CN204668294U - A kind of TO-220 air-tightness frame structure - Google Patents
A kind of TO-220 air-tightness frame structure Download PDFInfo
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- CN204668294U CN204668294U CN201520228628.7U CN201520228628U CN204668294U CN 204668294 U CN204668294 U CN 204668294U CN 201520228628 U CN201520228628 U CN 201520228628U CN 204668294 U CN204668294 U CN 204668294U
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Abstract
The utility model relates to a kind of TO-220 air-tightness frame structure, comprise chip installation portion, described chip installation portion one end is connected with fin, described fin is provided with a circular mounting hole, the described chip installation portion other end is welded with support lead, it is characterized in that: on described chip installation portion, neck front is provided with the first groove and the second groove, and the back side is provided with the first groove, described second groove is arranged in described first groove.The first groove that the utility model is arranged and the second groove can be that neck better combines with plastics, and the impact that the unnecessary copper material of muscle excision heat radiation fixed part transmits stress is cut in minimizing; Increase assembling area, have the original maximum maximum chip area being assembled into wide 6.0mm height 4.5mm, the maximum chip area of wide 6.5mm height 4.7mm after change, can be increased to.
Description
Technical field
The utility model relates to field of semiconductor manufacture, particularly relates to a kind of TO-220 air-tightness frame structure.Frame.
Background technology
In the process adopting lead-frame packages semiconductor device, need to carry out plastic packaging after chip is placed on the chip section of lead frame, in order to make the semiconductor device after plastic packaging, there is stronger air-tightness, current lead frame has groove in the edge of chip section usually, and seal groove is provided with inside groove, groove and seal groove the bond strength that can strengthen lead frame and plastic packaging material is set, thus make semiconductor device have certain air-tightness.But the lead frame changing profile of general design at present, the adhesion of plastic packaging material and lead frame is insecure, air-tightness is good not, maintains and does not have better anti-impact force, effectively can not ensure the reliability of product in operations such as immersion, plating and Trim Moldings.
Because above-mentioned defect, the design people, actively in addition research and innovation, to founding a kind of TO-220 air-tightness frame structure of new structure, make it have more value in industry.
Utility model content
For solving the problems of the technologies described above, the purpose of this utility model is to provide a kind of the purpose of this utility model and is to address the deficiencies of the prior art, and provides the TO-220 that a kind of waterproof seal is good and anti-impact force is strong waterproof sealed lead wire frame.
The technical solution of the utility model is as follows:
A kind of TO-220 air-tightness frame structure, comprise chip installation portion, described chip installation portion one end is connected with fin, described fin is provided with a circular mounting hole, the described chip installation portion other end is welded with support lead, it is characterized in that: on described chip installation portion, neck front is provided with the first groove and the second groove, and the back side is provided with the first groove, described second groove is arranged in described first groove.
Further, the wide 0.7mm of the wide 0.9mm of the long 3.3mm of described first groove, the long 3.0mm of described second groove.
Further, described chip installation portion upper side frame, left frame and left frame are provided with oblique angle.
Further, the angle at described oblique angle is 15 °.
Further, the degree of depth at described oblique angle is 0.16 ± 0.02mm.
Further, described chip installation portion is provided with the first square and the second square, wherein said second square is positioned at described first square interior.
Further, described first square and the second square pitch are 0.1mm.
Further, described first square and the second foursquare depth of cup are 0.16mm ± 0.02.
By such scheme, the utility model at least has the following advantages:
(1) the first groove arranged and the second groove can be that neck better combines with plastics, and the impact that the unnecessary copper material of muscle excision heat radiation fixed part transmits stress is cut in minimizing.
(2) increase assembling area, have the original maximum maximum chip area being assembled into wide 6.0mm height 4.5mm, the maximum chip area of wide 6.5mm height 4.7mm after change, can be increased to.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.
