CN203617271U - High-power plastic package lead frame - Google Patents
High-power plastic package lead frame Download PDFInfo
- Publication number
- CN203617271U CN203617271U CN201320700127.5U CN201320700127U CN203617271U CN 203617271 U CN203617271 U CN 203617271U CN 201320700127 U CN201320700127 U CN 201320700127U CN 203617271 U CN203617271 U CN 203617271U
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- CN
- China
- Prior art keywords
- lead frame
- fin
- thickness
- heat radiating
- power plastic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high-power plastic package lead frame, which is formed by arranging 30 lead frame units (1) in a single row, wherein the lead frame unit (1) comprises a base body (2), lead pins (3) and a connecting rib (4), the lead frame units are connected with each other through the connecting ribs (4), the connecting rib (4) is provided with a positioning hole, the diameter of the positioning hole (5) is 2-2.04mm, the upper part of the lead pin (3) is provided with a coining area (6), the thickness of the lead pin is 0.485-0.515mm, the surface of the base body (2) and the surface of the coining area are provided with a silver coating, the thickness of the silver coating is at least 0.03mum, the base body comprises a mounting groove and a heat radiating piece, the mounting groove is arranged on the heat radiating piece, the heat radiating piece is provided with an opening (8), the surface of the heat radiating piece is provided with radiating fins, and the number of the radiating fins is at least three. The high-power plastic package lead frame is simple in structure, convenient for mold production, and good in conductivity and heat radiating performance.
Description
Technical field
The utility model is specifically related to lead frame, particularly high-power plastic packaging lead frame.
Background technology
Along with the development of electron trade, semiconductor device adopts the more and more many of Plastic Package form, this just need to adapt to the lead frame of various different model plastic devices, and lead frame must adapt to the requirement of heat radiation, conduction and the carrying high-power chip of epoxy seal semiconductor device.
In process of production, size, electric conductivity and heat dispersion to lead frame require the highest lead frame.
Utility model content
Problem to be solved in the utility model is to provide a kind of lead frame of being convenient to mould production, electric conductivity and perfect heat-dissipating simple in structure.
For addressing the above problem, the technical scheme that the utility model provides is: high-power plastic packaging lead frame, by 30 single connecting to form in lead frame unit, described lead frame unit comprises matrix, terminal pin and dowel, described lead frame connects by dowel between unit, described dowel is provided with location hole, described location hole aperture is 2-2.04mm, described terminal pin top is provided with pressure-sizing district, the thickness of described terminal pin is 0.485-0.515mm, described matrix and surface, pressure-sizing district are provided with silver coating, described silver coating thickness is at least 0.03 μ m, described matrix comprises mounting groove and fin, described mounting groove is located on fin, described fin is provided with opening, described fin surface is provided with heat radiating fin, heat radiating fin can be in fin front, the back side or side, according to product requirement setting, described heat radiating fin is provided with at least three.
As further improvement of the utility model, the described matrix back side is provided with radiating groove, and described radiating groove is that cross section is the groove of triangle, circle or swallow-tail form, described heat radiation groove depth 0.1mm, the thickness of described fin is 0.3mm, and the thickness of described mounting groove is 0.2mm.
The utility model compared with prior art has the following advantages.
(1), high-power plastic packaging lead frame, by 30 single connecting to form in lead frame unit, described lead frame unit comprises matrix, terminal pin and dowel, described lead frame connects by dowel between unit, described dowel is provided with location hole, and described location hole aperture is 2-2.04mm, can guarantee that the entirety of high-power plastic packaging lead frame is fixed, can reduce again the use of material, and be convenient to mould punching moulding; Described terminal pin top is provided with pressure-sizing district, the thickness of described terminal pin is 0.485-0.515mm, described matrix and surface, pressure-sizing district are provided with silver coating, described silver coating thickness is at least 0.03 μ m, the existence of silver coating is significantly improved electric conductivity, and pressure-sizing district makes lead frame monolithic stability, the thickness of silver coating is minimum must 0.03 μ m, for guaranteeing that electric conductivity reaches the minimum of instructions for use, based on reducing expenses and can guarantee the requirement that electric conductivity will be good than general lead frame, need to guarantee that the thickness of silver coating is 0.03 μ m; Described matrix comprises mounting groove and fin, described mounting groove is located on fin, described fin is provided with opening, described fin surface is provided with heat radiating fin, and described heat radiating fin is provided with at least three, and fin is provided with opening and can makes high-power plastic packaging lead frame can realize under the condition of its function, save material, saved expenditure, the heat dispersion that is arranged so that lead frame of heat radiating fin further promotes, and has guaranteed that product has good heat dispersion.
