CN104733447A - Packaging module with stacked elements - Google Patents

Packaging module with stacked elements Download PDF

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Publication number
CN104733447A
CN104733447A CN201310751003.4A CN201310751003A CN104733447A CN 104733447 A CN104733447 A CN 104733447A CN 201310751003 A CN201310751003 A CN 201310751003A CN 104733447 A CN104733447 A CN 104733447A
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CN
China
Prior art keywords
crystal grain
metallic contact
carrier
groove
electrically connected
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Pending
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CN201310751003.4A
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Chinese (zh)
Inventor
陈石矶
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Innovative Turnkey Solution Corp
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Innovative Turnkey Solution Corp
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Publication of CN104733447A publication Critical patent/CN104733447A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

A package module with stacked elements comprises a carrier and a stacked element group, wherein the carrier is provided with a groove, the bottom of the groove is a crystal grain configuration area, two opposite sides in the crystal grain configuration area are provided with at least one group of platform parts, the stacked element group is provided with a plurality of crystal grains, and the crystal grains are respectively arranged in the crystal grain configuration area and the platform parts, so that the stacked element group is completely arranged in the groove to complete the package module with the stacked elements; the package module with stacked components can be connected with other placement bases by surface metal contacts to become an electronic component in an electronic device.

Description

There is the package module of laminated components
Technical field
The invention relates to a kind of package module with laminated components, relate to the package module that a kind of stacked package technology using three-dimensional carrier to carry out multiple chip is formed especially.
Background technology
The life of modern be unable to do without a large amount of electronic products, therefore the demand for semiconductor industry also gets more and more, also just constantly development is to meet the demand of market for various different product for semiconductor industry, and wherein the most general demand wishes to produce the better product of identical even function with less space.
Wherein, stacked chip packages (Stacked Die Package) is a kind of packaged type that can reduce product space, this is a kind of the technology of the chip configuration of multiple difference in functionality in same package module, except can reaching the order of Function Integration Mechanism, more effectively can save the area of circuit board, and the space can reduced occupied by chip, overall manufacturing cost can be reduced further.In addition, the circuit distance in encapsulation between multiple chips can shorten by stacked chip packages, to provide preferably electrical property efficiency, and effectively can reduce signal problem disturbed in circuit conduct.
At present, adopt stacked chip packages more be the encapsulation of memory, such as, between flash memory and static RAM stacking; The communication chip of part is also had also to be adopt stacked chip-scale encapsulation, such as, by within chip configuration different to fundamental frequency, flash memory and static RAM etc. to same package module.
But, some shortcomings are had at present at the stacked chip packages used, such as chip is in technique stacking each other, because the weld pad (pad) on chip is more, make chip aim at not easily with the electrical contact on substrate (substrate), easily produce the problem that yield declines; In addition, for increasing the connection effect of chip chamber, the most general means increase sealing adhesive process between each chip, but too much sealing, except increasing the thickness of whole encapsulation finished product, also can produce the situation of excessive glue, not only can increase the cost of encapsulation, also reduce the reliability of encapsulation finished product; In addition, on the chip overlie one another, stamping plain conductor separately is also pretty troublesome technique; Further, chip package completes later finished product to be needed be installed on other electronic products, needs to make contact and pad alignment through alignment correction, and this also can make the cost of encapsulation increase; For above-mentioned shortcoming, it is considered herein that the necessity be improved.
Summary of the invention
In order to solve above-mentioned mentioned problem, a main purpose of the present invention is to provide a kind of package module with laminated components, by the carrier design of solid, the flow process of encapsulation stacking element is simplified, and also can improve the reliability of encapsulation finished product.
In order to reach above-mentioned purpose, the invention provides a kind of package module with laminated components, comprise: a carrier, there is a first surface and relative with first surface one second, first surface is formed with a groove and around the edge part of groove, groove is configured with a crystal grain configuring area, and multiple first metallic contact of dual side-edge configuration relative on bottom portion of groove, two platform part, be configured on the relative dual side-edge in crystal grain configuring area respectively, make between two platform part and crystal grain configuring area, to form a pair first groove walls, a pair second groove walls are formed between edge part and two platform part, and expose the first metallic contact to the open air, the height of two platform part is equal and higher than crystal grain configuring area, two platform part configure respectively multiple second metallic contact, wherein, one of them of each the first metallic contact all with the second metallic contact is corresponding, and be electrically connected with one first metal material between the first corresponding metallic contact and the second metallic contact, one first crystal grain, has a upper end and a lower end, and on lower end, configure multiple first weld pad, and the first crystal grain is configured in crystal grain configuring area to cover crystalline substance, and the first weld pad and the first metallic contact are electrically connected, one second crystal grain, has a upper end and a lower end, and on lower end, configure multiple second weld pad, and the second crystal grain, to cover the upper end that crystalline substance is configured at the first crystal grain, makes the second metallic contact in the second weld pad and platform part be electrically connected, wherein, each second metallic contact is electrically connected with multiple second metal material further, second metal material extends second that is configured to carrier from the platform part of carrier via first surface, and is positioned on one end of second in each second metal material, forms multiple respective metal end points.
The above-mentioned package module with laminated components can have a substrate further, substrate has one the 3rd and a fourth face relative with the 3rd, substrate also has multiple substrate through hole to be through to fourth face from the 3rd face, 3rd mask has multiple electrical contact, fourth face has multiple outer contact, and each electrical contact all extends to fourth face via the metal in substrate through hole and is electrically connected with one of them of outer contact respectively; Wherein, the 3rd of substrate is superimposed with the second face of carrier, and the metal endpoints on electrical contact all respectively with the second is electrically connected.
Invention further provides a kind of package module with laminated components, comprise: a carrier, there is a first surface and relative with first surface one second, first surface is formed with a groove and around the edge part of groove, groove is configured with a crystal grain configuring area, and on bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on the dual side-edge of crystal grain configuring area respectively, make between two platform part and crystal grain configuring area, to form a pair first groove walls, a pair second groove walls are formed between edge part and two platform part, and it is adjacent and expose the first metallic contact to the open air, the height of two platform part is equal and higher than crystal grain configuring area, platform part configures multiple second metallic contact, multiple through hole is configured in crystal grain configuring area and two platform part, every pass through aperture is through to carrier second, and metal column is configured in every pass through aperture, one first crystal grain, has a upper end and a lower end, and on lower end, configure multiple first weld pad, and the first crystal grain is configured in crystal grain configuring area to cover crystalline substance, and the first weld pad and the first metallic contact are electrically connected, one second crystal grain, have a upper end and a lower end, and on lower end, configure multiple second weld pad, the second crystal grain is to cover the upper end that crystalline substance is configured at the first crystal grain, the second metallic contact in second weld pad and platform part is electrically connected, and exposes the upper end of part the first crystal grain, wherein, first metallic contact and the second metallic contact are all electrically connected via the metal column in through hole, make the first metallic contact and the second metallic contact extend to second of carrier respectively, and then make each first metallic contact and each the second metallic contact be positioned at the multiple respective metal end points of each self-forming in one end of second.
The above-mentioned package module with laminated components can have a substrate further, substrate has one the 3rd and a fourth face relative with the 3rd, substrate also has multiple substrate through hole to be through to fourth face from the 3rd face, 3rd mask has multiple electrical contact, fourth face has multiple outer contact, and each electrical contact all extends to fourth face via the metal in substrate through hole and is electrically connected with one of them of outer contact respectively; Wherein, the 3rd of substrate is superimposed with the second face of carrier, and the metal endpoints on electrical contact all respectively with the second is electrically connected.
