CN104051402A - Partly silvered lead frame - Google Patents
Partly silvered lead frame Download PDFInfo
- Publication number
- CN104051402A CN104051402A CN201410219535.8A CN201410219535A CN104051402A CN 104051402 A CN104051402 A CN 104051402A CN 201410219535 A CN201410219535 A CN 201410219535A CN 104051402 A CN104051402 A CN 104051402A
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- CN
- China
- Prior art keywords
- lead frame
- terminal pin
- silver
- bonding
- bonding region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a partly silvered lead frame. The partly silvered lead frame comprises a plurality of lead frame units arranged in a single row. The lead frame units are connected through connecting ribs. Each lead frame unit comprises a substrate and a terminal pin, wherein the joint of each substrate and the corresponding terminal pin is bent; each substrate is provided with a die bonding area; each terminal pin is provided with a bonding area; the lower left corner of each die binding area and each bonding area are respectively provided with a silver coating. According to the partly silvered lead frame, the die bonding areas and the bonding areas are provided with the silver coatings respectively, so that the heat conduction performance and electric conduction performance of the partly silvered lead frame are improved, the partly silvered lead frame can be welded easily, and the partly silvered lead frame has the anti-corrosive function.
Description
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.At present, more enterprise requires lead frame local silver-plating, because silver coating has good heat conduction, conduction and welding performance, also possesses the effect of anticorrosion simultaneously.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame of local silver-plating.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame of local silver-plating, by multiple lead frames unit single composition, described lead frame connects by dowel between unit, described lead frame unit comprises matrix and terminal pin, bends in described matrix and terminal pin junction, and described matrix is provided with bonding die district, described terminal pin is provided with bonding region, and the lower left corner and the bonding region in described bonding die district are respectively equipped with silver coating and silver coating.
As a further improvement on the present invention, the silver coating in the lower left corner, described bonding die district is the square of length of side 2mm.
As a further improvement on the present invention, the silver coating of described bonding region covers surface, bonding region completely, the bonding head of district 2.9 ± 0.01mm, wide 1.4 ± 0.01mm.
As a further improvement on the present invention, the width of described lead frame unit is 11.405 ± 0.015mm, and matrix thickness is 1.3 ± 0.02mm, and terminal pin thickness is 0.5 ± 0.01mm.
As a further improvement on the present invention, described matrix is provided with louvre, and louvre diameter is 3.7 ± 0.05mm.
Adopt said structure, its beneficial effect is: this lead frame is silver-plated respectively in bonding die district and bonding region, has improved heat conduction, electric conductivity, is easy to welding, has possessed the function of anti-corruption simultaneously.
Brief description of the drawings
Fig. 1 is the structural representation of the lead frame of local silver-plating of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-bonding die district, 5-bonding region, 6-1-silver coating, 6-2-silver coating, 7-louvre.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of lead frame of local silver-plating, by 1 single composition of multiple lead frames unit, between described lead frame unit 1, connect by dowel, described lead frame unit 1 comprises matrix 2 and terminal pin 3, bend in described matrix 2 and terminal pin 3 junctions, described matrix 2 is provided with bonding die district 4, described terminal pin 3 is provided with bonding region 5, the lower left corner in described bonding die district 4 and bonding region 5 are respectively equipped with silver coating 6-1 and silver coating 6-2, wherein, the silver coating 6-1 in 4 lower left corners, bonding die district is the square of length of side 2mm, the silver coating 6-2 of bonding region 5 covers 5 surfaces, bonding region completely, long 2.9 ± the 0.01mm in bonding region 5, wide 1.4 ± 0.01mm, the width of described lead frame unit 1 is 11.405 ± 0.015mm, matrix 2 thickness are 1.3 ± 0.02mm, terminal pin 3 thickness are 0.5 ± 0.01mm, described matrix 1 is provided with louvre 7, louvre 7 diameters are 3.7 ± 0.05mm.
This lead frame is silver-plated respectively in bonding die district 4 and bonding region 5, has improved heat conduction, electric conductivity, is easy to welding, has possessed the function of anti-corruption simultaneously.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (5)
1. the lead frame of a local silver-plating, by multiple lead frames unit (1) single composition, between described lead frame unit (1), connect by dowel, described lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in described matrix (2) and terminal pin (3) junction, it is characterized in that: described matrix (2) is provided with bonding die district (4), described terminal pin (3) is provided with bonding region (5), and the lower left corner in described bonding die district (4) and bonding region (5) are respectively equipped with silver coating (6-1) and silver coating (6-2).
2. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: what the silver coating (6-1) in the lower left corner, described bonding die district (4) was length of side 2mm is square.
3. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: the silver coating (6-2) of described bonding region (5) covers surface, bonding region (5) completely, bonding region (5) long 2.9 ± 0.01mm, wide 1.4 ± 0.01mm.
4. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.015mm, and matrix (2) thickness is 1.3 ± 0.02mm, and terminal pin (3) thickness is 0.5 ± 0.01mm.
5. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: described matrix (1) is provided with louvre (7), and louvre (7) diameter is 3.7 ± 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219535.8A CN104051402A (en) | 2014-05-23 | 2014-05-23 | Partly silvered lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219535.8A CN104051402A (en) | 2014-05-23 | 2014-05-23 | Partly silvered lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104051402A true CN104051402A (en) | 2014-09-17 |
Family
ID=51504056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410219535.8A Pending CN104051402A (en) | 2014-05-23 | 2014-05-23 | Partly silvered lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104051402A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262720A1 (en) * | 2003-06-30 | 2004-12-30 | Renesas Technology Corp. | Semiconductor device |
| CN102637664A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203325898U (en) * | 2013-05-24 | 2013-12-04 | 辽阳泽华电子产品有限责任公司 | Improved TO-92 MOD packaging lead wire framework |
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN103617983A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Low-power plastic packaged lead frame |
| CN203967073U (en) * | 2014-05-23 | 2014-11-26 | 沈健 | A kind of lead frame of local silver-plating |
-
2014
- 2014-05-23 CN CN201410219535.8A patent/CN104051402A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262720A1 (en) * | 2003-06-30 | 2004-12-30 | Renesas Technology Corp. | Semiconductor device |
| CN102637664A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203325898U (en) * | 2013-05-24 | 2013-12-04 | 辽阳泽华电子产品有限责任公司 | Improved TO-92 MOD packaging lead wire framework |
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN103617983A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Low-power plastic packaged lead frame |
| CN203967073U (en) * | 2014-05-23 | 2014-11-26 | 沈健 | A kind of lead frame of local silver-plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140917 |