CN203850280U - Double-chip plastic-sealed lead frame - Google Patents
Double-chip plastic-sealed lead frame Download PDFInfo
- Publication number
- CN203850280U CN203850280U CN201420137764.0U CN201420137764U CN203850280U CN 203850280 U CN203850280 U CN 203850280U CN 201420137764 U CN201420137764 U CN 201420137764U CN 203850280 U CN203850280 U CN 203850280U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip
- lead
- terminal pin
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a double-chip plastic-sealed lead frame which is composed of a plurality of lead frame units in one row. The lead frame units are interconnected through a connecting rib. Each lead frame unit comprises a heat radiating fin and lead legs. The connecting parts between the heat radiating fin and the lead legs are bent. Seven lead legs are arranged, wherein the end of a third lead leg is provided with a large chip, and the end of each of the other six lead legs is provided with a small chip. The plastic-sealed lead frame is a seven-lead-leg double-chip frame. The large chip and the small chips are respectively arranged on the lead legs. The small chips are utilized as driving power supplies. The double-chip plastic-sealed lead frame facilitates mounting on a circuit board and has high added value.
Description
Technical field
The utility model relates to a kind of plastic packaging lead frame.
Background technology
Plastic packaging lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging plastic packaging lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of dual chip plastic packaging lead frame.
In order to solve the problems of the technologies described above, the utility model provides a kind of dual chip plastic packaging lead frame, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, described lead frame unit comprises fin and terminal pin, bends in fin and terminal pin junction, and described terminal pin is provided with seven, wherein the 3rd terminal pin end is provided with large chip, and other six terminal pin ends are provided with little chip.
As further improvement of the utility model, the width of described lead frame unit is 11.405 ± 0.03mm.
As further improvement of the utility model, described lead frame unit is provided with location hole, and the diameter of location hole is 1.2 ± 0.03mm.
As further improvement of the utility model, described fin thickness is 1.3 ± 0.015mm, and terminal pin thickness is 0.45 ± 0.01mm, and fin and terminal pin plane of living in is at a distance of 2.67 ± 0.05mm.
As further improvement of the utility model, described fin is provided with louvre, and louvre diameter is 3.85 ± 0.05mm.
Adopt said structure, its beneficial effect is: this plastic packaging lead frame is a kind of seven terminal pin dual chip frameworks, and large and small two kinds of chips are installed respectively on terminal pin, and little chip is as driving power, and this framework is convenient to be installed on wiring board, and added value is very high.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, 4-large chip, the little chip of 5-, 6-location hole, 7-louvre.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1, a kind of dual chip plastic packaging lead frame, by 1 single composition of multiple lead frames unit, between each lead frame unit 1, interconnect by dowel, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, described terminal pin 3 is provided with seven, wherein the 3rd terminal pin 3 ends are provided with large chip 4, other six terminal pin 3 ends are provided with little chip 5, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described lead frame unit 1 is provided with location hole 6, the diameter of location hole 6 is 1.2 ± 0.03mm, described fin 2 thickness are 1.3 ± 0.015mm, terminal pin 3 thickness are 0.45 ± 0.01mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.67 ± 0.05mm, described fin 2 is provided with louvre 7, louvre 7 diameters are 3.85 ± 0.05mm.
This plastic packaging lead frame is a kind of seven terminal pin 3 dual chip frameworks, and large chip 4, little chip 5 are installed respectively on terminal pin 3, and little chip 5 is as driving power, and this framework is convenient to be installed on wiring board, and added value is very high.
Within the similar designed plastic packaging lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.
Claims (5)
1. a dual chip plastic packaging lead frame, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, it is characterized in that: described lead frame unit (1) comprises fin (2) and terminal pin (3), bend in fin (2) and terminal pin (3) junction, described terminal pin (3) is provided with seven, and wherein the 3rd terminal pin (3) end is provided with large chip (4), and other six terminal pins (3) end is provided with little chip (5).
2. a kind of dual chip plastic packaging lead frame according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
3. a kind of dual chip plastic packaging lead frame according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (6), and the diameter of location hole (6) is 1.2 ± 0.03mm.
4. a kind of dual chip plastic packaging lead frame according to claim 1, it is characterized in that: described fin (2) thickness is 1.3 ± 0.015mm, terminal pin (3) thickness is 0.45 ± 0.01mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.67 ± 0.05mm.
5. a kind of dual chip plastic packaging lead frame according to claim 1, is characterized in that: described fin (2) is provided with louvre (7), and louvre (7) diameter is 3.85 ± 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420137764.0U CN203850280U (en) | 2014-03-26 | 2014-03-26 | Double-chip plastic-sealed lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420137764.0U CN203850280U (en) | 2014-03-26 | 2014-03-26 | Double-chip plastic-sealed lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850280U true CN203850280U (en) | 2014-09-24 |
Family
ID=51563260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420137764.0U Expired - Fee Related CN203850280U (en) | 2014-03-26 | 2014-03-26 | Double-chip plastic-sealed lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850280U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108039342A (en) * | 2017-12-01 | 2018-05-15 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220D7L lead frames |
| CN108520872A (en) * | 2018-05-02 | 2018-09-11 | 泰州友润电子科技股份有限公司 | A kind of more loading type lead frames with insulation protection performance |
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
-
2014
- 2014-03-26 CN CN201420137764.0U patent/CN203850280U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108039342A (en) * | 2017-12-01 | 2018-05-15 | 泰州友润电子科技股份有限公司 | A kind of improved TO-220D7L lead frames |
| CN108520872A (en) * | 2018-05-02 | 2018-09-11 | 泰州友润电子科技股份有限公司 | A kind of more loading type lead frames with insulation protection performance |
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TAIZHOU YOURUN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHANG XUAN Effective date: 20150731 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150731 Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Taizhou Yourun Electronic Co., Ltd. Address before: 225324, Jiangsu Taizhou hi tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard workshop area 126 Patentee before: Zhang Xuan |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Friends of Taizhou run electronic Polytron Technologies Inc Address before: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee before: Taizhou Yourun Electronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20190326 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |