CN103617977A - High-power molding-encapsulated lead frame - Google Patents
High-power molding-encapsulated lead frame Download PDFInfo
- Publication number
- CN103617977A CN103617977A CN201310548625.7A CN201310548625A CN103617977A CN 103617977 A CN103617977 A CN 103617977A CN 201310548625 A CN201310548625 A CN 201310548625A CN 103617977 A CN103617977 A CN 103617977A
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- China
- Prior art keywords
- lead frame
- fin
- thickness
- heat dissipation
- mounting groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a high-power molding-encapsulated lead frame. 30 lead frame units (1) are in single-row connection with one another so as to from the high-power molding-encapsulated lead frame; the lead frame unit (1) comprises a substrate (2), lead pins (3) and a connecting rib (4); the lead frame units are connected with one another through the connecting ribs (4); positioning holes are formed in the connecting ribs; the aperture of the positioning holes (5) is in a range of 2 mm to 2.04 mm; the lead pins (3) are provided with precisely-pressed areas (6); the thickness of the lead pins is in a range of 0.485 mm to 0.515 mm; the surfaces of the substrate (2) and the precisely-pressed areas are provided silver plated layers; the thickness of the silver plated layers is at least 0.03 micro m; the substrate comprises a mounting groove and a heat dissipation sheet; the mounting groove is formed in the heat radiation sheet; and openings (8) are formed in the heat dissipation sheet; the surface of the heat dissipation sheet is provided with heat dissipation fins; and at least three heat dissipation fins exist. The high-power molding-encapsulated lead frame of the invention has the advantages of simple structure, convenience in mould production as well as excellent conductivity and heat dissipation performance.
Description
Technical field
The present invention is specifically related to lead frame, particularly a kind of high-power plastic packaging lead frame.
Background technology
Development along with electron trade, semiconductor device adopts the more and more many of Plastic Package form, this just need to adapt to the lead frame of various different model plastic devices, and lead frame must adapt to the requirement of heat radiation, conduction and the carrying high-power chip of epoxy seal semiconductor device.
Lead frame in process of production, requires the highest to the size of lead frame, electric conductivity and heat dispersion.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of lead frame of being convenient to mould production, electric conductivity and perfect heat-dissipating simple in structure.
For addressing the above problem, technical scheme provided by the invention is: a kind of high-power plastic packaging lead frame, by 30 single connecting to form in lead frame unit, described lead frame unit comprises matrix, terminal pin and dowel, described lead frame connects by dowel between unit, described dowel is provided with location hole, described location hole aperture is 2-2.04mm, described terminal pin top is provided with pressure-sizing district, the thickness of described terminal pin is 0.485-0.515mm, described matrix and surface, pressure-sizing district are provided with silver coating, described silver coating thickness is at least 0.03 μ m, described matrix comprises mounting groove and fin, described mounting groove is located on fin, described fin is provided with opening, described fin surface is provided with heat radiating fin, heat radiating fin can be positive at fin, the back side or side, according to product requirement setting, described heat radiating fin is provided with at least three.
As a further improvement on the present invention, the described matrix back side is provided with radiating groove, and described radiating groove is that cross section is the groove of triangle, circle or swallow-tail form, described heat radiation groove depth 0.1mm, and the thickness of described fin is 0.3mm, the thickness of described mounting groove is 0.2mm.
The present invention compared with prior art has the following advantages.
(1), a kind of high-power plastic packaging lead frame, by 30 single connecting to form in lead frame unit, described lead frame unit comprises matrix, terminal pin and dowel, described lead frame connects by dowel between unit, described dowel is provided with location hole, and described location hole aperture is 2-2.04mm, can guarantee that the integral body of high-power plastic packaging lead frame is fixed, can reduce the use of material again, and be convenient to mould punching moulding; Described terminal pin top is provided with pressure-sizing district, the thickness of described terminal pin is 0.485-0.515mm, described matrix and surface, pressure-sizing district are provided with silver coating, described silver coating thickness is at least 0.03 μ m, the existence of silver coating is significantly improved electric conductivity, and pressure-sizing district makes lead frame monolithic stability, the thickness of silver coating is minimum must 0.03 μ m, for guaranteeing that electric conductivity reaches the minimum of instructions for use, based on reducing expenses and can guarantee the requirement that electric conductivity will be good than general lead frame, need to guarantee that the thickness of silver coating is 0.03 μ m; Described matrix comprises mounting groove and fin, described mounting groove is located on fin, described fin is provided with opening, described fin surface is provided with heat radiating fin, and described heat radiating fin is provided with at least three, and fin is provided with opening and can makes high-power plastic packaging lead frame can realize under the condition of its function, save material, saved expenditure, the heat dispersion that is arranged so that lead frame of heat radiating fin further promotes, and has guaranteed that product has good heat dispersion.
(2), the described matrix back side is provided with radiating groove, described radiating groove is that cross section is the groove of triangle, circle or swallow-tail form, described heat radiation groove depth 0.1mm, the thickness of described fin is 0.3mm, and the thickness of described mounting groove is 0.2mm, and radiating groove setting is can save material for first, and its structure is convenient to mould punching, be suitable for producing, and it increases the area of ingress of air, be convenient to heat radiation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the high-power plastic packaging lead frame of the present invention.