Invention further provides a kind of package module with laminated components, comprise: a carrier, there is a first surface and relative with first surface one second, first surface is formed with a groove and around the edge part of groove, groove is configured with a crystal grain configuring area, and on bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on the relative dual side-edge in crystal grain configuring area respectively, make between two platform part and crystal grain configuring area, to form a pair first groove walls, a pair second groove walls are formed between edge part and two platform part, and it is adjacent and expose the first metallic contact to the open air, the height of two platform part is equal and higher than crystal grain configuring area, two platform part configure respectively multiple second metallic contact, wherein, one of them of each the first metallic contact all with the second metallic contact is corresponding, and be electrically connected with a metal material between the first corresponding metallic contact and the second metallic contact, one first crystal grain, has a upper end and a lower end, and on lower end, configure multiple first weld pad, and the first crystal grain is configured in crystal grain configuring area to cover crystalline substance, and the first weld pad and the first metallic contact are electrically connected, one second crystal grain, has a upper end and a lower end, and on lower end, configure multiple second weld pad, and the second crystal grain, to cover the upper end that crystalline substance is configured at the first crystal grain, makes the second metallic contact in the second weld pad and platform part be electrically connected, wherein, each second metallic contact is electrically connected with multiple second metal material further, and each second metal material is configured to the edge part of carrier from two platform part extensions of carrier and forms a metal endpoints.
The above-mentioned package module with laminated components can have a substrate further, substrate has one the 3rd and a fourth face relative with the 3rd, substrate also has multiple substrate through hole to be through to fourth face from the 3rd face, 3rd mask has multiple electrical contact, fourth face has multiple outer contact, and each electrical contact all extends to fourth face via the metal in substrate through hole and is electrically connected with one of them of outer contact respectively; Wherein, the 3rd of substrate is superimposed with the first surface of carrier, and electrical contact is electrically connected with the metal endpoints on edge part all respectively.
The present invention also been proposed a kind of package module with laminated components, comprise: a carrier, there is a first surface and relative with first surface one second, first surface is formed with a groove and around the edge part of groove, groove is configured with a crystal grain configuring area, and on bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on the relative dual side-edge in crystal grain configuring area respectively, make between two platform part and crystal grain configuring area, to form a pair first groove walls, a pair second groove walls are formed between edge part and two platform part, and it is adjacent and expose the first metallic contact to the open air, the height of two platform part is equal and higher than crystal grain configuring area, two platform part configure respectively multiple second metallic contact, wherein, one of them of each the first metallic contact all with the second metallic contact is corresponding, and be electrically connected with one first metal material between the first corresponding metallic contact and the second metallic contact, multiple through hole is configured at crystal grain configuring area, every pass through aperture is through to carrier second, and metal column is configured in every pass through aperture, one first crystal grain, has a upper end and a lower end, and on lower end, configure multiple first weld pad, and the first crystal grain is configured in crystal grain configuring area to cover crystalline substance, and the first weld pad and the first metallic contact are electrically connected, one second crystal grain, has a upper end and a lower end, and on lower end, configure multiple second weld pad, and the second crystal grain, to cover the upper end that crystalline substance is configured at the first crystal grain, makes the second metallic contact in the second weld pad and platform part be electrically connected, wherein, the first metallic contact is electrically connected via the metal column in through hole, makes the first metallic contact extend to second of carrier, and then makes each first metallic contact be positioned at the multiple respective metal end points of each self-forming in one end of second.
The above-mentioned package module with laminated components can have a substrate further, substrate has one the 3rd and a fourth face relative with the 3rd, substrate also has multiple substrate through hole to be through to fourth face from the 3rd face, 3rd mask has multiple electrical contact, fourth face has multiple outer contact, and each electrical contact all extends to fourth face via the metal in substrate through hole and is electrically connected with one of them of outer contact respectively; Wherein, the 3rd of substrate is superimposed with the second face of carrier, and the metal endpoints on electrical contact all respectively with the second is electrically connected.
The present invention also been proposed a kind of package module with laminated components, comprise: one first package module, first package module has further: a carrier, there is a first surface and relative with first surface one second, first surface is formed with a groove and around the edge part of groove, groove is configured with a crystal grain configuring area, and on bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on the relative dual side-edge in crystal grain configuring area respectively, make between two platform part and crystal grain configuring area, to form a pair first groove walls, a pair second groove walls are formed between edge part and two platform part, and it is adjacent and expose the first metallic contact to the open air, the height of two platform part is equal and higher than crystal grain configuring area, two platform part configure respectively multiple second metallic contact, wherein, one of them of each the first metallic contact all with the second metallic contact is corresponding, and be electrically connected with a metal material between the first corresponding metallic contact and the second metallic contact, multiple through hole is configured at crystal grain configuring area, every pass through aperture is through to second of carrier, and a metal column is configured in every pass through aperture, one first crystal grain, has a upper end and a lower end, and on lower end, configure multiple first weld pad, and the first crystal grain is configured in crystal grain configuring area to cover crystalline substance, and the first weld pad and the first metallic contact are electrically connected, one second crystal grain, has a upper end and a lower end, and on lower end, configure multiple second weld pad, and the second crystal grain, to cover the upper end that crystalline substance is configured at the first crystal grain, makes the second metallic contact in the second weld pad and platform part be electrically connected, wherein, the first metallic contact is electrically connected via the metal column in through hole, makes the first metallic contact extend to second of carrier, and then makes each first metallic contact be positioned at the multiple respective metal end points of each self-forming in one end of second, and one second package module, second package module has further: a carrier, there is a first surface and relative with first surface one second, first surface is formed with a groove and around the edge part of groove, groove is configured with a crystal grain configuring area, and on bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on the relative dual side-edge in crystal grain configuring area respectively, make between two platform part and crystal grain configuring area, to form a pair first groove walls, a pair second groove walls are formed between edge part and two platform part, and it is adjacent and expose the first metallic contact to the open air, the height of two platform part is equal and higher than crystal grain configuring area, two platform part configure respectively multiple second metallic contact, wherein, one of them of each the first metallic contact all with the second metallic contact is corresponding, and be electrically connected with one first metal material between the first corresponding metallic contact and the second metallic contact, each second metallic contact is electrically connected with multiple second metal material further, and each second metal material is configured to the edge part of carrier from two platform part extensions of carrier and forms a first metal end point, multiple through hole is configured at crystal grain configuring area, every pass through aperture is through to second of carrier, and a metal column is configured in every pass through aperture, one first crystal grain, has a upper end and a lower end, and on lower end, configure multiple first weld pad, and the first crystal grain is configured in crystal grain configuring area to cover crystalline substance, and the first weld pad and the first metallic contact are electrically connected, one second crystal grain, has a upper end and a lower end, and on lower end, configure multiple second weld pad, and the second crystal grain, to cover the upper end that crystalline substance is configured at the first crystal grain, makes the second metallic contact in the second weld pad and platform part be electrically connected, one substrate, substrate has one the 3rd and a fourth face relative with the 3rd, substrate also has multiple substrate through hole to be through to fourth face from the 3rd face, 3rd mask has multiple electrical contact, fourth face has multiple outer contact, and each electrical contact all extends to fourth face via the metal in substrate through hole and is electrically connected with one of them of outer contact respectively, wherein, the 3rd of substrate is superimposed with the first surface of carrier, and electrical contact is electrically connected with the first metal end point on edge part all respectively, wherein, the first metallic contact is electrically connected via the metal column in through hole, makes the first metallic contact extend to second of carrier, and then makes each first metallic contact be positioned at each self-forming in one end multiple second metal endpoints accordingly of second, wherein, second of carrier of first package module connects with the second face of the carrier of the second package module, and each metal endpoints on the first package module carrier second, is electrically connected with each second metal endpoints of the second package module carrier second respectively.
