CN203850277U - A plastic package lead wire framework with bosses formed through pressing - Google Patents

A plastic package lead wire framework with bosses formed through pressing Download PDF

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Publication number
CN203850277U
CN203850277U CN201420125885.3U CN201420125885U CN203850277U CN 203850277 U CN203850277 U CN 203850277U CN 201420125885 U CN201420125885 U CN 201420125885U CN 203850277 U CN203850277 U CN 203850277U
Authority
CN
China
Prior art keywords
lead wire
lead frame
wire framework
heat radiating
plastic package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420125885.3U
Other languages
Chinese (zh)
Inventor
张轩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Friends of Taizhou run electronic Polytron Technologies Inc
Original Assignee
张轩
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张轩 filed Critical 张轩
Priority to CN201420125885.3U priority Critical patent/CN203850277U/en
Application granted granted Critical
Publication of CN203850277U publication Critical patent/CN203850277U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a plastic package lead wire framework with bosses formed through pressing. The plastic package lead wire framework with the pressed boss is composed of a plurality of lead wire frame units arranged in a single row mode. The lead wire framework units are connected with each other through connection ribs. The lead wire framework units comprise heat radiating fins and lead wire pins. Portions connection the heat radiating fins and the lead wire pins are bent. The heat radiating fins are provided with the bosses. The thickness of each heat radiating fin is 1.72+-0.015mm. The height of each boss is 0.4mm. The width of each lead wire framework unit is 11.405+-0.025mm. The lead wire framework units are provided with positioning holes. The diameter of each positioning hole is 1.52+-0.03mm. The heat radiating fins are provided with heat radiating holes. The diameter of each heat radiating hole is 3.85+-0.05mm. The bosses are added to the radiating fins of the plastic package lead wire framework, so that combination of plastic package materials with the plastic package lead wire framework is facilitated, and the combination is firmer.

Description

A kind of plastic packaging lead frame that is pressed with boss
Technical field
The utility model relates to a kind of plastic packaging lead frame.
Background technology
plastic packaging lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging plastic packaging lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of plastic packaging lead frame that is pressed with boss.
In order to solve the problems of the technologies described above, the utility model provides a kind of plastic packaging lead frame that is pressed with boss, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, described lead frame unit comprises fin and terminal pin, bend in fin and terminal pin junction, described fin is provided with boss.
As further improvement of the utility model, described fin thickness is 1.27 ± 0.015mm, and boss height is 0.4mm.
As further improvement of the utility model, the width of described lead frame unit is 11.405 ± 0.025mm.
As further improvement of the utility model, described lead frame unit is provided with location hole, and the diameter of location hole is 1.52 ± 0.03mm.
As further improvement of the utility model, described fin is provided with louvre, and louvre diameter is 3.85 ± 0.05mm.
Adopt said structure, its beneficial effect is: this plastic packaging lead frame fin increases boss, is more conducive to the combination of plastic packaging material and plastic packaging lead frame, makes it more firm.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 be in Fig. 1 A-A to view.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, 4-boss, 5-location hole, 6-louvre.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1, a kind of plastic packaging lead frame that is pressed with boss, by 1 single composition of multiple lead frames unit, between each lead frame unit 1, interconnect by dowel, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, described fin 2 is provided with boss 4, described fin 2 thickness are 1.27 ± 0.015mm, boss 4 is highly 0.4mm, the width of described lead frame unit 1 is 11.405 ± 0.025mm, described lead frame unit 1 is provided with location hole 5, the diameter of location hole 5 is 1.52 ± 0.03mm, described fin 2 is provided with louvre 6, louvre 6 diameters are 3.85 ± 0.05mm.
This plastic packaging lead frame fin 2 increases boss 4, is more conducive to the combination of plastic packaging material and plastic packaging lead frame, makes it more firm.
Within the similar designed plastic packaging lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.

Claims (5)

1. one kind is pressed with the plastic packaging lead frame of boss, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, it is characterized in that: described lead frame unit (1) comprises fin (2) and terminal pin (3), bend in fin (2) and terminal pin (3) junction, described fin (2) is provided with boss (4).
2. a kind of plastic packaging lead frame that is pressed with boss according to claim 1, is characterized in that: described fin (2) thickness is 1.27 ± 0.015mm, boss (4) is highly 0.4mm.
3. a kind of plastic packaging lead frame that is pressed with boss according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.025mm.
4. a kind of plastic packaging lead frame that is pressed with boss according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (5), and the diameter of location hole (5) is 1.52 ± 0.03mm.
5. a kind of plastic packaging lead frame that is pressed with boss according to claim 1, is characterized in that: described fin (2) is provided with louvre (6), and louvre (6) diameter is 3.85 ± 0.05mm.
CN201420125885.3U 2014-03-20 2014-03-20 A plastic package lead wire framework with bosses formed through pressing Expired - Fee Related CN203850277U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420125885.3U CN203850277U (en) 2014-03-20 2014-03-20 A plastic package lead wire framework with bosses formed through pressing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420125885.3U CN203850277U (en) 2014-03-20 2014-03-20 A plastic package lead wire framework with bosses formed through pressing

Publications (1)

Publication Number Publication Date
CN203850277U true CN203850277U (en) 2014-09-24

Family

ID=51563257

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420125885.3U Expired - Fee Related CN203850277U (en) 2014-03-20 2014-03-20 A plastic package lead wire framework with bosses formed through pressing

Country Status (1)

Country Link
CN (1) CN203850277U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: TAIZHOU YOURUN ELECTRONIC CO., LTD.

Free format text: FORMER OWNER: ZHANG XUAN

Effective date: 20150731

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150731

Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area

Patentee after: Taizhou Yourun Electronic Co., Ltd.

Address before: 225324, Jiangsu Taizhou hi tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard workshop area 126

Patentee before: Zhang Xuan

C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area

Patentee after: Friends of Taizhou run electronic Polytron Technologies Inc

Address before: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area

Patentee before: Taizhou Yourun Electronic Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140924

Termination date: 20170320

CF01 Termination of patent right due to non-payment of annual fee