CN103928422A - Lead frame suitable for high-temperature environment - Google Patents

Lead frame suitable for high-temperature environment Download PDF

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Publication number
CN103928422A
CN103928422A CN201410118628.1A CN201410118628A CN103928422A CN 103928422 A CN103928422 A CN 103928422A CN 201410118628 A CN201410118628 A CN 201410118628A CN 103928422 A CN103928422 A CN 103928422A
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CN
China
Prior art keywords
lead frame
fin
terminal pin
lead
applicable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410118628.1A
Other languages
Chinese (zh)
Inventor
张轩
Original Assignee
张轩
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张轩 filed Critical 张轩
Priority to CN201410118628.1A priority Critical patent/CN103928422A/en
Publication of CN103928422A publication Critical patent/CN103928422A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses a lead frame suitable for a high-temperature environment. The lead frame is composed of a plurality of lead frame units in a single row, the lead frame units are connected with one another through connection ribs, each lead frame unit comprises a cooling fin and lead pins, the joint of each cooling fin and the corresponding lead pins is bent, and a plurality of small heat dissipation holes which are distributed regularly are formed in the middle of each cooling fin. Because the small heat dissipation holes are additionally formed in the middles of the cooling fins of the lead frame, the heat dissipation effect of the cooling fins can be enhanced substantially, and the lead frame can be applied to a high-power circuit board used as high environment temperature.

Description

A kind of lead frame that is applicable to hot environment
Technical field
The present invention relates to a kind of lead frame.
Background technology
lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame that is applicable to hot environment.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame that is applicable to hot environment, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises fin and terminal pin, bending in fin and terminal pin junction, is provided with the heat radiation aperture of a plurality of regular distribution in the middle of described fin is provided with.
As a further improvement on the present invention, the width of described lead frame unit is 11.405 ± 0.03mm.
As a further improvement on the present invention, described lead frame unit is provided with location hole, and the diameter of location hole is 1.524 ± 0.05mm.
As a further improvement on the present invention, described fin thickness is 1.27 ± 0.015mm, and terminal pin thickness is 0.38 ± 0.015mm, and fin and terminal pin plane of living in is at a distance of 2.7 ± 0.07mm.
Adopt said structure, its beneficial effect is: in the middle of the fin of this lead frame, set up a plurality of heat radiation apertures, can significantly improve the effect of fin heat radiation, lead frame can be applied to powerful, in the high wiring board of ambient temperature.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is A place enlarged drawing in Fig. 1.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, the 4-aperture that dispels the heat, 5-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Fig. 1 and 2, a kind of lead frame that is applicable to hot environment, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, in the middle of being provided with, described fin 2 is provided with the heat radiation aperture 4 of a plurality of regular distribution, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described lead frame unit 1 is provided with location hole 5, the diameter of location hole 5 is 1.524 ± 0.05mm, described fin 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.7 ± 0.07mm.
In the middle of the fin 2 of this lead frame, set up a plurality of heat radiation apertures 4, can significantly improve the effect of fin 2 heat radiations, lead frame can be applied to powerful, in the high wiring board of ambient temperature.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.

Claims (4)

1. a lead frame that is applicable to hot environment, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, described lead frame unit (1) comprises fin (2) and terminal pin (3), bending in fin (2) and terminal pin (3) junction, it is characterized in that: the heat radiation aperture (4) that is provided with a plurality of regular distribution in the middle of described fin (2) is provided with.
2. a kind of lead frame that is applicable to hot environment according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
3. a kind of lead frame that is applicable to hot environment according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (5), and the diameter of location hole (5) is 1.524 ± 0.05mm.
4. a kind of lead frame that is applicable to hot environment according to claim 1, it is characterized in that: described fin (2) thickness is 1.27 ± 0.015mm, terminal pin (3) thickness is 0.38 ± 0.015mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.7 ± 0.07mm.
CN201410118628.1A 2014-03-27 2014-03-27 Lead frame suitable for high-temperature environment Pending CN103928422A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410118628.1A CN103928422A (en) 2014-03-27 2014-03-27 Lead frame suitable for high-temperature environment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410118628.1A CN103928422A (en) 2014-03-27 2014-03-27 Lead frame suitable for high-temperature environment

Publications (1)

Publication Number Publication Date
CN103928422A true CN103928422A (en) 2014-07-16

Family

ID=51146594

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410118628.1A Pending CN103928422A (en) 2014-03-27 2014-03-27 Lead frame suitable for high-temperature environment

Country Status (1)

Country Link
CN (1) CN103928422A (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0069390B1 (en) * 1981-07-06 1987-11-25 Matsushita Electronics Corporation Lead frame for plastic encapsulated semiconductor device
JPH04242966A (en) * 1990-08-09 1992-08-31 Fuji Electric Co Ltd Resin sealed semiconductor device
JPH08125093A (en) * 1994-10-24 1996-05-17 Rohm Co Ltd Semiconductor device
US5691884A (en) * 1994-12-08 1997-11-25 Fuji Electric Co., Ltd. Semiconductor device with removably fixed lead frame
JP2000349218A (en) * 1999-06-08 2000-12-15 Nec Corp Semiconductor device
CN2919538Y (en) * 2006-06-30 2007-07-04 王永国 Mechanical loading and clamping large-power LED bracket
CN201417767Y (en) * 2009-05-27 2010-03-03 宁波明昕微电子股份有限公司 Lead frame used for bearing triode chip during T0220F outline triode product encapsulation
CN202285232U (en) * 2011-09-27 2012-06-27 惠州Tcl移动通信有限公司 Printed circuit board (PCB) radiating pad structure for quad flat no lead (QFN) encapsulated component
CN102738110A (en) * 2012-08-10 2012-10-17 常州银河世纪微电子有限公司 Surface-mounted type lead frame
CN103617984A (en) * 2013-11-08 2014-03-05 张轩 Plastic package lead frame
CN203850286U (en) * 2014-03-27 2014-09-24 张轩 Plastic-sealed lead frame suitable for high-temperature environment

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0069390B1 (en) * 1981-07-06 1987-11-25 Matsushita Electronics Corporation Lead frame for plastic encapsulated semiconductor device
JPH04242966A (en) * 1990-08-09 1992-08-31 Fuji Electric Co Ltd Resin sealed semiconductor device
JPH08125093A (en) * 1994-10-24 1996-05-17 Rohm Co Ltd Semiconductor device
US5691884A (en) * 1994-12-08 1997-11-25 Fuji Electric Co., Ltd. Semiconductor device with removably fixed lead frame
JP2000349218A (en) * 1999-06-08 2000-12-15 Nec Corp Semiconductor device
CN2919538Y (en) * 2006-06-30 2007-07-04 王永国 Mechanical loading and clamping large-power LED bracket
CN201417767Y (en) * 2009-05-27 2010-03-03 宁波明昕微电子股份有限公司 Lead frame used for bearing triode chip during T0220F outline triode product encapsulation
CN202285232U (en) * 2011-09-27 2012-06-27 惠州Tcl移动通信有限公司 Printed circuit board (PCB) radiating pad structure for quad flat no lead (QFN) encapsulated component
CN102738110A (en) * 2012-08-10 2012-10-17 常州银河世纪微电子有限公司 Surface-mounted type lead frame
CN103617984A (en) * 2013-11-08 2014-03-05 张轩 Plastic package lead frame
CN203850286U (en) * 2014-03-27 2014-09-24 张轩 Plastic-sealed lead frame suitable for high-temperature environment

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Application publication date: 20140716