CN203850275U - A plastic package lead wire framework used for electric appliances with a relatively large power - Google Patents
A plastic package lead wire framework used for electric appliances with a relatively large power Download PDFInfo
- Publication number
- CN203850275U CN203850275U CN201420125855.2U CN201420125855U CN203850275U CN 203850275 U CN203850275 U CN 203850275U CN 201420125855 U CN201420125855 U CN 201420125855U CN 203850275 U CN203850275 U CN 203850275U
- Authority
- CN
- China
- Prior art keywords
- lead wire
- plastic package
- lead frame
- framework
- relatively large
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a plastic package lead wire framework used for electric appliances with a relatively large power. The plastic package lead wire framework used for the electric appliance with the relatively large power is composed of a plurality of lead wire frame units arranged in a single row mode. The lead wire framework units are connected with each other through connection ribs. The lead wire framework units comprise basal bodies and lead wire pins. Portions connection the basal bodies and the lead wire pins are bent. The basal bodies are provided with radiating holes and bonding die zones. The lead wire pins are provided with reinforcement ribs. The width of each lead wire framework unit is 11.405+-0.03mm. The diameter of each heat radiating hole is 3.84+-0.04mm. The thickness of each basal body is 1.72+-0.015mm. The thickness of each conductive wire pin is 0.381-0.015mm. A plane where the basal bodies are and a plane where the conductive wire pins are is away from each other for 2.76+-0.1mm. According to the plastic package lead wire framework, the reinforcement ribs are driven into the conductive wire pins, so that disadvantages of softness of original conductive wire pins are solved; the framework structural hardness is enhanced; and the plastic package lead wire framework can be widely applied to circuit boards of the electric appliances with the relatively large power.
Description
Technical field
The utility model relates to a kind of plastic packaging lead frame.
Background technology
Plastic packaging plastic packaging lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging plastic packaging plastic packaging lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of plastic packaging lead frame for relatively high power electrical equipment.
In order to solve the problems of the technologies described above, the utility model provides a kind of plastic packaging lead frame for relatively high power electrical equipment, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described matrix is provided with louvre and bonding die district, and described terminal pin is provided with reinforcement.
As further improvement of the utility model, the width of described lead frame unit is 11.405 ± 0.03mm.
As further improvement of the utility model, described louvre diameter is 3.84 ± 0.04mm.
As further improvement of the utility model, described matrix thickness is 1.27 ± 0.015mm, and terminal pin thickness is 0.38 ± 0.015mm, and matrix and terminal pin plane of living in is at a distance of 2.67 ± 0.1mm.
Adopt said structure, its beneficial effect is: this plastic packaging lead frame is squeezed into reinforcement on terminal pin, changes the shortcoming that original terminal pin is soft, strengthens frame structure hardness, can be widely used on the wiring board of relatively high power electrical equipment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-louvre, 5-bonding die district, 6-reinforcement.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1, a kind of plastic packaging lead frame for relatively high power electrical equipment, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, described lead frame unit 1 comprises matrix 2 and terminal pin 3, bend in matrix 2 and terminal pin 3 junctions, described matrix 2 is provided with louvre 4 and bonding die district 5, described terminal pin 3 is provided with reinforcement 6, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described louvre 4 diameters are 3.84 ± 0.04mm, described matrix 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, matrix 2 and terminal pin 3 plane of living in are at a distance of 2.67 ± 0.1mm.
This plastic packaging lead frame is squeezed into reinforcement 6 on terminal pin 3, changes the soft shortcoming of original terminal pin 3, strengthens frame structure hardness, can be widely used on the wiring board of relatively high power electrical equipment.
Within the similar designed plastic packaging lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.
Claims (4)
1. the plastic packaging lead frame for relatively high power electrical equipment, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: described lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described matrix (2) is provided with louvre (4) and bonding die district (5), and described terminal pin (3) is provided with reinforcement (6).
2. a kind of plastic packaging lead frame for relatively high power electrical equipment according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
3. a kind of plastic packaging lead frame for relatively high power electrical equipment according to claim 1, is characterized in that: described louvre (4) diameter is 3.84 ± 0.04mm.
4. a kind of plastic packaging lead frame for relatively high power electrical equipment according to claim 1, it is characterized in that: described matrix (2) thickness is 1.27 ± 0.015mm, terminal pin (3) thickness is 0.38 ± 0.015mm, and matrix (2) and terminal pin (3) plane of living in are at a distance of 2.67 ± 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125855.2U CN203850275U (en) | 2014-03-20 | 2014-03-20 | A plastic package lead wire framework used for electric appliances with a relatively large power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125855.2U CN203850275U (en) | 2014-03-20 | 2014-03-20 | A plastic package lead wire framework used for electric appliances with a relatively large power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850275U true CN203850275U (en) | 2014-09-24 |
Family
ID=51563255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420125855.2U Expired - Fee Related CN203850275U (en) | 2014-03-20 | 2014-03-20 | A plastic package lead wire framework used for electric appliances with a relatively large power |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850275U (en) |
-
2014
- 2014-03-20 CN CN201420125855.2U patent/CN203850275U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TAIZHOU YOURUN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHANG XUAN Effective date: 20150730 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150730 Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Taizhou Yourun Electronic Co., Ltd. Address before: 225324, Jiangsu Taizhou hi tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard workshop area 126 Patentee before: Zhang Xuan |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Friends of Taizhou run electronic Polytron Technologies Inc Address before: 225324, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee before: Taizhou Yourun Electronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20170320 |