CN113422587A - Cylindrical crystal oscillator and chip single packaging structure based on multilayer concave embedded substrate - Google Patents

Cylindrical crystal oscillator and chip single packaging structure based on multilayer concave embedded substrate Download PDF

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Publication number
CN113422587A
CN113422587A CN202110524300.XA CN202110524300A CN113422587A CN 113422587 A CN113422587 A CN 113422587A CN 202110524300 A CN202110524300 A CN 202110524300A CN 113422587 A CN113422587 A CN 113422587A
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China
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crystal oscillator
chip
multilayer substrate
substrate
electrode
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CN202110524300.XA
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Chinese (zh)
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不公告发明人
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BEIJING 7Q TECHNOLOGY CO LTD
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BEIJING 7Q TECHNOLOGY CO LTD
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details

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  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Abstract

The invention relates to a cylindrical crystal oscillator and chip single packaging structure based on a multilayer concave embedded substrate, which comprises: the multilayer substrate comprises a multilayer substrate, a multilayer substrate signal wire, a multilayer substrate grounding wire, a bottom layer electrode and a grounding electrode; the lower surface of the multilayer substrate is provided with a concave embedding space, at least one cylinder crystal oscillator and at least one crystal oscillator driving chip are placed in the concave embedding space in a lying mode, a stepped structure is formed in the space, and the cylinder crystal oscillator lies on the inner layer substrate of the concave embedding space of the multilayer substrate in the lying mode; the chip is welded on the inner layer substrate of the concave embedding space of the multilayer substrate; the multilayer substrate is provided with a step-shaped structure in the concave embedding space, a lead electrode of the cylindrical crystal oscillator is not bent and is smoothly welded with a substrate electrode on the step-shaped structure, and the substrate electrode is connected with the bottom layer electrode through the multilayer substrate signal wire; the cylinder crystal oscillator is connected with the crystal oscillator driving chip through a multilayer substrate connecting line. The structure has short processing period and low cost.

