CN102184907A - To3p waterproof sealing lead frame - Google Patents
To3p waterproof sealing lead frame Download PDFInfo
- Publication number
- CN102184907A CN102184907A CN2011100975686A CN201110097568A CN102184907A CN 102184907 A CN102184907 A CN 102184907A CN 2011100975686 A CN2011100975686 A CN 2011100975686A CN 201110097568 A CN201110097568 A CN 201110097568A CN 102184907 A CN102184907 A CN 102184907A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- to3p
- waterproof sealing
- chip bottom
- dao
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides a TO3P waterproof sealing lead frame which has high bonding strength with plastic and good waterproof property. The TO3P waterproof sealing lead frame consists of a radiating fixed part, a chip bottom base island and an outer lead, wherein a chip is arranged at the center of the chip bottom base island. The TO3P waterproof sealing lead frame is characterized in that V-shaped water-retaining troughs are arranged at the periphery of the center of the chip bottom base island, and concave-convex grooves are arranged on the periphery outside the V-shaped water-retaining troughs of the chip bottom base island.
Description
Technical field
The present invention relates to the technical field of semiconductor packages, be specially TO3P waterproof sealing lead frame.
Background technology
Existing TO3P sealed lead frame carries out plastic packaging after the chip section substrate of chip and lead frame is seated, because chip bottom Ji Dao's is the plane all around, so the bond strength of lead frame and plastic cement is low, water proofing property is poor.
Summary of the invention
At the problems referred to above, the invention provides TO3P waterproof sealing lead frame, it makes bond strength height, the good waterproof performance of lead frame and plastic cement.
TO3P waterproof sealing lead frame, its technical scheme is such: it comprises heat radiation fixed part, chip bottom Ji Dao, outer pin, chip is installed at the center of described chip bottom Ji Dao, it is characterized in that: have the V-type water-blocking groove around the center of described chip bottom Ji Dao, have tongue and groove around the V-type water-blocking groove outside of described chip bottom Ji Dao.
It is further characterized in that: the described V-type water-blocking groove around the center of described chip bottom Ji Dao is interconnected and forms a closed space;
Described tongue and groove around the center of described chip bottom Ji Dao is connected and forms a closed space;
Described tongue and groove is specially the not grooving of mid portion of any two adjacent grooves and the structure that is combined to form.
After adopting said structure of the present invention, after chip was installed in the center of chip section Ji Dao, because the existence of tongue and groove, the bond strength height of lead frame behind the plastic packaging and plastic cement, good waterproof performance were because water proofing property has further been guaranteed in the existence of V-type water-blocking groove.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is that the A-A of Fig. 1 cuts open the structural representation enlarged drawing;
Fig. 3 is that the B-B of Fig. 2 cuts open the structural representation enlarged drawing.
Embodiment
See Fig. 1, Fig. 2, Fig. 3, it comprises fin fixed part 1, chip bottom base island 2, outer pin 3, the center on chip bottom base island 2 is installed chip and (is not drawn among the figure, belong to existing mature structure), have V-type water-blocking groove 4 around the center on chip bottom base island 2, chip bottom base island 2 be positioned at V-type water-blocking groove 4 outsides around have a tongue and groove 5, V-type water-blocking groove 4 all around is connected and forms a closed space; Tongue and groove 5 all around is connected and forms a closed space, and tongue and groove 5 is specially the not grooving of mid portion of any two adjacent grooves 6 and the structure that is combined to form.
Wherein: TO3P is the model of lead frame.
Claims (4)
1.TO3P waterproof sealing lead frame, it comprises heat radiation fixed part, chip bottom Ji Dao, outer pin, chip is installed at the center of described chip bottom Ji Dao, it is characterized in that: have the V-type water-blocking groove around the center of described chip bottom Ji Dao, have tongue and groove around the V-type water-blocking groove outside of described chip bottom Ji Dao.
2. TO3P waterproof sealing lead frame according to claim 1 is characterized in that: the described V-type water-blocking groove around the center of described chip bottom Ji Dao is interconnected and forms a closed space.
3. TO3P waterproof sealing lead frame according to claim 1 is characterized in that: the described tongue and groove around the center of described chip bottom Ji Dao is connected and forms a closed space.
4. according to the described TO3P waterproof sealing of arbitrary claim lead frame among the claim 1-3, it is characterized in that: described tongue and groove is specially the not grooving of mid portion of any two adjacent grooves and the structure that is combined to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100975686A CN102184907A (en) | 2011-04-19 | 2011-04-19 | To3p waterproof sealing lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100975686A CN102184907A (en) | 2011-04-19 | 2011-04-19 | To3p waterproof sealing lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102184907A true CN102184907A (en) | 2011-09-14 |
Family
ID=44571060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100975686A Pending CN102184907A (en) | 2011-04-19 | 2011-04-19 | To3p waterproof sealing lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102184907A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790037A (en) * | 2012-08-03 | 2012-11-21 | 无锡红光微电子有限公司 | SOT89-3L packaging lead frame |
| CN103633057A (en) * | 2013-12-12 | 2014-03-12 | 南通华隆微电子有限公司 | TO-220HF waterproof sealing lead frame |
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
| CN104143518A (en) * | 2013-05-10 | 2014-11-12 | 瑞萨电子株式会社 | Method of manufacturing semiconductor device and semiconductor device |
Citations (7)
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| US5886400A (en) * | 1995-08-31 | 1999-03-23 | Motorola, Inc. | Semiconductor device having an insulating layer and method for making |
| CN2893922Y (en) * | 2006-04-19 | 2007-04-25 | 宁波康强电子股份有限公司 | Improved large-power lead wire frame |
| CN201017876Y (en) * | 2007-03-15 | 2008-02-06 | 宁波华龙电子有限公司 | Waterproof type plastic capsulation series lead wire frame |
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN101442035A (en) * | 2008-12-14 | 2009-05-27 | 天水华天科技股份有限公司 | Flat non down-lead encapsulation piece and method for producing the same |
| CN101512756A (en) * | 2006-08-29 | 2009-08-19 | 费查尔德半导体有限公司 | Semiconductor die package including stacked dice and heat sink structures |
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
-
2011
- 2011-04-19 CN CN2011100975686A patent/CN102184907A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5886400A (en) * | 1995-08-31 | 1999-03-23 | Motorola, Inc. | Semiconductor device having an insulating layer and method for making |
| CN2893922Y (en) * | 2006-04-19 | 2007-04-25 | 宁波康强电子股份有限公司 | Improved large-power lead wire frame |
| CN101512756A (en) * | 2006-08-29 | 2009-08-19 | 费查尔德半导体有限公司 | Semiconductor die package including stacked dice and heat sink structures |
| CN201017876Y (en) * | 2007-03-15 | 2008-02-06 | 宁波华龙电子有限公司 | Waterproof type plastic capsulation series lead wire frame |
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN101442035A (en) * | 2008-12-14 | 2009-05-27 | 天水华天科技股份有限公司 | Flat non down-lead encapsulation piece and method for producing the same |
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790037A (en) * | 2012-08-03 | 2012-11-21 | 无锡红光微电子有限公司 | SOT89-3L packaging lead frame |
| CN104143518A (en) * | 2013-05-10 | 2014-11-12 | 瑞萨电子株式会社 | Method of manufacturing semiconductor device and semiconductor device |
| CN103633057A (en) * | 2013-12-12 | 2014-03-12 | 南通华隆微电子有限公司 | TO-220HF waterproof sealing lead frame |
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110914 |