Via the package module with laminated components proposed by the invention, encapsulation factory only need when encapsulating in conjunction with laminated components module and carrier, and can encapsulation be completed in conjunction with carrier and substrate, wherein carrier and substrate all by standardized flow process by other manufacturers produce, cost required when so just effectively can reduce encapsulation.
Via the package module with laminated components proposed by the invention, the laminated components group after encapsulation, because be positioned among carrier completely, can not be subject to the impact of external substance, therefore effectively can improve reliability.
Via the package module with laminated components proposed by the invention, stacked package (Package on Package) can be completed by two identical package modules with laminated components, and do not need distinctly to make different encapsulation (Package) elements and just can complete stacked package, the efficiency that encapsulation factory makes stacked package can be increased.
Via the package module with laminated components proposed by the invention, because carrier and substrate are all produced by standardization flow process, the finished product size therefore after encapsulation is also easy to standardization, decreases the time required for routing and alignment correction.
Accompanying drawing explanation
For making the object of the present invention, technical characteristic and advantage, can more correlative technology field personnel understand and be implemented the present invention, appended accompanying drawing is coordinated at this, technical characteristic of the present invention and execution mode is illustrated in follow-up specification, and enumerate preferred embodiment and further illustrate, right following examples illustrate and are not used to limit the present invention, and with hereinafter contrasted accompanying drawing, express the signal relevant with feature of the present invention, wherein:
Fig. 1 carrier upper schematic diagram of the present invention;
Fig. 2 A is the carrier upper schematic diagram of first embodiment of the invention;
Fig. 2 B looks schematic diagram under the carrier of first embodiment of the invention;
Fig. 3 looks schematic diagram under crystal grain first embodiment of the present invention;
Fig. 4 is the package module cross-sectional schematic that the first embodiment of the present invention has laminated components;
Fig. 5 A is substrate upper schematic diagram of the present invention;
Fig. 5 B looks schematic diagram under substrate of the present invention;
Fig. 6 is the package module cross-sectional schematic that the second embodiment of the present invention has laminated components;
Fig. 7 A is the carrier upper schematic diagram of the third embodiment of the present invention;
Fig. 7 B looks schematic diagram under the carrier of the third embodiment of the present invention;
Fig. 8 A is the substrate upper schematic diagram of third embodiment of the invention;
Fig. 8 B looks schematic diagram under the substrate of third embodiment of the invention;
Fig. 9 is the package module cross-sectional schematic that the third embodiment of the present invention has laminated components;
Figure 10 is fourth embodiment of the present invention carrier upper schematic diagram;
Figure 11 is the package module cross-sectional schematic that the fourth embodiment of the present invention has laminated components;
Figure 12 A is the carrier upper schematic diagram of the fifth embodiment of the present invention;
Figure 13 B looks schematic diagram under the carrier of the fifth embodiment of the present invention;
Figure 13 is the package module cross-sectional schematic that the fifth embodiment of the present invention has laminated components;
Figure 14 is another execution mode cross-sectional schematic of package module that the fifth embodiment of the present invention has laminated components;
Figure 15 A is the carrier upper schematic diagram of the sixth embodiment of the present invention; Schematic diagram is looked under the carrier of Figure 15 B sixth embodiment of the present invention;
Figure 16 is the package module cross-sectional schematic that the sixth embodiment of the present invention has laminated components.
Embodiment
Please first consulting Fig. 1, is carrier upper schematic diagram of the present invention.As shown in Figure 1, carrier 1 can be formed in macromolecular material injection molding mode, and this macromolecular material can select a kind of poly-sub-acyl ammonium; Carrier 1 also has first surface 12 and second face 14 relative with first surface 12, first surface 12 is formed with groove 13 and the edge part 121 around this groove 13, the bottom of this groove 13 is crystal grain configuring area 131, simultaneously, be positioned on the relative dual-side of groove 13, be all configured with two first platform part 133 and two second platform part 135 respectively; Two first platform part 133 are respectively adjacent to crystal grain configuring area 131, significantly, crystal grain configuring area 131 is positioned at the centre of both sides first platform part 133, simultaneously, first platform part 133 comparatively crystal grain configuring area 131 is high, in a preferred embodiment, the height of this first platform part 133 can be designed to identical with the height that will carry out crystal grain or other potted elements encapsulated; Then; second platform part 135 is adjacent to the first platform part 133; significantly; two first platform part 133 and crystal grain configuring area 131 are all positioned at the centre of both sides second platform part 135; similarly; second platform part 135 comparatively the first platform part 133 is high, and in a preferred embodiment, the height of this second platform part 135 can be designed to identical with the height that will carry out crystal grain or other potted elements encapsulated.According to the above description, clearly, crystal grain configuring area 131, first platform part 133 and the second platform part 135 can form stair-stepping structure on the dual-side that groove 13 is relative.In addition, under a preferably enforcement state, the present invention can make the groove walls 15a between crystal grain configuring area 131 and arbitrary first platform part 133, the groove walls 15b between the first platform part 133 and the second adjacent platform part 135, the groove walls 15c between arbitrary second platform part 135 and adjacent first surface 12 be all inclined-plane, and the angle of each groove wall and each plane is θ, wherein, 90 °≤θ≤135 °, that is, each groove walls 1Sa, 15b, 15c also can be vertical planes; Being noted that the present invention does not limit the size of the angle theta of each plane in groove walls 15a, 15b, 15c and carrier 1, and arranging the main purpose of described groove walls, is be to help crystal grain location and aim at.
Then, see also Fig. 2 A and Fig. 2 B, under being respectively the carrier upper schematic diagram of first embodiment of the invention and the carrier of first embodiment of the invention, look schematic diagram.First, as shown in Figure 2 A, carrier 1a of the present invention, in crystal grain configuring area 131 and on the dual-side of adjacent first platform part 133, is configured with multiple metallic contact 132; And in the first platform part 133, be configured with multiple metallic contact 134, and in the second platform part 135, be also configured with multiple metallic contact 136; Meanwhile, the quantity of metallic contact 132, metallic contact 134 and metallic contact 136 is identical, and the position between these each metallic contacts 132,134 and 136 of the same side is corresponding.In addition, all be electrically connected each via metal material 182 between aforementioned each metallic contact 132 at the same side of carrier 1a and each metallic contact 134, and be all electrically connected each via metal material 184 between each metallic contact 134 and each metallic contact 136, each metallic contact 136 separately has and is electrically connected with multiple metal material 186, wherein, metal material 186 also extends to second face 14 of carrier 1a through the edge part 121 of groove walls 15c and first surface 12 from the second platform part 135, and multiple metal material 186 can through suitable arrangement and on one end of each metal material 186, form a metallic contact 138, make the metallic contact 138 being formed with multiple marshalling in second face 14 of carrier 1a, and form the configuration mode of marshalling as shown in Figure 2 B, but the present invention does not limit metallic contact 138 and metal material 186 configuring condition on the second face 14, such as, can by adjacent for metallic contact 138 periphery being configured at the second face 14.
The process that the metal material 182,184 and 186 of the present embodiment is formed can be the position first undercuting metal material 182,184 and 186 with laser, again to electroplate formation, groove walls 15a such as between metallic contact 132 and metallic contact 134 undercuts the position of metal material 182, then forms metal material 182 to electroplate; Under preferably enforcement state, because groove walls 15a, 15b, 15c can be inclined-plane, therefore effectively can improve the easy plating of metal material 182,184,186.