Description

Cylindrical crystal oscillator and chip single packaging structure based on multilayer concave embedded substrate
Technical Field
The invention relates to the technical field of multi-device packaging design by utilizing a substrate, in particular to a cylindrical crystal oscillator and chip single packaging structure based on a multilayer concave embedded substrate.
Background
To date, many devices and terminals involving electronic information systems require local clock devices, crystals in combination with clock chips, to provide stable digital pulse signals and time. According to the application, in many occasions generating time data at present, a crystal oscillator is separated from a chip, the crystal oscillator is arranged beside the chip, but the crystal and the chip are linked through a PCB master mask, after the crystal oscillator is used for a long time, a lot of dust can be generated around pins of the crystal oscillator and the chip, and the dust of Pin angle connecting lines of the devices can form tiny parasitic capacitance, so that the oscillation period of the crystal oscillator is influenced for a long time, and when the crystal oscillator is combined with a clock chip, time drift can be generated for a long time, and the time precision is influenced.
In order to overcome the defects, the RX8025T chip is first developed by the japanese EPSON company in the world. The chip is packaged by thick SOP14, and the chip and the cylindrical crystal oscillator are welded on the upper surface and the lower surface of a lead frame respectively and then placed in a packaging mold for molding, so that the clock device with an integrated thick SOP14 packaging structure is formed. The biggest defects and shortcomings of the integrated packaging of the crystal oscillator and the chip are that the packaging process is complex, the traditional cylindrical crystal oscillator with the frequency of 26.768KHz is large in size, SMT (surface mount technology) welding is not easy to achieve on a packaging frame, a special cylindrical crystal oscillator lead bending machine, a mounting machine and manual welding are needed, the yield is affected, the cost is high, and the packaging cost is high.
Disclosure of Invention
In order to overcome the packaging defects of EPSON RX8025T, reduce cost, prevent the requirements of stability and clock accuracy caused by external links of a crystal, improve reliability and realize large-scale mass production requirements, the invention provides a cylindrical crystal oscillator and chip single packaging structure based on a multilayer concave embedded substrate.
The purpose of the invention is realized by the following technical scheme.
Specifically, according to an aspect of the present invention, the present invention discloses a pillar crystal oscillator and chip single package structure based on a multi-layer recessed embedded substrate, including:
the multilayer substrate comprises a multilayer substrate, a multilayer substrate signal wire, a multilayer substrate grounding wire, a bottom layer electrode and a grounding electrode; wherein,
the lower surface of the multilayer substrate is provided with a concave embedding space, at least one cylinder crystal oscillator and at least one crystal oscillator driving chip are placed in the concave embedding space in a lying mode, a stepped structure is formed in the space, and the cylinder crystal oscillator lies on the inner layer substrate of the concave embedding space of the multilayer substrate in the lying mode; the chip is welded on the inner layer substrate of the concave embedding space of the multilayer substrate;
the multilayer substrate is provided with a step-shaped structure in the concave embedding space, a lead electrode of the cylindrical crystal oscillator is not bent and is smoothly welded with a substrate electrode on the step-shaped structure, and the substrate electrode is connected with the bottom layer electrode through the multilayer substrate signal wire; the cylinder crystal oscillator is connected with the crystal oscillator driving chip through a multilayer substrate connecting line;
the crystal oscillator driving chip is respectively connected with the cylinder crystal oscillator and the connecting electrode through a chip electrode lead and is connected with the multilayer substrate grounding wire through the connecting electrode.
Preferably, the crystal oscillator driving chip is a bare chip.
Preferably, the recessed space is further filled with an encapsulation resin to cover the cylindrical crystal oscillator and the bare chip.
Preferably, the encapsulation resin does not exceed the horizontal line of the lower surface of the multilayer substrate.
Preferably, the crystal oscillator driving chip is a packaged chip, the chip electrode lead is replaced by a chip pin, and the packaged chip is fixed to the multilayer substrate connecting line and the connecting electrode through the chip pin in a welding mode.
Preferably, on the multilayer substrate, a passive device is further soldered, including at least one of: and (3) surface-mounting a capacitor, an inductor, a resistor and a sensitive material device.
Preferably, the signal line of the multilayer substrate is connected with the bottom electrode through the corresponding interlayer connecting wire hole, and the ground line of the multilayer substrate is connected with the grounding electrode through the corresponding interlayer connecting wire hole.
The invention is characterized in that: the invention designs a cylinder crystal oscillator and chip single packaging structure based on a multilayer concave embedding type substrate by using a low-cost circuit substrate, and the structure can easily package the cylinder crystal oscillator and the chip in the concave embedding of the multilayer substrate through a stepped substrate of a concave embedding space.
This structure has the following advantages:
1. the high die processing cost of the traditional thick SOP14 packaging structure and the processing period of a new structure are avoided. The cylindrical crystal oscillator and chip single packaging structure based on the multilayer concave embedded substrate can realize the substrate frame only by a common PCB processing technology. Flexible design, low cost and short process cycle (days), while custom SiP molds are typically up to months long.
2. The cost is low. The packaging cost of the cylindrical crystal oscillator and chip single packaging structure based on the multi-layer concave embedded substrate is only a fraction of that of the packaging structure with the same thickness of SOP 14.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1-1 is a schematic diagram of a first embodiment of a pillar crystal oscillator and chip singulation package structure based on a multi-layer recessed substrate;
fig. 1-2 is a schematic top view of a cylindrical crystal oscillator and chip singulation package structure based on a multi-layer recessed substrate;
fig. 1-3 are schematic top and bottom views of a pillar crystal oscillator and chip singulation package structure based on a multi-layer recessed substrate;
fig. 2 is a schematic diagram of a second embodiment of a pillar crystal oscillator and die singulation package structure based on a multi-layer recessed substrate.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The invention designs a cylinder crystal oscillator and chip single packaging structure based on a multi-layer concave embedded substrate by utilizing a traditional low-cost PCB multi-layer substrate, and a step-shaped structure is formed in the internal space of the concave embedded substrate, so that a cylinder crystal electrode wire can be installed and welded on an electrode of the step-shaped substrate without bending. The inner layer and the outer layer are designed to be connected in a mode that the PCB substrate is used for flexible wiring, interconnection and integration of the crystal and the chip are achieved in the concave embedding type space, and finally glue dispensing forming is conducted.
The invention forms a concave embedding space on a part of the back layer of the multilayer substrate, so that the multilayer substrate is used as a packaging mother frame body, the cylindrical crystal oscillator and the chip are arranged in the concave embedding space and packaged in a dispensing mode.
As shown in fig. 1-1, fig. 1-1 is a schematic view of a pillar crystal oscillator and chip singulation package structure based on a multi-layer recessed substrate, and the present invention is intended to form a recessed space 4-2 on the bottom surface of the multi-layer substrate 1-1. And welding the crystal oscillator driving chip 2-1-0 packaged and molded in advance on an inner layer substrate of the multilayer substrate. According to the design wiring requirements, the chip electrode lead 2-1-1, the electrode 1-16 and the interlayer wiring hole 1-17 (a multilayer substrate grounding wire is arranged in the hole) are accessed to the substrate electrode wire 1-18 (also a grounding electrode). The cylinder crystal oscillator 2-3 lies on the bottom of the substrate, but the electrode lead 2-3-1 at the center of the cylinder crystal oscillator is welded on the electrode 1-13 of the ladder substrate layer 1-12 of the concave embedding space 4-2. It is noted here that the geometrical position of the electrode leads 2-3-1 is as high as possible in a horizontal plane with the height of the electrodes 1-13 of the stepped substrate layer 1-12. The crystal oscillator driving chip 2-1-0 is connected with the crystal oscillator 2-3 through a connecting line 1-19 of the multi-layer substrate. Of course, the electrodes 1-16, the multilayer substrate wires 1-19, the interlayer wire holes 1-17, the ground electrodes 1-18, etc. can be freely designed on the bottom surface of the substrate according to the system requirements of the chip device. 1-11 and 1-12 are insulating layers, and 1-14 are interlayer connecting holes (a plurality of substrate signal lines are arranged in the holes) for connecting bottom layer electrodes 1-15 and substrate electrodes 1-13.
After the assembly and the mounting of the chip and the device are completed, the concave embedding space of the substrate is filled with packaging resin 3-1, and the resin is cured by heating.
Further, it is emphasized that the encapsulation resin 3-1 in the recessed space of the multilayer substrate must not exceed the recessed space interface 4-1.
The structure diagrams are shown in fig. 1-2 and 1-3, which respectively show an upper diagram and a bottom diagram of a cylindrical crystal oscillator and driving chip single packaging structure based on a multi-layer recessed embedded substrate in a practical device. The upper surface is a flat substrate, and bottom layer electrodes 1-15, grounding electrodes 1-18 and the like of the substrate are welded with other mother boards, of course, a plurality of substrate peripheral electrodes such as the bottom layer electrodes 1-15, the grounding electrodes 1-18 and the like can be freely designed on the bottom surface of the substrate according to the system requirements of signal lines, grounding lines and power lines of chip devices.
In the practical design of the system of the present invention, packaged chips are also purchased, such as a schematic diagram of a multi-device package monolithic structure containing packaged chips based on a multi-layer recessed embedded substrate, i.e. as shown in fig. 2, a device can be a packaged chip 2-2-0, and chip pins 2-2-1 are soldered and fixed to recessed embedded metal connecting wires 1-16 (also connecting electrodes) inside the substrate and multi-layer substrate connecting wires 1-19. The crystal oscillator driving chip 2-2-0 is connected with the crystal oscillator 2-3 through a connecting line 1-19 of the multi-layer substrate. The cylindrical crystal oscillator 2-3 needs to be laid down when being installed, and the electrode 2-3-1 is welded with the substrate electrode 1-13. And filling resin 3-1 for heating and curing after the crystal oscillator and the driving chip are assembled.
The embodiment utilizes the cheap circuit substrate to design the structure to drive the chip and the cylinder crystal oscillator to be assembled in the concave embedding part of the multilayer substrate, can arrange the auxiliary circuit between the chip and the device by utilizing the substrate, does not need to manufacture a lead frame and a packaging mold of a new structure package every time, and has flexible design of a multi-substrate and a lead. The chip 2-1-0 in the encapsulated concave embedded substrate can be a bare chip or a chip encapsulated by resin. The cost and the manufacturing period can be reduced, which is the basic characteristic and the advantage of the invention.
The invention can flexibly test a small amount of samples (Pilot) at low cost. And rapid, initial, pilot-scale assessment of system-level functionality and performance can be performed. The performance discrete characteristic of each batch of chips is adjusted, and the optimization function of the chips is realized by flexibly performing parameter configuration adjustment through the selection of chip peripheral circuit devices arranged in the concave embedding.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (7)

