CN203932043U - A kind of power device of paster encapsulation - Google Patents
A kind of power device of paster encapsulation Download PDFInfo
- Publication number
- CN203932043U CN203932043U CN201420285407.9U CN201420285407U CN203932043U CN 203932043 U CN203932043 U CN 203932043U CN 201420285407 U CN201420285407 U CN 201420285407U CN 203932043 U CN203932043 U CN 203932043U
- Authority
- CN
- China
- Prior art keywords
- power device
- horizontal line
- slide glass
- paster
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 22
- 230000007704 transition Effects 0.000 claims abstract description 16
- 230000001154 acute effect Effects 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000003205 muscle Anatomy 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of power device of paster encapsulation, comprise plastic-sealed body and the paster package power device wire framework that is positioned at plastic-sealed body inside; Paster package power device wire framework comprises the fin, transition brace, the slide glass that connect successively, slide glass is provided with two leads away from a side of transition brace, slide glass surface arranges and is connected with chip by slicken solder, chip surface is by bonding wire and chip interconnection, fin, transition brace, slide glass are all positioned in same level, and wherein transition brace surface is provided with some every excessive groove; Lead is made up of the horizontal line section connecting successively, vertical line segment, lead crimp segment, horizontal line section, the vertical orthogonal connection of line segment, and the axis of horizontal line section is parallel with horizontal line, and the axis of lead crimp segment and horizontal line form acute angle K.Simple in structure, easy to operate, cost is low, makes the semiconductor device structure after encapsulation firm, and external force is damaging little to packaged chip.
Description
Technical field
The utility model relates to a kind of power device of paster encapsulation, relates to semiconductor device packaging technique, the device that particularly lead frame of the high power device of small size, low thermal resistance, easy assembling forms.
Background technology
Semiconductor is applied extremely extensive in our real life, conventional large-power semiconductor device is divided into the packing forms such as TO-220, TO-247 and TO-3P conventionally, be applied in circuit is all straight cutting mode conventionally, device pin is all vertical with PCB circuit board with body, and need to increase aluminium or copper radiating rib heat radiation, the utility model patent is the device that the lead frame of SMD power device forms.
Utility model content
The purpose of this utility model is to provide a kind of power device of paster encapsulation, and the infiltration of having stopped the liquid in device post-production and the assembling process after encapsulated moulding has improved the air-tightness of device.
The purpose of this utility model is achieved through the following technical solutions: a kind of power device of paster encapsulation, comprises plastic-sealed body and the paster package power device wire framework that is positioned at plastic-sealed body inside; Paster package power device wire framework comprises the fin, transition brace, the slide glass that connect successively, slide glass is provided with two leads away from a side of transition brace, slide glass surface arranges and is connected with chip by slicken solder, chip surface is by bonding wire and chip interconnection, fin, transition brace, slide glass are all positioned in same level, and wherein transition brace surface is provided with some every excessive groove; Lead is made up of the horizontal line section connecting successively, vertical line segment, lead crimp segment, horizontal line section, the vertical orthogonal connection of line segment, and the axis of horizontal line section is parallel with horizontal line, and the axis of lead crimp segment and horizontal line form acute angle K.
The acute angle K forming, can make lead (pin), fin contact PCB circuit board completely, reduces bad risk and the thermal resistance of device contacts, has improved the reliability of device.The angle of general K is less than 10 °.This forms slope, in the time of crimping, can make after the distortion of the vertical line segment of lead crimp segment utilization, and lead crimp segment level is compressed on PCB circuit board, forms elastic compression joint, reduces the bad risk of device contacts.
Be blockage connected in star every excessive groove.
Being multiple row multirow array every excessive groove distributes.
Fin is a plate body.
2 leads are provided with fairlead, and fairlead is positioned at plastic-sealed body inside.
Described fairlead is screwed hole, and its fairlead aperture surface is provided with thread protrusion.
Slide glass is equicrural ladder plate.
Every the groove infiltration that can effectively stop the liquid in device post-production and the assembling process after encapsulated moulding of overflowing, improve the air-tightness of device; Improve the adhesive force of sealing molding procedure epoxy resin and lead frame simultaneously, improved the mechanical strength of product.Sealing in molding procedure, excessive liquid-state epoxy resin automatic filling is not to can be excessive in the groove that overflows, thereby can achieve the above object.