Then, Fig. 3 is referred to, for looking schematic diagram under crystal grain first embodiment of the present invention.As shown in Figure 3, crystal grain 31 completes the wafer after semiconductor technology (wafer) by one, formed after cutting process.This crystal grain 31 has upper end 311 and the lower end 312 relative with upper end 311, lower end 312 there is multiple weld pad (pad) 310, in preferred embodiment, weld pad 310 can be configured in the two ends of crystal grain 31 respectively, and can be corresponding with the contact for configuring area, such as, weld pad 310 configuration can and the metallic contact 132 of crystal grain configuring area 131 corresponding; But the present invention does not restrict weld pad 310 number of crystal grain 31 and configuration mode, in like manner, metallic contact 132,134,136,138 and metal material 182,184,186 also can have corresponding number because the number of weld pad 310 is different.
Then, Fig. 4 is referred to, for the first embodiment of the present invention has the package module cross-sectional schematic of laminated components.As shown in Figure 4, the package module 4 with laminated components comprises carrier 1a as shown in Figure 2 A and laminated components group 3; The laminated components group 3 be made up of the first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 in the groove 13 of carrier 1a, the outward appearance of the second crystal grain 32 and the 3rd crystal grain 33 is similar to the first crystal grain 31, therefore repeat no more, can describe later as laminated components group 3 and the annexation of groove 13; First form a padded coaming 19 in crystal grain configuring area 131, again the first crystal grain 31 is configured in crystal grain configuring area 131, wherein, first crystal grain 31 is electrically connected with metallic contact 132 by the weld pad 310 on its lower end 312 in chip bonding (flip chip) mode, makes padded coaming 19 between the first crystal grain 31 and crystal grain configuring area 131; The upper end 311 of the first crystal grain 31 is formed a padded coaming 19, again that the lower end 322 of the second crystal grain 32 is relative with the upper end 311 of the first crystal grain 31 and connect, make padded coaming 19 between the second crystal grain 32 and the first crystal grain 31, the lower end 322 of the second crystal grain 32 and the upper end 311 phase poststack of the first crystal grain 31, the upper end 311 of the first crystal grain 31 can be completely covered, meanwhile, the weld pad 320 of the lower end 322 of the second crystal grain 32 and the metallic contact 134 of the first platform part 133 are electrically connected mutually in the mode of chip bonding (flip chip); The upper end 321 of the second crystal grain 32 is formed a padded coaming 19, again that the lower end 332 of the 3rd crystal grain 33 is relative with the upper end 321 of the second crystal grain 32 and connect, make padded coaming 19 between the 3rd crystal grain 33 and the second crystal grain 32, the lower end 332 of the 3rd crystal grain 33 and the upper end 321 phase poststack of the second crystal grain 32, the upper end 321 of the second crystal grain 32 can be completely covered, meanwhile, the weld pad 330 of the 3rd crystal grain 33 lower end 332 and the metallic contact 136 of the second platform part 135 are electrically connected mutually in the mode of chip bonding (flip chip); In addition, the upper end 331 of piling the 3rd crystal grain 33 of poststack is no more than first surface 12; As mentioned above, the first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 can be connected with carrier 1a by the mode of chip bonding (flip chip); In addition, the groove walls 1Sa shown in the Fig. 4 in the present embodiment, 15b, 15c are vertical plane, therefore when encapsulating crystal grain, crystal grain can be made to be close to wall by the mode of location; And under preferably enforcement state, groove walls 1Sa, 15b, 15c can be designed as inclined-plane, even if therefore location slightly error to carrier 1a put into by crystal grain, each crystal grain also can be made to slide into applicable position by crooked wall; In addition, under preferably enforcement state, padded coaming 19 is for having the material of stickiness, such as: epoxy resin (exposy) or silica gel (silicone) etc., therefore padded coaming 19 can make carrier 1a, the first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 have better combination each other; In the present embodiment, can fill with colloid (not shown) further in groove 13, such as: epoxy resin, be subject to better protection to make the element in laminated components group 3 and other grooves 13.
Then, see also Fig. 5 A and Fig. 5 B, under being respectively substrate upper schematic diagram of the present invention and substrate of the present invention, look schematic diagram.As shown in Figure 5A, substrate 2 has one the 3rd face 22 and the fourth face 24 relative with the 3rd face 22, and has multiple substrate through hole 28 being through to fourth face 24 by the 3rd face 22; 3rd face 22 is formed with multiple electrical contact 25, electrical contact 25 is made up of metal material, and each electrical contact 25 all extends to fourth face 24 by substrate through hole 28 and forms multiple outer contact 26, outer contact 26 also forms arrangement mode as shown in Figure 5 B in fourth face 24 fan-out, but the arrangement mode of the external contact 26 of the present invention and electrical contact 25 is not limited.
Then, Fig. 6 is referred to, for the second embodiment of the present invention has the package module cross-sectional schematic of laminated components.As shown in Figure 6, second face 14 of the carrier 1a of the package module 4 with laminated components is as shown in Figure 4 relative with the 3rd face 22 of substrate 2 and connect, and forms the package module 4a with laminated components; In the 3rd junction of second face 14 of carrier 1a and substrate 2, each metallic contact 138 is all relative with an electrical contact 25 and connect; Compare with the package module 4a with laminated components, the package module 4 with laminated components lacks substrate 2, still can be used as the module that an encapsulation completes is encapsulated on placement rack (not shown) further, but the metallic contact 138 with the package module 4 of laminated components just needs different configuration modes to coordinate different placement racks (not shown), cause carrier 1a to carry out modular production, and then increase cost of manufacture; And the package module 4a with laminated components only needs the configuration mode of the outer contact 26 changing substrate 2 just can coordinate different placement racks (not shown), carrier 1a also can carry out modularized production, so just effectively can reduce the cost needed for encapsulation.
There is the package module 4 of laminated components, 4a as above after encapsulation completes, all can be placed in placement rack (not shown) and be electrically connected with placement rack (not shown) via metallic contact 138 or outer contact 26, simultaneously, because metal material 186 is also be exposed to have the package module 4 of laminated components, the outside of 4a, therefore there is the package module 4 of laminated components, 4a to be also electrically connected via metal material 186 and placement rack (not shown), so except the fault because short circuit causes can be reduced, the efficiency of circuit transmission also can be increased; In addition, carrier 1a only has the first platform part 133 also to encapsulate according to similar above-mentioned steps, that is, there is the package module 4 of laminated components, 4a may have and structure different shown in Fig. 4 or Fig. 6, but effect that the present invention can reach can't be affected.
Then, please refer to Fig. 7 A and Fig. 7 B, for looking schematic diagram under the carrier upper schematic diagram of the third embodiment of the present invention and the carrier of the third embodiment of the present invention.As shown in Figure 7 A, under this enforcement state, the first surface 12 of the carrier 1b that the carrier 1 shown in outward appearance to Fig. 1 is similar is configured with the second face 14 that multiple carrier perforation 18 is through to carrier 1b, crystal grain configuring area 131 is configured with multiple metallic contact 132 separately on the dual-side near two first platform part 133, each metallic contact 132 extends to the second face 14 along carrier perforation 18 separately, simultaneously, two first platform part 133 are configured with multiple metallic contact 134 separately, two second platform part 135 are configured with multiple metallic contact 136 separately, and each metallic contact 134, 136 18 extend to the second face 14 all separately along carrier perforation, significantly, this has a metal column 180 during each carrier can be made to bore a hole, each extends to the metallic contact 132 in the second face 14, 134, 136 form multiple metallic contact 132a respectively, 134a, 136a, all be connected with metal column 180 between each metallic contact 132 with metallic contact 132a, all be connected with metal column 180 between each metallic contact 134 with metallic contact 134a, all be connected with metal column 180 between each metallic contact 136 with metallic contact 136a, metallic contact 132a, 134a, 136a also forms the configuration mode of marshalling as shown in Figure 7 B, but the present invention does not limit metallic contact 132a, 134a, 136a configuring condition on the second face 14.