1. The utility model provides a cylinder crystal oscillator and chip individuation packaging structure based on concave formula base plate of inlaying of multilayer which characterized in that includes:
the multilayer substrate comprises a multilayer substrate, a multilayer substrate signal wire, a multilayer substrate grounding wire, a bottom layer electrode and a grounding electrode; wherein,
the lower surface of the multilayer substrate is provided with a concave embedding space, at least one cylinder crystal oscillator and at least one crystal oscillator driving chip are placed in the concave embedding space in a lying mode, a stepped structure is formed in the space, and the cylinder crystal oscillator lies on the inner layer substrate of the concave embedding space of the multilayer substrate in the lying mode; the chip is welded on the inner layer substrate of the concave embedding space of the multilayer substrate;
the multilayer substrate is provided with a step-shaped structure in the concave embedding space, a lead electrode of the cylindrical crystal oscillator is not bent and is smoothly welded with a substrate electrode on the step-shaped structure, and the substrate electrode is connected with the bottom layer electrode through the multilayer substrate signal wire; the cylinder crystal oscillator is connected with the crystal oscillator driving chip through a multilayer substrate connecting line;
the crystal oscillator driving chip is respectively connected with the cylinder crystal oscillator and the connecting electrode through a chip electrode lead and is connected with the multilayer substrate grounding wire through the connecting electrode.
2. The structure of claim 1, wherein the pillar crystal oscillator and chip singulation package structure comprises:
the crystal oscillator driving chip is a bare chip.
3. The structure of claim 2, wherein the pillar crystal oscillator and chip singulation package structure comprises:
and the concave embedding space is further filled with packaging resin to cover the cylindrical crystal oscillator and the bare chip.
4. The structure of claim 3, wherein the pillar crystal oscillator and chip singulation package structure comprises:
the encapsulation resin does not exceed the horizontal line of the lower surface of the multilayer substrate.
5. The structure of claim 1, wherein the pillar crystal oscillator and chip singulation package structure comprises:
the crystal oscillator driving chip is a packaging chip, the chip electrode lead is replaced by a chip pin, and the packaging chip is fixedly welded to the multilayer substrate connecting line and the connecting electrode through the chip pin.
6. The structure of claim 1, wherein the pillar crystal oscillator and chip singulation package structure comprises: and further soldering a passive device on the multilayer substrate, wherein the passive device comprises at least one of the following components: and (3) surface-mounting a capacitor, an inductor, a resistor and a sensitive material device.
7. The structure of claim 1, wherein the pillar crystal oscillator and chip singulation package structure comprises: the multilayer substrate signal wire is connected with the bottom layer electrode through the corresponding interlayer connecting wire hole, and the multilayer substrate grounding wire is connected with the grounding electrode through the corresponding interlayer connecting wire hole.
CN202110524300.XA 2021-05-13 2021-05-13 Cylindrical crystal oscillator and chip single packaging structure based on multilayer concave embedded substrate Pending CN113422587A (en)

