CN204130522U - A kind of lead frame of local silver-plating - Google Patents
A kind of lead frame of local silver-plating Download PDFInfo
- Publication number
- CN204130522U CN204130522U CN201420362099.5U CN201420362099U CN204130522U CN 204130522 U CN204130522 U CN 204130522U CN 201420362099 U CN201420362099 U CN 201420362099U CN 204130522 U CN204130522 U CN 204130522U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- terminal pin
- frame unit
- matrix
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of lead frame of local silver-plating, form by multiple lead frame unit is single, connected by dowel between lead frame unit, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, terminal pin is provided with three, left terminal pin and right terminal pin end are respectively equipped with bonding region, surface, bonding region is provided with silver coating, the width of lead frame unit is 11.405 ± 0.015mm, matrix thickness is 1.3 ± 0.02mm, terminal pin thickness is 0.5 ± 0.01mm, matrix is provided with louvre, louvre diameter is 3.6 ± 0.02mm, lead frame unit is provided with location hole, location hole diameter is 1.5 ± 0.02mm, this lead frame is silver-plated respectively in the bonding region of left terminal pin and right terminal pin, improve the heat conduction of terminal pin, electric conductivity, be easy to welding, the function of anti-corruption that simultaneously made it possess.
Description
Technical field
The utility model relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.At present, more enterprise requirements lead frame local silver-plating, because silver coating has good heat conduction, conduction and welding performance, also possesses the effect of anticorrosion simultaneously.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of lead frame of local silver-plating.
In order to solve the problems of the technologies described above, the utility model provides a kind of lead frame of local silver-plating, form by multiple lead frame unit is single, connected by dowel between described lead frame unit, described lead frame unit comprises matrix and terminal pin, and bend in described matrix and terminal pin junction, described terminal pin is provided with three, left terminal pin and right terminal pin end are respectively equipped with bonding region, and surface, bonding region is provided with silver coating.
As further improvement of the utility model, the width of described lead frame unit is 11.405 ± 0.015mm, and matrix thickness is 1.3 ± 0.02mm, and terminal pin thickness is 0.5 ± 0.01mm.
As further improvement of the utility model, described matrix is provided with louvre, and louvre diameter is 3.6 ± 0.02mm.
As further improvement of the utility model, described lead frame unit is provided with location hole, and location hole diameter is 1.5 ± 0.02mm.
Adopt said structure, its beneficial effect is: this lead frame is silver-plated respectively in the bonding region of left terminal pin and right terminal pin, improves the heat conduction of terminal pin, electric conductivity, is easy to welding, the function of anti-corruption that simultaneously made it possess.
Accompanying drawing explanation
Fig. 1 is the structural representation of the lead frame of the utility model local silver-plating.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-bonding region, 5-silver coating, 6-louvre, 7-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Figure 1, a kind of lead frame of local silver-plating, form by multiple lead frame unit 1 is single, connected by dowel between described lead frame unit 1, described lead frame unit 1 comprises matrix 2 and terminal pin 3, bend in described matrix 2 and terminal pin 3 junction, described terminal pin 3 is provided with three, left terminal pin and right terminal pin end are respectively equipped with bonding region 4, surface, bonding region 4 is provided with silver coating 5, the width of described lead frame unit 1 is 11.405 ± 0.015mm, matrix 2 thickness is 1.3 ± 0.02mm, terminal pin 3 thickness is 0.5 ± 0.01mm, described matrix 1 is provided with louvre 6, louvre 6 diameter is 3.6 ± 0.02mm, described lead frame unit 1 is provided with location hole 7, location hole 7 diameter is 1.5 ± 0.02mm.
This lead frame is silver-plated respectively in the bonding region 4 of left terminal pin and right terminal pin, improves the heat conduction of terminal pin, electric conductivity, is easy to welding, the function of anti-corruption that simultaneously made it possess.
Any employing and the similar lead frame designed by technical characteristic of the utility model will fall within protection range of the present utility model.
Claims (4)
1. the lead frame of a local silver-plating, form by multiple lead frame unit (1) is single, connected by dowel between described lead frame unit (1), described lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in described matrix (2) and terminal pin (3) junction, it is characterized in that: described terminal pin (3) is provided with three, left terminal pin and right terminal pin end are respectively equipped with bonding region (4), and bonding region (4) surface is provided with silver coating (5).
2. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.015mm, and matrix (2) thickness is 1.3 ± 0.02mm, and terminal pin (3) thickness is 0.5 ± 0.01mm.
3. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: described matrix (1) is provided with louvre (6), and louvre (6) diameter is 3.6 ± 0.02mm.
4. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (7), and location hole (7) diameter is 1.5 ± 0.02mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420362099.5U CN204130522U (en) | 2014-07-02 | 2014-07-02 | A kind of lead frame of local silver-plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420362099.5U CN204130522U (en) | 2014-07-02 | 2014-07-02 | A kind of lead frame of local silver-plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204130522U true CN204130522U (en) | 2015-01-28 |
Family
ID=52386849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420362099.5U Expired - Fee Related CN204130522U (en) | 2014-07-02 | 2014-07-02 | A kind of lead frame of local silver-plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204130522U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
-
2014
- 2014-07-02 CN CN201420362099.5U patent/CN204130522U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170220 Address after: 225300 Taizhou province high Port District Xu Zhuang prosperous road east side Patentee after: Taizhou Dongtian Electronics Co., Ltd. Address before: 225324 Taizhou, Jiangsu high port Xu Zhuang Road, East Yongfeng Road, No. 9 Patentee before: Shen Jian |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20180702 |