Then, please refer to Fig. 8 A and Fig. 8 B, for looking schematic diagram under the substrate upper schematic diagram of third embodiment of the invention and the substrate of third embodiment of the invention.As shown in Figure 8 A, substrate 2a has the 3rd face 22 and the fourth face 24 relative with the 3rd face 22, there is multiple electrical contact 25 in 3rd face 22 of substrate 2a, and each electrical contact 25 all can be corresponding with the metallic contact 132a in carrier 1b second face 14 or metallic contact 134a or metallic contact 136a; Each electrical contact 25 also extends to fourth face 24 via the substrate through hole 28 of substrate 2a by the 3rd face 22 and forms multiple outer contact 26, the arrangement mode that each outer contact 26 can be formed as shown in Figure 8 B in fourth face 24 fan-out of substrate 2a, but the present invention do not limit outer contact 26 can at the configuring condition of substrate 2c fourth face 24.
Then, Fig. 9 is referred to, for the third embodiment of the present invention has the package module cross-sectional schematic of laminated components.As shown in Figure 9, the package module 4b with laminated components has carrier 1b as shown in figures 7 a and 7b, substrate 2a as shown in Fig. 8 A, Fig. 8 B and laminated components group 3; The laminated components group 3 be made up of the first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 in the groove 13 of carrier 1b, similar to the package module 4 with laminated components shown in Fig. 4 to the annexation of groove 13 as laminated components group 3, therefore repeat no more; 3rd face 22 of substrate 2a is relative with second face 14 of carrier 1b and connect, and wherein, each metallic contact 132a, 134a, the 136a in the second face 14 all respectively with three electrical contact 25 in face 22 is relative and connect; Under preferably enforcement state, the first surface 12 of carrier 1b has an adhesive film 17 to be covered in the lump the upper end 331 of first surface 12, groove 13 and the 3rd crystal grain 33 further, and the package module 4b with laminated components encapsulated is electrically connected with outside placement rack (not shown) by outer contact 26; In addition, the package module 4h with laminated components also can not install substrate 2a additional and form another package module and be encapsulated on placement rack (not shown) further, the package module 4b with laminated components only needs the configuration mode of the outer contact 26 changing substrate 2a just can coordinate different placement racks (not shown), carrier 1b also can carry out modularized production, so just effectively can reduce the cost needed for encapsulation; In the present embodiment, can fill with colloid (not shown) further in groove 13, such as: epoxy resin, be subject to better protection to make the element in laminated components group 3 and other grooves 13; In addition, carrier 1b only has the first platform part 133 also to encapsulate according to similar above-mentioned steps, and that is, the package module 4b with laminated components may have and structure different shown in Fig. 9, but can't affect effect that the present invention can reach.
Then, referring to Figure 10, is fourth embodiment of the present invention carrier upper schematic diagram.As shown in Figure 10, the structure of carrier 1c and the carrier 1a shown in Fig. 2 A similar, maximum difference is, the metal material 186 be connected with the metallic contact 136 in carrier 1c second platform part 135, do not extend to second face 14 of carrier 1c, and the first surface 12 of carrier 1c is only extended to through groove walls 15c, metal material 186 is also electrically connected with the metallic contact 138 of multiple marshalling on the edge part 121 of first surface 12.
Then, Figure 11 is referred to, for the fourth embodiment of the present invention has the package module cross-sectional schematic of laminated components.As shown in figure 11, the package module 4c with laminated components has carrier 1c as shown in Figure 9, laminated components group 3 and the substrate shown in Fig. 5 A, Fig. 5 B 2; Wherein, it is laminated components group 3 that the first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 form in the groove 13 of carrier 1c, similar to the package module 4 with laminated components shown in Fig. 4 to the annexation of groove 13 as laminated components group 3, therefore repeat no more; Second face 22 of substrate 2 is relative with the first surface 12 of carrier 1c and connect, wherein, each electrical contact 25 metallic contact 138 that is all respective and carrier 1c first surface 12 edge part 121 in substrate 2 the 3rd face 22 is electrically connected, and the package module 4c with laminated components encapsulated is electrically connected with outside placement rack (not shown) by outer contact 26; In addition, the package module 4c with laminated components also can not install substrate 2 additional and form another package module and be encapsulated on placement rack (not shown) further, simultaneously, the package module 4c with laminated components only needs the configuration mode of the outer contact 26 changing substrate 2 just can coordinate different placement racks (not shown), carrier 1c also can carry out modularized production, so just effectively can reduce the cost needed for encapsulation; In the present embodiment, can fill with colloid (not shown) further in groove 13, such as: epoxy resin, be subject to better protection to make the element in laminated components group 3 and other grooves 13; In addition, carrier 1c only has the first platform part 133 also to encapsulate according to similar above-mentioned steps, that is, the package module 4c with laminated components may have and structure different shown in Figure 11, and only have the first platform part 133 and the first crystal grain 31, second crystal grain 32, but effect that the present invention can reach can't be affected.
Then, please refer to Figure 12 A and Figure 12 B, for looking schematic diagram under the carrier upper schematic diagram of the fifth embodiment of the present invention and the carrier of the fifth embodiment of the present invention.As illustrated in fig. 12, under this enforcement state, carrier 1d the structure of first surface 12 and arrangements of components situation similar to the carrier 1c shown in Figure 10, difference is, the edge part 121 of carrier 1d does not have metallic contact 138, meanwhile, the multiple metallic contacts 136 in the second platform part 135 are only electrically connected with metal material 184, are not electrically connected with metal material 184 further, in addition, carrier 1d has multiple carrier perforation 18 being through to the second face 14 by first surface 12 further, wherein, each metallic contact 132 in crystal grain configuring area 131 all extends to second face 14 of carrier 1d via carrier perforation 18, significantly, this can form a metal column 180 in each carrier perforation 18, each metallic contact 132 second face 14 of each comfortable carrier 1d forms metallic contact 132a, all be connected with metal column 180 between each metallic contact 132 with metallic contact 132a, metallic contact 132a forms configuring condition as shown in Figure 12 B in the second face 14 proper alignment.
Then, Figure 13 is referred to, for the fifth embodiment of the present invention has the package module cross-sectional schematic of laminated components.As shown in figure 13, the package module 4d with laminated components has carrier 1d as shown in Figure 9, laminated components group 3; Wherein, it is laminated components group 3 that the first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 form in the groove 13 of carrier 1d, similar to the package module 4 with laminated components shown in Fig. 4 to the annexation of groove 13 as laminated components group 3, therefore repeat no more; After laminated components group 3 in groove 13 has configured, optionally configure an adhesive film 17 in the first surface 12 of carrier 1d again, make laminated components group 3 can be subject to good protection; The package module 4d with laminated components can be electrically connected by the metallic contact 132a in carrier 1d second face 14 and outside placement rack (not shown).
Then, Figure 14 is referred to, for the fifth embodiment of the present invention has another execution mode cross-sectional schematic of package module of laminated components.As shown in figure 14, the package module 4d ' with laminated components is the substrate 2 configured further in carrier 1d second face 14 of the package module 4d as shown in figure 13 with laminated components as shown in Fig. 5 A, Fig. 5 B, wherein, 3rd face 22 of substrate 2 is relative with second face 14 of carrier 1d and connect, and each electrical contact 25 on the 3rd face 22 is electrically connected with each metallic contact 132a in the second face 14 respectively; The package module 4d ' with laminated components can be electrically connected with outside placement rack (not shown) by the outer contact 26 of substrate 2 fourth face 24, only need the configuration mode of the outer contact 26 changing substrate 2 just can coordinate different placement racks (not shown), carrier 1d also can carry out modularized production, so just effectively can reduce the cost needed for encapsulation; In the present embodiment, can fill with colloid (not shown) further in groove 13, such as: epoxy resin, be subject to better protection to make the element in laminated components group 3 and other grooves 13; In addition, carrier 1d only has the first platform part 133 also to encapsulate according to similar above-mentioned steps, that is, there is package module 4d, 4d of laminated components ' may have and structure different shown in Figure 13 or Figure 14, and only have the first platform part 133 and the first crystal grain 31, second crystal grain 32, but effect that the present invention can reach can't be affected.