Fig. 2 is the left view of the high-power plastic packaging lead frame of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-dowel, 5-location hole ，6-pressure-sizing district, 7-fin, 8-opening, 9-heat radiating fin, 10-radiating groove.
Embodiment
Below in conjunction with drawings and Examples, the present invention is improved further to explanation.
As depicted in figs. 1 and 2, a kind of high-power plastic packaging lead frame, by 30 single connecting to form in lead frame unit 1, lead frame unit 1 comprises matrix 2, terminal pin 3 and dowel 4, between lead frame unit, by dowel 4, connect, dowel 4 is provided with location hole 5, and location hole 5 apertures are 2.02mm; Terminal pin 3 tops are provided with pressure-sizing district 6, and the thickness of terminal pin 3 is 0.485mm; Matrix 2 and 6 surfaces, pressure-sizing district are provided with silver coating, and silver coating thickness is 0.03 μ m, and matrix comprises mounting groove and fin 7, and mounting groove is located on fin, and fin 7 is provided with opening 8, and fin 7 surfaces are provided with heat radiating fin 9, and heat radiating fin 9 is provided with three.Matrix 2 back sides are provided with radiating groove 10, radiating groove 10 for cross section be leg-of-mutton groove, the dark 0.1mm of radiating groove 10.The thickness of fin 7 is 0.3mm, and the thickness of mounting groove is 0.2mm.
Modified model, reduced form that high-power plastic packaging lead frame of the present invention is TO-251L, this product is convenient to punching production, and Mould Machining is simple, should not damage, and production efficiency is high, and the market competitiveness is strong.
Teachings herein is example of the present invention and explanation; but do not mean that the obtainable advantage of the present invention is so limited, may be to wherein one or more of the advantage realizing in the simple transformation of structure and/or some execution modes all in the application's protection range in every practice process of the present invention.
Claims (3)
1. a high-power plastic packaging lead frame, by single the connecting to form in 30 lead frame unit (1), described lead frame unit (1) comprises matrix (2), terminal pin (3) and dowel (4), between described lead frame unit, by dowel (4), connect, described dowel (4) is provided with location hole (5), it is characterized in that: described location hole (5) aperture is 2-2.04mm, described terminal pin (3) top is provided with pressure-sizing district (6), the thickness of described terminal pin (3) is 0.485-0.515mm, described matrix (2) and surface, pressure-sizing district (6) are provided with silver coating, described silver coating thickness is at least 0.03 μ m, described matrix comprises mounting groove and fin (7), described mounting groove is located on fin, described fin (7) is provided with opening (8), described fin (7) surface is provided with heat radiating fin (9), described heat radiating fin (9) is provided with at least three.
2. high-power plastic packaging lead frame according to claim 1, it is characterized in that: described matrix (2) back side is provided with radiating groove (10), described radiating groove (10) for cross section be the groove of triangle, circle or swallow-tail form, the dark 0.1mm of described radiating groove (10).
3. high-power plastic packaging lead frame according to claim 1, is characterized in that: the thickness of described fin (7) is 0.3mm, and the thickness of described mounting groove is 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548625.7A CN103617977A (en) | 2013-11-08 | 2013-11-08 | High-power molding-encapsulated lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548625.7A CN103617977A (en) | 2013-11-08 | 2013-11-08 | High-power molding-encapsulated lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617977A true CN103617977A (en) | 2014-03-05 |
Family
ID=50168680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310548625.7A Pending CN103617977A (en) | 2013-11-08 | 2013-11-08 | High-power molding-encapsulated lead frame |
Country Status (1)
| Country | Link |
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| CN (1) | CN103617977A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051404A (en) * | 2014-07-08 | 2014-09-17 | 沈健 | Partially silvered lead frame |
| CN104051402A (en) * | 2014-05-23 | 2014-09-17 | 沈健 | Partly silvered lead frame |
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262720A1 (en) * | 2003-06-30 | 2004-12-30 | Renesas Technology Corp. | Semiconductor device |
| CN201853695U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Power diode lead frame |
| CN202142524U (en) * | 2011-07-25 | 2012-02-08 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN102386163A (en) * | 2011-06-16 | 2012-03-21 | 沈健 | Two-row lead frame for plastic encapsulated device for light-controlled device and sound-controlled device |
| US20120175762A1 (en) * | 2011-01-12 | 2012-07-12 | Renesas Electronics Corporation | Semiconductor device and manufacturing method thereof |
| CN203617271U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | High-power plastic package lead frame |
-
2013
- 2013-11-08 CN CN201310548625.7A patent/CN103617977A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262720A1 (en) * | 2003-06-30 | 2004-12-30 | Renesas Technology Corp. | Semiconductor device |
| CN201853695U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Power diode lead frame |
| US20120175762A1 (en) * | 2011-01-12 | 2012-07-12 | Renesas Electronics Corporation | Semiconductor device and manufacturing method thereof |
| CN102386163A (en) * | 2011-06-16 | 2012-03-21 | 沈健 | Two-row lead frame for plastic encapsulated device for light-controlled device and sound-controlled device |
| CN202142524U (en) * | 2011-07-25 | 2012-02-08 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN203617271U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | High-power plastic package lead frame |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051402A (en) * | 2014-05-23 | 2014-09-17 | 沈健 | Partly silvered lead frame |
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
| CN104051404A (en) * | 2014-07-08 | 2014-09-17 | 沈健 | Partially silvered lead frame |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |