CN103617984A - Plastic package lead frame - Google Patents

Plastic package lead frame Download PDF

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Publication number
CN103617984A
CN103617984A CN201310550089.4A CN201310550089A CN103617984A CN 103617984 A CN103617984 A CN 103617984A CN 201310550089 A CN201310550089 A CN 201310550089A CN 103617984 A CN103617984 A CN 103617984A
Authority
CN
China
Prior art keywords
lead frame
lead
terminal pin
plastic packaging
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310550089.4A
Other languages
Chinese (zh)
Inventor
张轩
Original Assignee
张轩
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张轩 filed Critical 张轩
Priority to CN201310550089.4A priority Critical patent/CN103617984A/en
Publication of CN103617984A publication Critical patent/CN103617984A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a plastic package lead frame which comprises a plurality of lead frame units in a single row. The lead frame units are connected through connection ribs, each lead frame unit comprises a base body and lead pins, the connection portions of the base bodies and the lead pins are bent, the lead pins are five in number and are distributed at equal intervals, each lead pin is provided with a radiating fin, each base body is provided with a boss, and positioning holes are arranged among the lead frame units. The lead frame is simple in structure, convenient to install, safe, reliable and low in production cost and saves materials.

Description

A kind of plastic packaging lead frame
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plastic packaging lead frame.
In order to solve the problems of the technologies described above, the invention provides a kind of plastic packaging lead frame, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described terminal pin is provided with five and equidistant arrangement.
As a further improvement on the present invention, described terminal pin is provided with fin.
As a further improvement on the present invention, described matrix is provided with boss.
As a further improvement on the present invention, between described lead frame unit, be provided with location hole.
Adopt said structure, its beneficial effect is: this lead frame structure is simple, is convenient to install, and terminal pin increases fin, avoids excess Temperature, and body portion is provided with a boss makes earth connection more reliable, saves material while producing simultaneously, reduces costs.
Accompanying drawing explanation
Fig. 1 is the structural representation of plastic packaging lead frame of the present invention.
Fig. 2 is the body portion end view of plastic packaging lead frame of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-fin, 5-boss, 6-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As illustrated in fig. 1 and 2, a kind of plastic packaging lead frame, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, the width of lead frame unit 1 is 11.405 ± 0.025mm, lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 2 partial-lengths are 9.49 ± 0.1mm, thickness is 1.27 ± 0.015mm, the thickness of terminal pin 3 is 0.38 ± 0.01mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 planes at a distance of 2.67 ± 0.1mm, described terminal pin 3 is provided with five and equidistant arrangement, described terminal pin 3 is provided with fin 4, described matrix 2 is provided with boss 5, the height of described boss 5 is 0.38mm, between described lead frame unit 1, be provided with location hole 6, the diameter of location hole 6 is 1.52 ± 0.03mm.
This lead frame structure is simple, is convenient to install, safe and reliable, and production cost is lower simultaneously, saves material.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.

Claims (4)

1. a plastic packaging lead frame, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described terminal pin (3) is provided with five and equidistant arrangement.
2. a kind of plastic packaging lead frame according to claim 1, is characterized in that: described terminal pin (3) is provided with fin (4).
3. a kind of plastic packaging lead frame according to claim 1, is characterized in that: described matrix (2) is provided with boss (5).
4. a kind of plastic packaging lead frame according to claim 1, is characterized in that: between described lead frame unit (1), be provided with location hole (6).
CN201310550089.4A 2013-11-08 2013-11-08 Plastic package lead frame Pending CN103617984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310550089.4A CN103617984A (en) 2013-11-08 2013-11-08 Plastic package lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310550089.4A CN103617984A (en) 2013-11-08 2013-11-08 Plastic package lead frame

Publications (1)

Publication Number Publication Date
CN103617984A true CN103617984A (en) 2014-03-05

Family

ID=50168688

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310550089.4A Pending CN103617984A (en) 2013-11-08 2013-11-08 Plastic package lead frame

Country Status (1)

Country Link
CN (1) CN103617984A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928422A (en) * 2014-03-27 2014-07-16 张轩 Lead frame suitable for high-temperature environment
CN103928421A (en) * 2014-03-27 2014-07-16 张轩 Lead frame with sawtooth-shaped waterproof grooves

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101989581A (en) * 2009-07-31 2011-03-23 日月光半导体制造股份有限公司 Packaging structure and packaging method
CN201868419U (en) * 2010-11-08 2011-06-15 宁波康强电子股份有限公司 Lead frame for manufacture of semiconductor discrete devices
US20130273696A1 (en) * 2011-01-12 2013-10-17 Renesas Electronics Corporation Semiconductor device and manufacturing method thereof
CN203277358U (en) * 2013-04-16 2013-11-06 泰州东田电子有限公司 Leading wire frame for MOS semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101989581A (en) * 2009-07-31 2011-03-23 日月光半导体制造股份有限公司 Packaging structure and packaging method
CN201868419U (en) * 2010-11-08 2011-06-15 宁波康强电子股份有限公司 Lead frame for manufacture of semiconductor discrete devices
US20130273696A1 (en) * 2011-01-12 2013-10-17 Renesas Electronics Corporation Semiconductor device and manufacturing method thereof
CN203277358U (en) * 2013-04-16 2013-11-06 泰州东田电子有限公司 Leading wire frame for MOS semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928422A (en) * 2014-03-27 2014-07-16 张轩 Lead frame suitable for high-temperature environment
CN103928421A (en) * 2014-03-27 2014-07-16 张轩 Lead frame with sawtooth-shaped waterproof grooves

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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140305