Then, refer to Figure 15 A and Figure 15 B, under being respectively the carrier upper schematic diagram of the sixth embodiment of the present invention and the carrier of the sixth embodiment of the present invention, look schematic diagram.As shown in fig. 15, under this enforcement state, carrier 1e the structure of first surface 12 and arrangements of components situation similar to the carrier 1c shown in Figure 10, difference is, carrier 1e has multiple carrier perforation 18 being through to the second face 14 by first surface 12 further, wherein, each metallic contact 132 in crystal grain configuring area 131 all extends to second face 14 of carrier 1e via carrier perforation 18, significantly, this can form a metal column 180 in each carrier perforation 18, each metallic contact 132 second face 14 of each comfortable carrier 1e forms metallic contact 132a, all be connected with metal column 180 between each metallic contact 132 with metallic contact 132a, metallic contact 132a forms configuring condition as shown in fig. 15b in the second face 14 proper alignment.
Then, Figure 16 is referred to, for the sixth embodiment of the present invention has the package module cross-sectional schematic of laminated components.As shown in figure 16, the package module 4e with laminated components has the package module 4d of laminated components by the package module 4d and that has a laminated components " formed; comprise a carrier 1d and as shown in Figure 12 A, Figure 12 B carrier 1e as shown in Figure 15 A, Figure 15 B, the metallic contact 132a on carrier 1d second face 14 is relative with the metallic contact 132a on carrier 1e second face 14 and connect; Wherein, its arrangements of components of carrier 1d being positioned at top can form the package module 4d as shown in fig. 13 that with laminated components; Be positioned at the carrier 1e of below also with same configuration mode configuring stacking element group 3, difference is, carrier 1e first surface 12 docks with the such as substrate 2 shown in Fig. 5 A, Fig. 5 B the 3rd face 22, significantly, each electrical contact 25 in substrate 2 the 3rd face 22 is electrically connected with each metallic contact 138 of carrier 1e first surface 12 respectively, and forms the package module 4d with laminated components "; The package module 4e with laminated components can be electrically connected with outside placement rack (not shown) by the outer contact 26 of substrate 2 fourth face 24, only needs the configuration mode of the outer contact 26 changing substrate 2 just can coordinate different placement racks (not shown); The package module 4e with laminated components is a kind of stacked package (Package on Package; PoP), be by carrier 1d and carrier 1e is stacking forms simultaneously, can coordinate the crystal grain of various different size, therefore encapsulating factory does not need to make elements different too much and just can complete multiple PoP and encapsulate, effectively improves the efficiency of making PoP, reduces costs simultaneously; In the present embodiment, can fill with colloid (not shown) further in groove 13, such as: epoxy resin, be subject to better protection to make the element in laminated components group 3 and other grooves 13; In addition, carrier 1d, 1e only have the first platform part 133 also to encapsulate according to similar above-mentioned steps, that is, there is package module 4d, 4d of laminated components ", 4e may have and structure different shown in Figure 16, but can't affect effect that the present invention can reach.
Carrier 1 of the present invention, 1a, 1b, 1c, 1d, 1e do not limit the number of its platform part, that is, according to different demands, carrier 1,1a, 1b, 1c, 1d, 1e are upper except the first platform part 133, second platform part 135, the platform part of the 3rd platform part (not shown), the 4th platform part (not shown) or more can be added, to encapsulate more crystal grain in carrier 1,1a, 1b, 1c, 1d, 1e, in like manner, the present invention does not limit the number of dies in laminated components group 3; The present invention does not limit kenel and the size of the first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 yet, first crystal grain 31, second crystal grain 32 and the 3rd crystal grain 33 can be identical or different crystal grain, also the same size or different size can be had, such as, the first crystal grain 31 in one group of laminated components group 3 is control chips, and the second crystal grain 32 and the 3rd crystal grain 33 are nand flash memory (NAND Flash) chips.
As previously mentioned, carrier 1 of the present invention, 1a, 1b, 1c, 1d, 1e and substrate 2,2a all can allow the manufacturers produce beyond encapsulation factory via the setting of standardization flow process, effectively can reduce production cost, and the size making encapsulating products by standardized setting also can standardization, therefore, the present invention only needs the step of carrying out aiming at when laminated components group 3 being assembled among carrier 1,1a, 1b, 1c, 1d, 1e, then can save the step of aligning when assembling other each elements, substrate 2, 2a is by the electrical contact 25 that configures in the 3rd face 22 and carrier 1, 1a, 1b, 1c, 1d, 1e forms electric connection, the outer contact 26 configured by fourth face 24 is again formed with other bases (not shown) and is connected, wherein electrical contact 25 coordinates carrier 1, 1a, 1b, 1c, 1d carries out standard configurations, outer contact 26 then can coordinate base (not shown) to be configured, so just the operating efficiency of the manufacturer of encapsulation factory and use encapsulation finished product is increased, and modular setting also can guarantee that each solder joint is connected each other really with contact, and can reliability be increased.
Although the present invention discloses as above with aforementioned preferred embodiment; so itself and be not used to limit the present invention; any skilled person; without departing from the spirit and scope of the present invention; when doing a little change and retouching, what therefore scope of patent protection of the present invention must define depending on the right appended by this specification is as the criterion.

Claims (17)

1. there is a package module for laminated components, comprising:
One carrier, there is a first surface and relative with this first surface one second, this first surface is formed with a groove and around the edge part of this groove, this groove is configured with a crystal grain configuring area, and multiple first metallic contact of dual side-edge configuration relative on this bottom portion of groove, two platform part, be configured on this relative dual side-edge of this crystal grain configuring area respectively, make to form a pair first groove walls between this two platform part and this crystal grain configuring area, a pair second groove walls are formed between this edge part and this two platform part, and expose described first metallic contact to the open air, the height of this two platform part is equal and higher than this crystal grain configuring area, this two platform part configures multiple second metallic contact respectively, wherein, first metallic contact described in each is all corresponding with one of them of described second metallic contact, and be electrically connected with one first metal material between this corresponding first metallic contact and this second metallic contact,
One first crystal grain, has a upper end and a lower end, and on this lower end, configure multiple first weld pad, and this first crystal grain is configured in this crystal grain configuring area to cover crystalline substance, and described first weld pad and described first metallic contact are electrically connected;
One second crystal grain, has a upper end and a lower end, and on this lower end, configure multiple second weld pad, and this second crystal grain, to cover this upper end that crystalline substance is configured at this first crystal grain, makes described second metallic contact in described second weld pad and described platform part be electrically connected;
Wherein, second metallic contact described in each is electrically connected with multiple second metal material further, described second metal material extends this second that is configured to this carrier from this platform part of this carrier via this first surface, and this second metal material is positioned on this one end of second in each, form multiple respective metal end points.
2. the package module with laminated components according to claim 1, wherein this package module with laminated components has an adhesive film further, this adhesive film is positioned at this first surface of this carrier, is covered in the lump this upper end of this first surface, this groove and this second crystal grain.
3. the package module with laminated components according to claim 1 and 2, wherein this package module with laminated components has a substrate further, this substrate has one the 3rd and a fourth face relative with the 3rd, this substrate also has multiple substrate through hole to be through to this fourth face from the 3rd face, 3rd mask has multiple electrical contact, this fourth face has multiple outer contact, and electrical contact described in each all extends to this fourth face via the metal in described substrate through hole and is electrically connected with one of them of described outer contact respectively;
Wherein, the 3rd of this substrate is superimposed with this second face of this carrier, and described electrical contact is electrically connected with the described metal endpoints on this second all respectively.