(2), the described matrix back side is provided with radiating groove, described radiating groove is that cross section is the groove of triangle, circle or swallow-tail form, described heat radiation groove depth 0.1mm, the thickness of described fin is 0.3mm, and the thickness of described mounting groove is 0.2mm, and radiating groove setting is can save material for first, and its structure is convenient to mould punching, be suitable for producing, and it increases the area of ingress of air, be convenient to heat radiation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the high-power plastic packaging lead frame of the utility model.
Fig. 2 is the left view of the high-power plastic packaging lead frame of the utility model.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-dowel, 5-location hole, 6-pressure-sizing district, 7-fin, 8-opening, 9-heat radiating fin, 10-radiating groove.
Embodiment
Below in conjunction with drawings and Examples, the utility model is improved further to explanation.
As depicted in figs. 1 and 2, high-power plastic packaging lead frame, by 30 single connecting to form in lead frame unit 1, lead frame unit 1 comprises matrix 2, terminal pin 3 and dowel 4, between lead frame unit, connect by dowel 4, dowel 4 is provided with location hole 5, and location hole 5 apertures are 2.02mm; Terminal pin 3 tops are provided with pressure-sizing district 6, and the thickness of terminal pin 3 is 0.485mm; Matrix 2 and 6 surfaces, pressure-sizing district are provided with silver coating, and silver coating thickness is 0.03 μ m, and matrix comprises mounting groove and fin 7, and mounting groove is located on fin, and fin 7 is provided with opening 8, and fin 7 surfaces are provided with heat radiating fin 9, and heat radiating fin 9 is provided with three.Matrix 2 back sides are provided with radiating groove 10, radiating groove 10 for cross section be leg-of-mutton groove, the dark 0.1mm of radiating groove 10.The thickness of fin 7 is 0.3mm, and the thickness of mounting groove is 0.2mm.
Modified model, reduced form that high-power plastic packaging lead frame of the present utility model is TO-251L, this product is convenient to punching production, and Mould Machining is simple, should not damage, and production efficiency is high, and the market competitiveness is strong.
Teachings herein is example of the present utility model and explanation; but do not mean that the obtainable advantage of the utility model is so limited, may be to wherein one or more of the advantage realizing in the simple transformation of structure and/or some execution modes all in the application's protection range in every the utility model practice process.
Claims (3)
1. high-power plastic packaging lead frame, by single the connecting to form in 30 lead frame unit (1), described lead frame unit (1) comprises matrix (2), terminal pin (3) and dowel (4), between described lead frame unit, connect by dowel (4), described dowel (4) is provided with location hole (5), it is characterized in that: described location hole (5) aperture is 2-2.04mm, described terminal pin (3) top is provided with pressure-sizing district (6), the thickness of described terminal pin (3) is 0.485-0.515mm, described matrix (2) and surface, pressure-sizing district (6) are provided with silver coating, described silver coating thickness is at least 0.03 μ m, described matrix comprises mounting groove and fin (7), described mounting groove is located on fin, described fin (7) is provided with opening (8), described fin (7) surface is provided with heat radiating fin (9), described heat radiating fin (9) is provided with at least three.
2. high-power plastic packaging lead frame according to claim 1, it is characterized in that: described matrix (2) back side is provided with radiating groove (10), described radiating groove (10) for cross section be the groove of triangle, circle or swallow-tail form, the dark 0.1mm of described radiating groove (10).
3. high-power plastic packaging lead frame according to claim 1, is characterized in that: the thickness of described fin (7) is 0.3mm, the thickness of described mounting groove is 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320700127.5U CN203617271U (en) | 2013-11-08 | 2013-11-08 | High-power plastic package lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320700127.5U CN203617271U (en) | 2013-11-08 | 2013-11-08 | High-power plastic package lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617271U true CN203617271U (en) | 2014-05-28 |
Family
ID=50769897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320700127.5U Expired - Fee Related CN203617271U (en) | 2013-11-08 | 2013-11-08 | High-power plastic package lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617271U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN108807327A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of full closed insulated lead frame with free switching function |
-
2013
- 2013-11-08 CN CN201320700127.5U patent/CN203617271U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN108807327A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of full closed insulated lead frame with free switching function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20141108 |
|
| EXPY | Termination of patent right or utility model |