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CN202110524300.XA CN113422587A (en) 2021-05-13 2021-05-13 Cylindrical crystal oscillator and chip single packaging structure based on multilayer concave embedded substrate

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278497A (en) * 2009-05-26 2010-12-09 Seiko Epson Corp Electronic device and method of manufacturing the same
CN201725791U (en) * 2009-12-25 2011-01-26 无锡华润安盛科技有限公司 Lead frame of small outline integrated circuit package structure and package device
CN102201794A (en) * 2010-03-19 2011-09-28 精工爱普生株式会社 Electronic device and method of manufacturing electronic device
CN102334288A (en) * 2009-02-25 2012-01-25 精工电子有限公司 Piezoelectric transducer, piezoelectric transducer mounted body, and method for manufacturing piezoelectric transducer
CN102368681A (en) * 2011-09-22 2012-03-07 武汉昊昱微电子股份有限公司 Packaging method for crystal oscillator welding
CN103137593A (en) * 2011-12-02 2013-06-05 无锡华润安盛科技有限公司 Lead frame for packaging integrated circuit and corresponding packaging components
CN107800401A (en) * 2016-09-01 2018-03-13 达帕有限公司 Suitable for the high degree of integration crystal oscillator encapsulating structure of high validity
CN109712947A (en) * 2019-01-14 2019-05-03 北京七芯中创科技有限公司 A kind of antenna component singulation structure based on the recessed embedded substrate of multilayer
CN110459509A (en) * 2019-07-24 2019-11-15 浙江荷清柔性电子技术有限公司 A kind of interconnection packaging method and interconnection package structure of chip
CN211879368U (en) * 2020-05-23 2020-11-06 深圳市和美精艺科技有限公司 Easy heat dissipation type packaging substrate

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102334288A (en) * 2009-02-25 2012-01-25 精工电子有限公司 Piezoelectric transducer, piezoelectric transducer mounted body, and method for manufacturing piezoelectric transducer
JP2010278497A (en) * 2009-05-26 2010-12-09 Seiko Epson Corp Electronic device and method of manufacturing the same
CN201725791U (en) * 2009-12-25 2011-01-26 无锡华润安盛科技有限公司 Lead frame of small outline integrated circuit package structure and package device
CN102201794A (en) * 2010-03-19 2011-09-28 精工爱普生株式会社 Electronic device and method of manufacturing electronic device
CN102368681A (en) * 2011-09-22 2012-03-07 武汉昊昱微电子股份有限公司 Packaging method for crystal oscillator welding
CN103137593A (en) * 2011-12-02 2013-06-05 无锡华润安盛科技有限公司 Lead frame for packaging integrated circuit and corresponding packaging components
CN107800401A (en) * 2016-09-01 2018-03-13 达帕有限公司 Suitable for the high degree of integration crystal oscillator encapsulating structure of high validity
CN109712947A (en) * 2019-01-14 2019-05-03 北京七芯中创科技有限公司 A kind of antenna component singulation structure based on the recessed embedded substrate of multilayer
CN110459509A (en) * 2019-07-24 2019-11-15 浙江荷清柔性电子技术有限公司 A kind of interconnection packaging method and interconnection package structure of chip
CN211879368U (en) * 2020-05-23 2020-11-06 深圳市和美精艺科技有限公司 Easy heat dissipation type packaging substrate

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