4. the package module with laminated components according to claim 1, wherein this to the angle of the first groove walls and this crystal grain configuring area between 90 degree to 135 degree.
5. there is a package module for laminated components, comprising:
One carrier, there is a first surface and relative with this first surface one second, this first surface is formed with a groove and around the edge part of this groove, this groove is configured with a crystal grain configuring area, and on this bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on this dual side-edge of this crystal grain configuring area respectively, make to form a pair first groove walls between this two platform part and this crystal grain configuring area, a pair second groove walls are formed between this edge part and this two platform part, and it is adjacent and expose described first metallic contact to the open air, the height of this two platform part is equal and higher than this crystal grain configuring area, this platform part configures multiple second metallic contact, multiple through hole is configured in this crystal grain configuring area and this two platform part, each this through hole is through to this carrier second, and a metal column is configured in each this through hole,
One first crystal grain, has a upper end and a lower end, and on this lower end, configure multiple first weld pad, and this first crystal grain is configured in this crystal grain configuring area to cover crystalline substance, and described first weld pad and described first metallic contact are electrically connected;
One second crystal grain, there is a upper end and a lower end, and on this lower end, configure multiple second weld pad, this second crystal grain is to cover this upper end that crystalline substance is configured at this first crystal grain, described second metallic contact in described second weld pad and this platform part is electrically connected, and exposes this upper end of this first crystal grain of part;
Wherein, described first metallic contact and described second metallic contact are all electrically connected via the described metal column in described through hole, make described first metallic contact and described second metallic contact extend to this second of this carrier respectively, and then make each this first metallic contact and each this second metallic contact be positioned at the multiple respective metal end points of this each self-forming in one end of second.
6. according to the package module with laminated components according to claim 5, wherein this package module with laminated components has an adhesive film further, this adhesive film is positioned at this first surface of this carrier, is covered in the lump this upper end of this first surface, this groove and this second crystal grain.
7. the package module with laminated components according to claim 5 or 6, wherein this package module with laminated components has a substrate further, this substrate has one the 3rd and a fourth face relative with the 3rd, this substrate also has multiple substrate through hole to be through to this fourth face from the 3rd face, 3rd mask has multiple electrical contact, this fourth face has multiple outer contact, and electrical contact described in each all extends to this fourth face via the metal in described substrate through hole and is electrically connected with one of them of described outer contact respectively;
Wherein, the 3rd of this substrate is superimposed with this second face of this carrier, and described electrical contact is electrically connected with the described metal endpoints on this second all respectively.
8. the package module with laminated components according to claim 5, wherein this to the angle of the first groove walls and this crystal grain configuring area between 90 degree to 135 degree.
9. there is a package module for laminated components, comprising:
One carrier, there is a first surface and relative with this first surface one second, this first surface is formed with a groove and around the edge part of this groove, this groove is configured with a crystal grain configuring area, and on this bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on this relative dual side-edge of this crystal grain configuring area respectively, make to form a pair first groove walls between this two platform part and this crystal grain configuring area, a pair second groove walls are formed between this edge part and this two platform part, and it is adjacent and expose described first metallic contact to the open air, the height of this two platform part is equal and higher than this crystal grain configuring area, this two platform part configures multiple second metallic contact respectively, wherein, first metallic contact described in each is all corresponding with one of them of described second metallic contact, and be electrically connected with one first metal material between this corresponding first metallic contact and this second metallic contact,
One first crystal grain, has a upper end and a lower end, and on this lower end, configure multiple first weld pad, and this first crystal grain is configured in this crystal grain configuring area to cover crystalline substance, and described first weld pad and described first metallic contact are electrically connected;
One second crystal grain, has a upper end and a lower end, and on this lower end, configure multiple second weld pad, and this second crystal grain, to cover this upper end that crystalline substance is configured at this first crystal grain, makes described second metallic contact in described second weld pad and described platform part be electrically connected;
Wherein, the second metallic contact described in each is electrically connected with multiple second metal material further, and the second metal material described in each is configured to this edge part of this carrier from this two platform part extension of this carrier and forms a metal endpoints.
10. the package module with laminated components according to claim 9, wherein this package module with laminated components has a substrate further, this substrate has one the 3rd and a fourth face relative with the 3rd, this substrate also has multiple substrate through hole to be through to this fourth face from the 3rd face, 3rd mask has multiple electrical contact, this fourth face has multiple outer contact, and electrical contact described in each all extends to this fourth face via the metal in described substrate through hole and is electrically connected with one of them of described outer contact respectively;
Wherein, the 3rd of this substrate is superimposed with this first surface of this carrier, and described electrical contact is electrically connected with the described metal endpoints on this edge part all respectively.
11. package modules with laminated components according to claim 9, wherein the angle of this groove walls and this crystal grain configuring area is between 90 degree to 135 degree.
12. 1 kinds of package modules with laminated components, comprising:
One carrier, there is a first surface and relative with this first surface one second, this first surface is formed with a groove and around the edge part of this groove, this groove is configured with a crystal grain configuring area, and on this bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on this relative dual side-edge of this crystal grain configuring area respectively, make to form a pair first groove walls between this two platform part and this crystal grain configuring area, a pair second groove walls are formed between this edge part and this two platform part, and it is adjacent and expose described first metallic contact to the open air, the height of this two platform part is equal and higher than this crystal grain configuring area, this two platform part configures multiple second metallic contact respectively, wherein, first metallic contact described in each is all corresponding with one of them of described second metallic contact, and be electrically connected with one first metal material between this corresponding first metallic contact and this second metallic contact, multiple through hole is configured at this crystal grain configuring area, each this through hole is through to this second of this carrier, and a metal column is configured in each this through hole,
One first crystal grain, has a upper end and a lower end, and on this lower end, configure multiple first weld pad, and this first crystal grain is configured in this crystal grain configuring area to cover crystalline substance, and described first weld pad and described first metallic contact are electrically connected;
One second crystal grain, has a upper end and a lower end, and on this lower end, configure multiple second weld pad, and this second crystal grain, to cover this upper end that crystalline substance is configured at this first crystal grain, makes described second metallic contact in described second weld pad and described platform part be electrically connected;
Wherein, described first metallic contact is electrically connected via the described metal column in described through hole, make described first metallic contact extend to this second of this carrier, and then make each this first metallic contact be positioned at the multiple respective metal end points of this each self-forming in one end of second.
13. according to the package module with laminated components according to claim 12, wherein this package module with laminated components has an adhesive film further, this adhesive film is positioned at this first surface of this carrier, is covered in the lump this upper end of this first surface, this groove and this second crystal grain.
14. package modules with laminated components according to claim 12 or 13, wherein this package module with laminated components has a substrate further, this substrate has one the 3rd and a fourth face relative with the 3rd, this substrate also has multiple substrate through hole to be through to this fourth face from the 3rd face, 3rd mask has multiple electrical contact, this fourth face has multiple outer contact, and electrical contact described in each all extends to this fourth face via the metal in described substrate through hole and is electrically connected with one of them of described outer contact respectively;
Wherein, the 3rd of this substrate is superimposed with this second face of this carrier, and described electrical contact is electrically connected with the described metal endpoints on this second all respectively.
15. package modules with laminated components according to claim 12, wherein this to the angle of the first groove walls and this crystal grain configuring area between 90 degree to 135 degree.