Preferably, through research, be blockage connected in star every excessive groove.Why adopting blockage connected in star is because the loading of blockage connected in star is large, can form cancellated structure.
In order to form cancellated structure, be multiple row multirow array every excessive groove and distribute.
Preferably, fin is not provided with fin through hole.The screw hole part of the top lock fin of conventional products is removed, reduced device volume; The consumption that has reduced device copper material, has reduced material cost.
Fin through hole is made up of manhole and strip through hole, and the projection of strip through hole and manhole projection exist the region that partially overlaps.As above arrange, the screw hole opening of fin expands, and has reduced the stress of this lead-in wire; Cut muscle, gradation at later stage product, the shearing force while seeing the finished product being packaged into this framework declines, and has reduced the damage of external force to packaged chip, has improved device reliability simultaneously.
Three lead-in wires comprise 2 leads and 1 outer lead, and outer lead is between 2 leads, and 2 leads are provided with fairlead.Make to seal the resin through hole of moulding, guarantee that lead-in wire and resin combine together completely, avoid lead-in wire to be subject to the mechanical failure in external impacts process in processing etc., improve product reliability.
Described fairlead is screwed hole, and its fairlead aperture surface is provided with thread protrusion.Thread protrusion is set and can further improves the effect that above-mentioned lead-in wire and resin combine together completely.
Preferably, slide glass is equicrural ladder plate.
Device is completely parallel with PCB circuit board and be attached to PCB above, has saved the space of terminal electronic Product Assembly device.
Conventional products is manual card at upper PCB circuit board, but product is paster technique, automatically binds by SMD board, and production efficiency is provided.
The utility model has the advantage of: simple in structure, easy to operate, cost is low, make the semiconductor device structure after encapsulation firm, external force is damaging little to packaged chip.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is end view of the present utility model.
Reference numeral in figure is expressed as: 1, fin; 2, slide glass; 3, slicken solder; 4, chip; 5, bonding wire; 6, plastic-sealed body; 7, lead; 8, lead crimp segment.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but execution mode of the present utility model is not limited to this.
Embodiment 1:
As shown in Fig. 1 and Fig. 2, Fig. 3.
A power device for paster encapsulation, comprises plastic-sealed body 6 and the paster package power device wire framework that is positioned at plastic-sealed body 6 inside; Paster package power device wire framework comprises the fin 1, transition brace, the slide glass 2 that connect successively, slide glass 2 is provided with two leads 7 away from a side of transition brace, slide glass 2 surfaces arrange and are connected with chip 4 by slicken solder 3, chip 4 surfaces are connected with lead 7 by bonding wire 5, fin 1, transition brace, slide glass 2 are all positioned in same level, and wherein transition brace surface is provided with some every excessive groove; Lead 7 is made up of the horizontal line section connecting successively, vertical line segment, lead crimp segment 8, horizontal line section, the vertical orthogonal connection of line segment, and the axis of horizontal line section is parallel with horizontal line, and the axis of lead crimp segment 8 and horizontal line form acute angle K.
The acute angle K forming, can make lead pin, fin contact PCB circuit board completely, reduces bad risk and the thermal resistance of device contacts, has improved the reliability of device.The angle of general K is less than 10 °.This forms slope, in the time of crimping, can make lead crimp segment 8 utilize after the distortion of vertical line segment, and lead crimp segment 8 levels are compressed on PCB circuit board, forms elastic compression joint, reduces the bad risk of device contacts.
Be blockage connected in star every excessive groove.
Being multiple row multirow array every excessive groove distributes.
Fin is a plate body.
2 leads 7 are provided with fairlead, and fairlead is positioned at plastic-sealed body 6 inside.
Described fairlead is screwed hole, and its fairlead aperture surface is provided with thread protrusion.
Slide glass 2 is equicrural ladder plate.
Every the groove infiltration that can effectively stop the liquid in device post-production and the assembling process after encapsulated moulding of overflowing, improve the air-tightness of device; Improve the adhesive force of sealing molding procedure epoxy resin and lead frame simultaneously, improved the mechanical strength of product.Sealing in molding procedure, excessive liquid-state epoxy resin automatic filling is not to can be excessive in the groove that overflows, thereby can achieve the above object.
