CN103928421A - Lead frame with sawtooth-shaped waterproof grooves - Google Patents
Lead frame with sawtooth-shaped waterproof grooves Download PDFInfo
- Publication number
- CN103928421A CN103928421A CN201410118615.4A CN201410118615A CN103928421A CN 103928421 A CN103928421 A CN 103928421A CN 201410118615 A CN201410118615 A CN 201410118615A CN 103928421 A CN103928421 A CN 103928421A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- sawtooth
- capillary groove
- shaped waterproof
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a lead frame with sawtooth-shaped waterproof grooves. The lead frame with the sawtooth-shaped waterproof groove is composed of a plurality of lead frame units in a single row mode, the lead frame units are connected to one another through connecting ribs. The lead frame units comprise cooling fins and lead feet, the joints of the cooling fins and the lead feet bend are bent, the sawtooth-shaped waterproof grooves are formed in the cooling fins, and six sawteeth are evenly arranged in the sawtooth-shaped waterproof grooves in the horizontal direction. According to the lead frame with the sawtooth-shaped waterproof grooves, the sawtooth-shaped waterproof grooves are formed in the cooling fins, so that the waterproof function is achieved, the combination of plastic sealing material and the frame is enhanced, debris caused by vibration of a chip is prevented, and the frame is more reliable.
Description
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame with zigzag capillary groove.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame with zigzag capillary groove, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, described lead frame unit comprises fin and terminal pin, bend in fin and terminal pin junction, in described fin, band is provided with zigzag capillary groove, horizontal evenly distributed six sawtooth in zigzag capillary groove.
As a further improvement on the present invention, described zigzag waterproof flute length 5.8mm, wide 0.4mm, dark 0.1mm.
As a further improvement on the present invention, the long 0.4mm of described sawtooth, wide 0.2mm, dark 0.3mm, interval 1mm between sawtooth.
As a further improvement on the present invention, the width of described lead frame unit is 11.405 ± 0.03mm.
As a further improvement on the present invention, described lead frame unit is provided with location hole, and the diameter of location hole is 1.55 ± 0.05mm.
As a further improvement on the present invention, described fin thickness is 1.27 ± 0.015mm, and terminal pin thickness is 0.38 ± 0.015mm, and plane is at a distance of 2.67 ± 0.1mm described in fin and terminal pin.
Adopt said structure, its beneficial effect is: this lead frame is with increase zigzag capillary groove not only to play waterproof action in fin, has also strengthened the combination of plastic packaging material and framework simultaneously, prevents that chip vibrations from producing fragment, makes framework more reliable.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is zigzag capillary groove schematic diagram of the present invention.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, 4-zigzag capillary groove, 5-sawtooth, 6-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Fig. 1 and 2, a kind of lead frame with zigzag capillary groove, by 1 single composition of multiple lead frames unit, between each lead frame unit 1, interconnect by dowel, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, in described fin 2, band is provided with zigzag capillary groove 4, horizontal evenly distributed six sawtooth 5 in zigzag capillary groove 4, the long 5.8mm of described zigzag capillary groove 4, wide 0.4mm, dark 0.1mm, the long 0.4mm of described sawtooth 5, wide 0.2mm, dark 0.3mm, interval 1mm between sawtooth 5, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described lead frame unit 1 is provided with location hole 6, the diameter of location hole 6 is 1.55 ± 0.05mm, described fin 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, described in fin 2 and terminal pin 3, plane is at a distance of 2.67 ± 0.1mm.
This lead frame is with increase zigzag capillary groove 4 not only to play waterproof action in fin 2, has also strengthened the combination of plastic packaging material and framework simultaneously, prevents that chip vibrations from producing fragment, makes framework more reliable.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (6)
1. the lead frame with zigzag capillary groove, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, described lead frame unit (1) comprises fin (2) and terminal pin (3), bend in fin (2) and terminal pin (3) junction, it is characterized in that: in described fin (2), band is provided with zigzag capillary groove (4) horizontal evenly distributed six sawtooth (5) in zigzag capillary groove (4).
2. a kind of lead frame with zigzag capillary groove according to claim 1, is characterized in that: the long 5.8mm of described zigzag capillary groove (4), wide 0.4mm, dark 0.1mm.
3. a kind of lead frame with zigzag capillary groove according to claim 1, is characterized in that: the long 0.4mm of described sawtooth (5), wide 0.2mm, dark 0.3mm, interval 1mm between sawtooth (5).
4. a kind of lead frame with zigzag capillary groove according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
5. a kind of lead frame with zigzag capillary groove according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (6), the diameter of location hole (6) is 1.55 ± 0.05mm.
6. a kind of lead frame with zigzag capillary groove according to claim 1, it is characterized in that: described fin (2) thickness is 1.27 ± 0.015mm, terminal pin (3) thickness is 0.38 ± 0.015mm, and fin (2) and the described plane of terminal pin (3) are at a distance of 2.67 ± 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118615.4A CN103928421A (en) | 2014-03-27 | 2014-03-27 | Lead frame with sawtooth-shaped waterproof grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118615.4A CN103928421A (en) | 2014-03-27 | 2014-03-27 | Lead frame with sawtooth-shaped waterproof grooves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103928421A true CN103928421A (en) | 2014-07-16 |
Family
ID=51146593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410118615.4A Pending CN103928421A (en) | 2014-03-27 | 2014-03-27 | Lead frame with sawtooth-shaped waterproof grooves |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103928421A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928426A (en) * | 2014-03-28 | 2014-07-16 | 张轩 | Leading frame |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201741688U (en) * | 2010-07-30 | 2011-02-09 | 吴江恒源金属制品有限公司 | Lead frame |
| CN201853698U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Short-pin triode lead frame |
| CN202285232U (en) * | 2011-09-27 | 2012-06-27 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) radiating pad structure for quad flat no lead (QFN) encapsulated component |
| CN202721119U (en) * | 2012-05-15 | 2013-02-06 | 苏州泰嘉电子有限公司 | Improved triode lead frame |
| CN202977409U (en) * | 2012-12-13 | 2013-06-05 | 深圳深爱半导体股份有限公司 | Waterproof lead frame |
| CN103617984A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame |
-
2014
- 2014-03-27 CN CN201410118615.4A patent/CN103928421A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201741688U (en) * | 2010-07-30 | 2011-02-09 | 吴江恒源金属制品有限公司 | Lead frame |
| CN201853698U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Short-pin triode lead frame |
| CN202285232U (en) * | 2011-09-27 | 2012-06-27 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) radiating pad structure for quad flat no lead (QFN) encapsulated component |
| CN202721119U (en) * | 2012-05-15 | 2013-02-06 | 苏州泰嘉电子有限公司 | Improved triode lead frame |
| CN202977409U (en) * | 2012-12-13 | 2013-06-05 | 深圳深爱半导体股份有限公司 | Waterproof lead frame |
| CN103617984A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic package lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928426A (en) * | 2014-03-28 | 2014-07-16 | 张轩 | Leading frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140716 |
|
| WD01 | Invention patent application deemed withdrawn after publication |