16. 1 kinds of package modules with laminated components, comprising:
One first package module, this first package module has further:
One carrier, there is a first surface and relative with this first surface one second, this first surface is formed with a groove and around the edge part of this groove, this groove is configured with a crystal grain configuring area, and on this bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on this relative dual side-edge of this crystal grain configuring area respectively, make to form a pair first groove walls between this two platform part and this crystal grain configuring area, a pair second groove walls are formed between this edge part and this two platform part, and it is adjacent and expose described first metallic contact to the open air, the height of this two platform part is equal and higher than this crystal grain configuring area, this two platform part configures multiple second metallic contact respectively, wherein, first metallic contact described in each is all corresponding with one of them of described second metallic contact, and be electrically connected with a metal material between this corresponding first metallic contact and this second metallic contact, multiple through hole is configured at this crystal grain configuring area, each this through hole is through to this second of this carrier, and a metal column is configured in each this through hole,
One first crystal grain, has a upper end and a lower end, and on this lower end, configure multiple first weld pad, and this first crystal grain is configured in this crystal grain configuring area to cover crystalline substance, and described first weld pad and described first metallic contact are electrically connected;
One second crystal grain, has a upper end and a lower end, and on this lower end, configure multiple second weld pad, and this second crystal grain, to cover this upper end that crystalline substance is configured at this first crystal grain, makes described second metallic contact in described second weld pad and described platform part be electrically connected;
Wherein, described first metallic contact is electrically connected via the metal column in described through hole, make described first metallic contact extend to this second of this carrier, and then make each this first metallic contact be positioned at the multiple respective metal end points of this each self-forming in one end of second; And
One second package module, this second package module has further:
One carrier, there is a first surface and relative with this first surface one second, this first surface is formed with a groove and around the edge part of this groove, this groove is configured with a crystal grain configuring area, and on this bottom portion of groove, configure multiple first metallic contact, two platform part, be configured on this relative dual side-edge of this crystal grain configuring area respectively, make to form a pair first groove walls between this two platform part and this crystal grain configuring area, a pair second groove walls are formed between this edge part and this two platform part, and it is adjacent and expose described first metallic contact to the open air, the height of this two platform part is equal and higher than this crystal grain configuring area, this two platform part configures multiple second metallic contact respectively, wherein, first metallic contact described in each is all corresponding with one of them of described second metallic contact, and be electrically connected with one first metal material between this corresponding first metallic contact and this second metallic contact, second metallic contact described in each is electrically connected with multiple second metal material further, and the second metal material described in each is configured to this edge part of this carrier from this two platform part extension of this carrier and forms a first metal end point, multiple through hole is configured at this crystal grain configuring area, each this through hole is through to this second of this carrier, and a metal column is configured in each this through hole,
One first crystal grain, has a upper end and a lower end, and on this lower end, configure multiple first weld pad, and this first crystal grain is configured in this crystal grain configuring area to cover crystalline substance, and described first weld pad and described first metallic contact are electrically connected;
One second crystal grain, has a upper end and a lower end, and on this lower end, configure multiple second weld pad, and this second crystal grain, to cover this upper end that crystalline substance is configured at this first crystal grain, makes described second metallic contact in described second weld pad and described platform part be electrically connected;
One substrate, this substrate has one the 3rd and a fourth face relative with the 3rd, this substrate also has multiple substrate through hole to be through to this fourth face from the 3rd face, 3rd mask has multiple electrical contact, this fourth face has multiple outer contact, and electrical contact described in each all extends to this fourth face via the metal in described substrate through hole and is electrically connected with one of them of described outer contact respectively;
Wherein, the 3rd of this substrate is superimposed with this first surface of this carrier, and described electrical contact is electrically connected with the described the first metal end point on this edge part all respectively;
Wherein, described first metallic contact is electrically connected via the metal column in described through hole, make described first metallic contact extend to this second of this carrier, and then make each this first metallic contact be positioned at this each self-forming in one end of second multiple second metal endpoints accordingly;
Wherein, this second of this carrier of this first package module connects with this second face of this carrier of this second package module, and metal endpoints described in each on this this carrier of the first package module this second, is electrically connected with the second metal endpoints described in this each of second of this this carrier of the second package module respectively.
17. according to the package module with laminated components according to claim 16, wherein this first package module has an adhesive film further, this adhesive film is positioned at this first surface of this carrier of the first package module, is covered in the lump this upper end of this first surface, this groove and this second crystal grain.
CN201310751003.4A 2013-12-18 2013-12-31 Packaging module with stacked elements Pending CN104733447A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108028233A (en) * 2015-09-23 2018-05-11 英特尔公司 Substrate, assembly and techniques for implementing multi-chip flip chip packages
CN108793058A (en) * 2017-05-03 2018-11-13 北京万应科技有限公司 A kind of MEMS sensor system packaging structure and manufacturing method
CN111048479A (en) * 2019-12-27 2020-04-21 华天科技（西安）有限公司 Multi-chip stacking packaging structure and packaging method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040207058A1 (en) * 2002-12-30 2004-10-21 Sohn Young Ho Side braze packages
CN101170095A (en) * 2006-10-27 2008-04-30 新光电气工业株式会社 Semiconductor package and stacked layer type semiconductor package
US20090236718A1 (en) * 2008-03-19 2009-09-24 Joungin Yang Package-on-package system with internal stacking module interposer
TW201025532A (en) * 2008-12-16 2010-07-01 Powertech Technology Inc Chip stacked package having single-sided pads on chips
US20100314738A1 (en) * 2009-06-12 2010-12-16 Chi Heejo Integrated circuit packaging system with a stack package and method of manufacture thereof
CN102194805A (en) * 2010-03-18 2011-09-21 海力士半导体有限公司 Semiconductor package with stacked chips and method for manufacturing the same
US20110278721A1 (en) * 2009-11-04 2011-11-17 Stats Chippac, Ltd. Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate
US20120104623A1 (en) * 2010-10-28 2012-05-03 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Stepped Interposer for Stacking and Electrically Connecting Semiconductor Die

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040207058A1 (en) * 2002-12-30 2004-10-21 Sohn Young Ho Side braze packages
CN101170095A (en) * 2006-10-27 2008-04-30 新光电气工业株式会社 Semiconductor package and stacked layer type semiconductor package
US20090236718A1 (en) * 2008-03-19 2009-09-24 Joungin Yang Package-on-package system with internal stacking module interposer
TW201025532A (en) * 2008-12-16 2010-07-01 Powertech Technology Inc Chip stacked package having single-sided pads on chips
US20100314738A1 (en) * 2009-06-12 2010-12-16 Chi Heejo Integrated circuit packaging system with a stack package and method of manufacture thereof
US20110278721A1 (en) * 2009-11-04 2011-11-17 Stats Chippac, Ltd. Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate
CN102194805A (en) * 2010-03-18 2011-09-21 海力士半导体有限公司 Semiconductor package with stacked chips and method for manufacturing the same
US20120104623A1 (en) * 2010-10-28 2012-05-03 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Stepped Interposer for Stacking and Electrically Connecting Semiconductor Die

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108028233A (en) * 2015-09-23 2018-05-11 英特尔公司 Substrate, assembly and techniques for implementing multi-chip flip chip packages
CN108028233B (en) * 2015-09-23 2023-02-24 英特尔公司 Substrate, assembly and techniques for implementing multi-chip flip chip packages
CN108793058A (en) * 2017-05-03 2018-11-13 北京万应科技有限公司 A kind of MEMS sensor system packaging structure and manufacturing method
CN111048479A (en) * 2019-12-27 2020-04-21 华天科技（西安）有限公司 Multi-chip stacking packaging structure and packaging method thereof
CN111048479B (en) * 2019-12-27 2021-06-29 华天科技(南京)有限公司 Multi-chip stacking packaging structure and packaging method thereof

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