CN203617282U - Lead frame applied to low-power electrical appliance - Google Patents

Lead frame applied to low-power electrical appliance Download PDF

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Publication number
CN203617282U
CN203617282U CN201320701634.0U CN201320701634U CN203617282U CN 203617282 U CN203617282 U CN 203617282U CN 201320701634 U CN201320701634 U CN 201320701634U CN 203617282 U CN203617282 U CN 203617282U
Authority
CN
China
Prior art keywords
lead frame
lead
terminal pin
low
frame unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320701634.0U
Other languages
Chinese (zh)
Inventor
张轩
Original Assignee
张轩
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张轩 filed Critical 张轩
Priority to CN201320701634.0U priority Critical patent/CN203617282U/en
Application granted granted Critical
Publication of CN203617282U publication Critical patent/CN203617282U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model discloses a lead frame applied to a low-power electrical appliance. The lead frame is formed by connecting a plurality of lead frame units in a single row, wherein the lead frame units are connected with each other through connecting ribs, the lead frame unit comprises a base body and lead pins, a connecting part of the base body and the lead pin is bent, the lead pin is provided with a bonding area, the coining depth of the bonding area is 0.02-0.04mm, the number of the lead pins is three, and the lead frame unit is provided with positioning holes. Requirements for the bonding area coining depth of the lead pins at two sides of the frame are high, the two sides are symmetrical, the degree of processing difficulty is increased, but the additional value is high, thereby being widely applied to low-power high-precision electrical appliances, and playing an important role.

Description

A kind of lead frame for low power electric appliance
Technical field
The utility model relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of lead frame.
In order to solve the problems of the technologies described above, the utility model provides a kind of lead frame for low power electric appliance, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, terminal pin is provided with bonding region, and the described bonding region pressure-sizing degree of depth is 0.02-0.04mm.
As further improvement of the utility model, described terminal pin is provided with three.
As further improvement of the utility model, described lead frame unit is provided with location hole.
Adopt said structure, its beneficial effect is: the bonding region pressure-sizing depth requirements of this framework both sides terminal pin is higher, both sides symmetry, and difficulty of processing coefficient increases, but added value is high, is widely used in, in low power high-accuracy electrical equipment, playing an important role.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model lead frame.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-bonding region, 5-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Figure 1, a kind of lead frame for low power electric appliance, by 1 single composition of multiple lead frames unit, the width of lead frame unit 1 is 8.89 ± 0.025mm, between each lead frame unit 1, interconnect by dowel, lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 2 and terminal pin 3 thickness are 0.5 ± 0.01mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 planes at a distance of 1.27 ± 0.05mm, terminal pin 3 is provided with bonding region 4, the described bonding region 4 pressure-sizing degree of depth are 0.02-0.04mm, described terminal pin 3 is provided with three, terminal pin 3 width are 0.72 ± 0.02mm, described lead frame unit is provided with location hole 5, the diameter of location hole 5 is 1.55 ± 0.05mm.
The bonding region pressure-sizing depth requirements of this framework both sides terminal pin is higher, both sides symmetry, and difficulty of processing coefficient increases, but added value is high, is widely used in, in low power high-accuracy electrical equipment, playing an important role.
Within the similar designed lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.

Claims (3)

1. the lead frame for low power electric appliance, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, it is characterized in that: lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, terminal pin (3) is provided with bonding region (4), and described bonding region (4) the pressure-sizing degree of depth is 0.02-0.04mm.
2. a kind of lead frame for low power electric appliance according to claim 1, is characterized in that: described terminal pin (3) is provided with three.
3. a kind of lead frame for low power electric appliance according to claim 1, is characterized in that: described lead frame unit is provided with location hole (5).
CN201320701634.0U 2013-11-08 2013-11-08 Lead frame applied to low-power electrical appliance Expired - Fee Related CN203617282U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320701634.0U CN203617282U (en) 2013-11-08 2013-11-08 Lead frame applied to low-power electrical appliance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320701634.0U CN203617282U (en) 2013-11-08 2013-11-08 Lead frame applied to low-power electrical appliance

Publications (1)

Publication Number Publication Date
CN203617282U true CN203617282U (en) 2014-05-28

Family

ID=50769908

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320701634.0U Expired - Fee Related CN203617282U (en) 2013-11-08 2013-11-08 Lead frame applied to low-power electrical appliance

Country Status (1)

Country Link
CN (1) CN203617282U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103617987A (en) * 2013-11-08 2014-03-05 张轩 Plastic encapsulated lead frame for low-power electric appliances

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103617987A (en) * 2013-11-08 2014-03-05 张轩 Plastic encapsulated lead frame for low-power electric appliances

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140528

Termination date: 20141108

EXPY Termination of patent right or utility model