CN203617280U - Lead frame convenient for bonding wires - Google Patents
Lead frame convenient for bonding wires Download PDFInfo
- Publication number
- CN203617280U CN203617280U CN201320700238.6U CN201320700238U CN203617280U CN 203617280 U CN203617280 U CN 203617280U CN 201320700238 U CN201320700238 U CN 201320700238U CN 203617280 U CN203617280 U CN 203617280U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- terminal pin
- pin
- slide glass
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a lead frame convenient for bonding wires, which is formed by arranging 48 lead frame units (1) in a single row through connecting ribs (2), wherein the lead frame unit (1) comprises a chip loading area (3) and lead pins, the lead pins comprise a middle lead pin (4), a left lead pin (5) and a right lead pin (6), the chip loading area (3) is fixedly connected with the right lead pin (6), the upper part of the middle lead pin (4) and the upper part of the left lead pin (5) are provided a bonding portion (7), and one side of the chip loading area (3) is provided with a radiating fin. The lead frame disclosed by the utility model has the advantages that the structure is simple, bonded wires are not easy to be connected, welding wires are saved, and the cost is reduced.
Description
Technical field
The utility model is specifically related to lead frame, is particularly convenient to beat the lead frame of silk.
Background technology
Along with the development of electron trade, semiconductor device adopts the more and more many of Plastic Package form, this just need to adapt to the lead frame of various different model plastic devices, and lead frame must adapt to the requirement of heat radiation, conduction and the carrying high-power chip of epoxy seal semiconductor device.
Lead frame is beating in silk process, and traditional slide glass district and the position relationship of bonding region can cause while breaking silk and easily cause and be connected, and have wasted welding wire, have increased cost.
Utility model content
Problem to be solved in the utility model be to provide a kind of simple in structure, to break silk be to be difficult for being connected having saved welding wire, having reduced the lead frame of cost.
For addressing the above problem, the technical scheme that the utility model provides is: the lead frame of being convenient to beat silk, connected to form by dowel is single by 48 lead frame unit, lead frame unit comprises slide glass district and terminal pin, described terminal pin comprises middle leads pin, left side terminal pin and right side terminal pin, described slide glass district is fixedly connected with right side terminal pin, and described middle leads pin and terminal pin top, left side are provided with bonding part, and described slide glass district one side is provided with heat radiating fin.
As further improvement of the utility model, described bonding part is provided with electrodeposited coating, and the thickness of described electrodeposited coating is at least 3 μ m.The length in described slide glass district is 2.14-2.18mm, and width is 2.02-2.06mm.
The utility model compared with prior art has the following advantages.
(1), be convenient to beat the lead frame of silk, connected to form by dowel is single by 48 lead frame unit, lead frame unit comprises slide glass district and terminal pin, described terminal pin comprises middle leads pin, left side terminal pin and right side terminal pin, described slide glass district is fixedly connected with right side terminal pin, described middle leads pin and terminal pin top, left side are provided with bonding part, the utility model has changed the position of bonding part and slide glass district in traditional handicraft, semi-surrounding slide glass district, bonding region, lead frame of the present utility model should not be connected in the time breaking silk, the length of having saved welding wire is cost, improve industrial efficiency, the utility model is generally applied in miniwatt energy-saving lamp.Described slide glass district one side is provided with heat radiating fin, has guaranteed use safety and the life-span of lead frame.
(2), described bonding part is provided with electrodeposited coating, the thickness of described electrodeposited coating is at least 3 μ m.The length in described slide glass district is 2.14-2.18mm, and width is 2.02-2.06mm.Electrodeposited coating has guaranteed conductivity of the present utility model, can select silver-plated or copper facing.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model is convenient to the lead frame of breaking silk.
In figure: 1-lead frame unit, 2-dowel, 3-slide glass district, 4-middle leads pin, 5-left side terminal pin, 6-right side terminal pin, 7-bonding part.
Embodiment
Below in conjunction with drawings and Examples, the utility model is improved further to explanation.
As shown in Figure 1, be convenient to beat the lead frame of silk, connected to form by dowel 2 is single by 48 lead frame unit 1, lead frame unit 1 comprises slide glass district 3 and terminal pin, terminal pin comprises middle leads pin 4, left side terminal pin 5 and right side terminal pin 6, slide glass district 3 is fixedly connected with right side terminal pin 6, and middle leads pin 4 and left side terminal pin 5 tops are provided with bonding part 7, and slide glass district 3 one sides are provided with heat radiating fin.Bonding part 7 is provided with electrodeposited coating, and the thickness of electrodeposited coating is 3 μ m.The length in slide glass district 3 is 2.16mm, and width is 2.04mm.
Teachings herein is example of the present utility model and explanation; but do not mean that the obtainable advantage of the utility model is so limited, may be to wherein one or more of the advantage realizing in the simple transformation of structure and/or some execution modes all in the application's protection range in every the utility model practice process.
Claims (3)
1. be convenient to beat the lead frame of silk, it is characterized in that: by 48 lead frame unit (1) by single the connecting to form of dowel (2), lead frame unit (1) comprises slide glass district (3) and terminal pin, described terminal pin comprises middle leads pin (4), left side terminal pin (5) and right side terminal pin (6), described slide glass district (3) is fixedly connected with right side terminal pin (6), described middle leads pin (4) and left side terminal pin (5) top are provided with bonding part (7), and described slide glass district (3) one sides are provided with heat radiating fin.
2. the lead frame of being convenient to beat silk according to claim 1, is characterized in that: described bonding part (7) is provided with electrodeposited coating, and the thickness of described electrodeposited coating is at least 3 μ m.
3. the lead frame of being convenient to beat silk according to claim 1, is characterized in that: the length in described slide glass district (3) is 2.14-2.18mm, and width is 2.02-2.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320700238.6U CN203617280U (en) | 2013-11-08 | 2013-11-08 | Lead frame convenient for bonding wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320700238.6U CN203617280U (en) | 2013-11-08 | 2013-11-08 | Lead frame convenient for bonding wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617280U true CN203617280U (en) | 2014-05-28 |
Family
ID=50769906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320700238.6U Expired - Fee Related CN203617280U (en) | 2013-11-08 | 2013-11-08 | Lead frame convenient for bonding wires |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617280U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617975A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Wire forging-facilitating lead frame |
-
2013
- 2013-11-08 CN CN201320700238.6U patent/CN203617280U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617975A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Wire forging-facilitating lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20141108 |
|
| EXPY | Termination of patent right or utility model |