Preferably, through research, be blockage connected in star every excessive groove.Why adopting blockage connected in star is because the loading of blockage connected in star is large, can form cancellated structure.
In order to form cancellated structure, be multiple row multirow array every excessive groove and distribute.
Preferably, fin is not provided with fin through hole.The screw hole part of the top lock fin of conventional products is removed, reduced device volume; The consumption that has reduced device copper material, has reduced material cost.
Fin through hole is made up of manhole and strip through hole, and the projection of strip through hole and manhole projection exist the region that partially overlaps.As above arrange, the screw hole opening of fin expands, and has reduced the stress of this lead-in wire; Cut muscle, gradation at later stage product, the shearing force while seeing the finished product being packaged into this framework declines, and has reduced the damage of external force to packaged chip, has improved device reliability simultaneously.
Three lead-in wires comprise 2 leads and 1 outer lead, and outer lead is between 2 leads, and 2 leads are provided with fairlead.Make to seal the resin through hole of moulding, guarantee that lead-in wire and resin combine together completely, avoid lead-in wire to be subject to the mechanical failure in external impacts process in processing etc., improve product reliability.
Described fairlead is screwed hole, and its fairlead aperture surface is provided with thread protrusion.Thread protrusion is set and can further improves the effect that above-mentioned lead-in wire and resin combine together completely.
Preferably, slide glass is equicrural ladder plate.
Device is completely parallel with PCB circuit board and be attached to PCB above, has saved the space of terminal electronic Product Assembly device.
Conventional products is manual card at upper PCB circuit board, but product is paster technique, automatically binds by SMD board, and production efficiency is provided.
As mentioned above, can well realize the utility model.
Claims (7)
1. a power device for paster encapsulation, is characterized in that: comprise plastic-sealed body (6) and be positioned at the inner paster package power device wire framework of plastic-sealed body (6); Paster package power device wire framework comprises the fin (1), transition brace, the slide glass (2) that connect successively, slide glass (2) is provided with two leads (7) away from a side of transition brace, slide glass (2) surface arranges and is connected with chip (4) by slicken solder (3), chip (4) surface is connected with lead (7) by bonding wire (5), fin (1), transition brace, slide glass (2) are all positioned in same level, and wherein transition brace surface is provided with some every excessive groove; Lead (7) is made up of the horizontal line section connecting successively, vertical line segment, lead crimp segment (8), horizontal line section, the vertical orthogonal connection of line segment, the axis of horizontal line section is parallel with horizontal line, and the axis of lead crimp segment (8) and horizontal line form acute angle K.
2. the power device of a kind of paster encapsulation according to claim 1, is characterized in that: be blockage connected in star every excessive groove.
3. the power device of a kind of paster encapsulation according to claim 1, is characterized in that: be multiple row multirow array every excessive groove and distribute.
4. according to the power device of a kind of paster encapsulation described in any one in claim 1-3, it is characterized in that: fin is a plate body.
5. according to the power device of a kind of paster encapsulation described in any one in claim 1-3, it is characterized in that: 2 leads (7) are provided with fairlead, fairlead is positioned at plastic-sealed body (6) inside.
6. the power device of a kind of paster encapsulation according to claim 5, is characterized in that: described fairlead is screwed hole, and its fairlead aperture surface is provided with thread protrusion.
7. according to the power device of a kind of paster encapsulation described in any one in claim 1-3, it is characterized in that: slide glass (2) is equicrural ladder plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420285407.9U CN203932043U (en) | 2014-05-30 | 2014-05-30 | A kind of power device of paster encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420285407.9U CN203932043U (en) | 2014-05-30 | 2014-05-30 | A kind of power device of paster encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203932043U true CN203932043U (en) | 2014-11-05 |
Family
ID=51827813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420285407.9U Expired - Fee Related CN203932043U (en) | 2014-05-30 | 2014-05-30 | A kind of power device of paster encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203932043U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711319A (en) * | 2016-12-23 | 2017-05-24 | 无锡市好达电子有限公司 | Chip isolating slot of surface acoustic wave filter with CSP (Chip Scale Package) |
-
2014
- 2014-05-30 CN CN201420285407.9U patent/CN203932043U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711319A (en) * | 2016-12-23 | 2017-05-24 | 无锡市好达电子有限公司 | Chip isolating slot of surface acoustic wave filter with CSP (Chip Scale Package) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 |