises island, be looped around around island some pins and from the extended dowel of described island, on two pins in described some pins, be provided with those widened sections, the end of described dowel forms bifurcation structure, described chip is arranged on the first surface of described island, and described crystal oscillator is arranged on the second surface relative with the first surface of described island.
8. packaging according to claim 7, is characterized in that, all or part of bonding of described chip and described some pins, described crystal oscillator and two pin bondings that are provided with described those widened sections.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103946670A CN103137593A (en) | 2011-12-02 | 2011-12-02 | Lead frame for packaging integrated circuit and corresponding packaging components |
| PCT/CN2012/085609 WO2013079011A1 (en) | 2011-12-02 | 2012-11-30 | Lead frame for encapsulating integrated circuit and corresponding encapsulation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103946670A CN103137593A (en) | 2011-12-02 | 2011-12-02 | Lead frame for packaging integrated circuit and corresponding packaging components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103137593A true CN103137593A (en) | 2013-06-05 |
Family
ID=48497206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103946670A Pending CN103137593A (en) | 2011-12-02 | 2011-12-02 | Lead frame for packaging integrated circuit and corresponding packaging components |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103137593A (en) |
| WO (1) | WO2013079011A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935564A (en) * | 2015-12-31 | 2017-07-07 | 无锡华润安盛科技有限公司 | Integrated circuit package structure |
| CN112133688A (en) * | 2020-11-25 | 2020-12-25 | 苏州纳芯微电子股份有限公司 | Packaging structure of multi-base-island lead frame |
| CN113422587A (en) * | 2021-05-13 | 2021-09-21 | 北京七芯中创科技有限公司 | Cylindrical crystal oscillator and chip single packaging structure based on multilayer concave embedded substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6258629B1 (en) * | 1999-08-09 | 2001-07-10 | Amkor Technology, Inc. | Electronic device package and leadframe and method for making the package |
| KR20020033887A (en) * | 2000-10-30 | 2002-05-08 | 마이클 디. 오브라이언 | Lead frame structure for manufacturing semiconductor package |
| CN201417768Y (en) * | 2009-06-09 | 2010-03-03 | 铜陵丰山三佳微电子有限公司 | Lead frame for semi-conductor integrated circuit |
| CN201725791U (en) * | 2009-12-25 | 2011-01-26 | 无锡华润安盛科技有限公司 | Lead frame of small outline integrated circuit package structure and package device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020065737A (en) * | 2001-02-07 | 2002-08-14 | 주식회사 칩팩코리아 | Structure of lead frame for fabricating semiconductor package |
| JP2004214233A (en) * | 2002-12-26 | 2004-07-29 | Renesas Technology Corp | Semiconductor device and manufacturing method therefor |
-
2011
- 2011-12-02 CN CN2011103946670A patent/CN103137593A/en active Pending
-
2012
- 2012-11-30 WO PCT/CN2012/085609 patent/WO2013079011A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6258629B1 (en) * | 1999-08-09 | 2001-07-10 | Amkor Technology, Inc. | Electronic device package and leadframe and method for making the package |
| KR20020033887A (en) * | 2000-10-30 | 2002-05-08 | 마이클 디. 오브라이언 | Lead frame structure for manufacturing semiconductor package |
| CN201417768Y (en) * | 2009-06-09 | 2010-03-03 | 铜陵丰山三佳微电子有限公司 | Lead frame for semi-conductor integrated circuit |
| CN201725791U (en) * | 2009-12-25 | 2011-01-26 | 无锡华润安盛科技有限公司 | Lead frame of small outline integrated circuit package structure and package device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935564A (en) * | 2015-12-31 | 2017-07-07 | 无锡华润安盛科技有限公司 | Integrated circuit package structure |
| CN112133688A (en) * | 2020-11-25 | 2020-12-25 | 苏州纳芯微电子股份有限公司 | Packaging structure of multi-base-island lead frame |
| CN113422587A (en) * | 2021-05-13 | 2021-09-21 | 北京七芯中创科技有限公司 | Cylindrical crystal oscillator and chip single packaging structure based on multilayer concave embedded substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013079011A1 (en) | 2013-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9385071B2 (en) | Manufacturing method of semiconductor device and semiconductor device | |
| CN102593015B (en) | The manufacture method of semiconductor device | |
| KR102330403B1 (en) | Semiconductor device and method of manufacturing the same | |
| KR200492009Y1 (en) | Preformed lead frame and lead frame package made from the same | |
| US9184118B2 (en) | Micro lead frame structure having reinforcing portions and method | |
| US20130093069A1 (en) | Package structure and the method to fabricate thereof | |
| CN104517927A (en) | Semiconductor device and method of manufacturing the same | |
| US9673122B2 (en) | Micro lead frame structure having reinforcing portions and method | |
| JP2016127067A (en) | Semiconductor device manufacturing method | |
| CN103137593A (en) | Lead frame for packaging integrated circuit and corresponding packaging components | |
| CN101071799A (en) | Manufacturing method of resin-molding type semiconductor device, and wiring board therefor | |
| JP5205173B2 (en) | Semiconductor device and manufacturing method thereof | |
| KR100227120B1 (en) | Semiconductor chip package having combinational structure of lead-on-chip leads and standard normal leads | |
| EP3166142B1 (en) | Bond wire connection and method of manufacturing the same | |
| CN210429796U (en) | Packaging structure for double-side welding and assembling of lead frame | |
| CN206098385U (en) | Lead frame of IC semiconductor for device | |
| JP6143726B2 (en) | Resin-encapsulated semiconductor device, manufacturing method thereof, lead frame | |
| CN103400811A (en) | Frame based flat packaging part adopting special dispensing technology and manufacturing process thereof | |
| CN112635428B (en) | Frame structure of chip package and semiconductor device | |
| US20090294933A1 (en) | Lead Frame and Chip Package Structure and Method for Fabricating the Same | |
| CN203932043U (en) | A kind of power device of paster encapsulation | |
| JP2011210936A (en) | Method of manufacturing semiconductor device, and semiconductor device | |
| KR20070078593A (en) | Array type leadframe package, semiconductor package using array type leadframe package, and method for manufacturing the semiconductor package | |
| CN205406514U (en) | Preformed seals wafer -level package structure of lead frame | |
| CN104600048A (en) | Semiconductor packaging structure and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130605 |