Accompanying drawing explanation
This use of Fig. 1 new structure schematic diagram;
The novel upper neck enlarged diagram of this use of Fig. 2;
Fig. 3 originally uses novel upper side frame, left frame and left frame oblique angle schematic diagram;
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples for illustration of the utility model, but are not used for limiting scope of the present utility model.
See Fig. 1, a kind of TO-220 air-tightness of one described in the utility model one preferred embodiment frame structure, comprise chip installation portion 1, described chip installation portion 1 one end is connected with fin 2, described fin 2 is provided with a circular mounting hole 3, described chip installation portion 1 other end is welded with support lead 4, on described chip installation portion, neck 5 front is provided with the first groove 502 and the second groove 501, the back side is provided with the first groove 502, described second groove 501 is arranged in described first groove 502, see Fig. 2, the wherein wide 0.9mm of the long 3.3mm of the first groove 502, the wide 0.7mm of the long 3.0mm of described second groove 501.See Fig. 3, chip installation portion 1 upper side frame, left frame and left frame are provided with oblique angle 103, and wherein the angle at oblique angle is 15 °, and the degree of depth at oblique angle is 0.16 ± 0.02mm.Chip installation portion 1 is provided with the first square 101 and the second square 102, it is inner that wherein said second square 102 is positioned at described first square 101, first square 101 and the second square 102 spacing are 0.1mm, and the depth of cup of the first square 101 and the second square 102 is 0.16mm ± 0.02.
The above is only preferred implementation of the present utility model; be not limited to the utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvement and modification, these improve and modification also should be considered as protection range of the present utility model.
Claims (8)
1. a TO-220 air-tightness frame structure, comprise chip installation portion, described chip installation portion one end is connected with fin, described fin is provided with a circular mounting hole, the described chip installation portion other end is welded with support lead, it is characterized in that: on described chip installation portion, neck front is provided with the first groove and the second groove, and the back side is provided with the first groove, described second groove is arranged in described first groove.
2. a kind of TO-220 air-tightness frame structure according to claim 1, is characterized in that: the wide 0.7mm of the wide 0.9mm of the long 3.3mm of described first groove, the long 3.0mm of described second groove.
3. a kind of TO-220 air-tightness frame structure according to claim 1, is characterized in that: described chip installation portion upper side frame, left frame and left frame are provided with oblique angle.
4. a kind of TO-220 air-tightness frame structure according to claim 3, is characterized in that: the angle at described oblique angle is 15 °.
5. a kind of TO-220 air-tightness frame structure according to claim 3, is characterized in that: the degree of depth at described oblique angle is 0.16 ± 0.02mm.
6. a kind of TO-220 air-tightness frame structure according to claim 1, is characterized in that: described chip installation portion is provided with the first square and the second square, wherein said second square is positioned at described first square interior.
7. a kind of TO-220 air-tightness frame structure according to claim 6, is characterized in that: described first square and the second square pitch are 0.1mm.
8. a kind of TO-220 air-tightness frame structure according to claim 7, is characterized in that: described first square and the second foursquare depth of cup are 0.16mm ± 0.02.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520228628.7U CN204668294U (en) | 2015-04-15 | 2015-04-15 | A kind of TO-220 air-tightness frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520228628.7U CN204668294U (en) | 2015-04-15 | 2015-04-15 | A kind of TO-220 air-tightness frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204668294U true CN204668294U (en) | 2015-09-23 |
Family
ID=54138650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520228628.7U Active CN204668294U (en) | 2015-04-15 | 2015-04-15 | A kind of TO-220 air-tightness frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204668294U (en) |
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2015
- 2015-04-15 CN CN201520228628.7U patent/CN204668294U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Donghai Semiconductor Technology Co., Ltd. Address before: Block D16-2, Shuofang Industrial Concentration Zone, Wuxi New District, Jiangsu Province, 214000 Patentee before: Wuxi Roum Semiconductor Technology Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Donghai Semiconductor Co.,Ltd. Address before: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI ROUM SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |