CN103928422A - Lead frame suitable for high-temperature environment - Google Patents
Lead frame suitable for high-temperature environment Download PDFInfo
- Publication number
- CN103928422A CN103928422A CN201410118628.1A CN201410118628A CN103928422A CN 103928422 A CN103928422 A CN 103928422A CN 201410118628 A CN201410118628 A CN 201410118628A CN 103928422 A CN103928422 A CN 103928422A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- fin
- terminal pin
- lead
- applicable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract 5
- 230000017525 heat dissipation Effects 0.000 abstract 3
- 210000000614 Ribs Anatomy 0.000 abstract 1
- 230000000875 corresponding Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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[Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound 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[Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound 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[Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a lead frame suitable for a high-temperature environment. The lead frame is composed of a plurality of lead frame units in a single row, the lead frame units are connected with one another through connection ribs, each lead frame unit comprises a cooling fin and lead pins, the joint of each cooling fin and the corresponding lead pins is bent, and a plurality of small heat dissipation holes which are distributed regularly are formed in the middle of each cooling fin. Because the small heat dissipation holes are additionally formed in the middles of the cooling fins of the lead frame, the heat dissipation effect of the cooling fins can be enhanced substantially, and the lead frame can be applied to a high-power circuit board used as high environment temperature.
Description
Technical field
The present invention relates to a kind of lead frame.
Background technology
lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame that is applicable to hot environment.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame that is applicable to hot environment, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises fin and terminal pin, bending in fin and terminal pin junction, is provided with the heat radiation aperture of a plurality of regular distribution in the middle of described fin is provided with.
As a further improvement on the present invention, the width of described lead frame unit is 11.405 ± 0.03mm.
As a further improvement on the present invention, described lead frame unit is provided with location hole, and the diameter of location hole is 1.524 ± 0.05mm.
As a further improvement on the present invention, described fin thickness is 1.27 ± 0.015mm, and terminal pin thickness is 0.38 ± 0.015mm, and fin and terminal pin plane of living in is at a distance of 2.7 ± 0.07mm.
Adopt said structure, its beneficial effect is: in the middle of the fin of this lead frame, set up a plurality of heat radiation apertures, can significantly improve the effect of fin heat radiation, lead frame can be applied to powerful, in the high wiring board of ambient temperature.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is A place enlarged drawing in Fig. 1.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, the 4-aperture that dispels the heat, 5-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Fig. 1 and 2, a kind of lead frame that is applicable to hot environment, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, in the middle of being provided with, described fin 2 is provided with the heat radiation aperture 4 of a plurality of regular distribution, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described lead frame unit 1 is provided with location hole 5, the diameter of location hole 5 is 1.524 ± 0.05mm, described fin 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.7 ± 0.07mm.
In the middle of the fin 2 of this lead frame, set up a plurality of heat radiation apertures 4, can significantly improve the effect of fin 2 heat radiations, lead frame can be applied to powerful, in the high wiring board of ambient temperature.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. a lead frame that is applicable to hot environment, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, described lead frame unit (1) comprises fin (2) and terminal pin (3), bending in fin (2) and terminal pin (3) junction, it is characterized in that: the heat radiation aperture (4) that is provided with a plurality of regular distribution in the middle of described fin (2) is provided with.
2. a kind of lead frame that is applicable to hot environment according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
3. a kind of lead frame that is applicable to hot environment according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (5), and the diameter of location hole (5) is 1.524 ± 0.05mm.
4. a kind of lead frame that is applicable to hot environment according to claim 1, it is characterized in that: described fin (2) thickness is 1.27 ± 0.015mm, terminal pin (3) thickness is 0.38 ± 0.015mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.7 ± 0.07mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118628.1A CN103928422A (en) | 2014-03-27 | 2014-03-27 | Lead frame suitable for high-temperature environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118628.1A CN103928422A (en) | 2014-03-27 | 2014-03-27 | Lead frame suitable for high-temperature environment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103928422A true CN103928422A (en) | 2014-07-16 |
Family
ID=51146594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410118628.1A Pending CN103928422A (en) | 2014-03-27 | 2014-03-27 | Lead frame suitable for high-temperature environment |
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| Country | Link |
|---|---|
| CN (1) | CN103928422A (en) |
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| CN202285232U (en) * | 2011-09-27 | 2012-06-27 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) radiating pad structure for quad flat no lead (QFN) encapsulated component |
| CN102738110A (en) * | 2012-08-10 | 2012-10-17 | 常州银河世纪微电子有限公司 | Surface-mounted type lead frame |
| CN103617984A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame |
| CN203850286U (en) * | 2014-03-27 | 2014-09-24 | 张轩 | Plastic-sealed lead frame suitable for high-temperature environment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0069390B1 (en) * | 1981-07-06 | 1987-11-25 | Matsushita Electronics Corporation | Lead frame for plastic encapsulated semiconductor device |
| JPH04242966A (en) * | 1990-08-09 | 1992-08-31 | Fuji Electric Co Ltd | Resin sealed semiconductor device |
| JPH08125093A (en) * | 1994-10-24 | 1996-05-17 | Rohm Co Ltd | Semiconductor device |
| US5691884A (en) * | 1994-12-08 | 1997-11-25 | Fuji Electric Co., Ltd. | Semiconductor device with removably fixed lead frame |
| JP2000349218A (en) * | 1999-06-08 | 2000-12-15 | Nec Corp | Semiconductor device |
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| CN202285232U (en) * | 2011-09-27 | 2012-06-27 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) radiating pad structure for quad flat no lead (QFN) encapsulated component |
| CN102738110A (en) * | 2012-08-10 | 2012-10-17 | 常州银河世纪微电子有限公司 | Surface-mounted type lead frame |
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| CN203850286U (en) * | 2014-03-27 | 2014-09-24 | 张轩 | Plastic-sealed lead frame suitable for high-temperature environment |
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Application publication date: 20140716 |