CN201741688U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN201741688U CN201741688U CN2010202775168U CN201020277516U CN201741688U CN 201741688 U CN201741688 U CN 201741688U CN 2010202775168 U CN2010202775168 U CN 2010202775168U CN 201020277516 U CN201020277516 U CN 201020277516U CN 201741688 U CN201741688 U CN 201741688U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip part
- chip section
- sides
- plastic sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a lead frame comprising a radiating part, a chip part, a middle pipe pin and two side pipe pins which are distributed on both sides of the middle pipe pin; the chip part is provided with two wave-shaped side parts; the side parts respectively form stepped surfaces on both sides of the chip part; and a circular through hole is arranged between the radiating part and the chip part. Firstly, both sides of the chip part of the lead frame are designed into a wave shape, thereby increasing the combining area with plastic sealing material; secondly, because the combining surface does not belong to a smooth transition surface, so that the combination between the lead frame and the plastic sealing material is better; and in addition, when in plastic sealing, the plastic sealing material is fully filled in the through hole between the radiating part and the chip part, thereby further enhancing the combining strength.
Description
Technical field
The utility model relates to a kind of semi-conductor discrete device, more particularly, relates to a kind of lead frame that is used for the semiconductor element encapsulation.
Background technology
In the prior art, the adhesion of lead frame and capsulation material becomes technical bottleneck, traditional lead frame often because its with capsulation material between combine inadequately firm and comes off, directly influence performance, quality and useful life that semiconductor is met.
The utility model content
The purpose of this utility model provides a kind of and the strong lead frame of capsulation material adhesion.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of lead frame, comprise frame body, described frame body comprises a plurality of frame units, be connected with middle muscle by end muscle between the adjacent frame unit, each frame unit comprises radiating part, chip section, interim pins and is distributed in two side pipe pin of the both sides of described interim pins that described chip section is provided with the side portion of two undulates.
Preferably, form cascaded surface between the side portion of described two undulates and the chip section respectively.
Preferably, the connection of described radiating part and described chip section has a manhole.
The beneficial effects of the utility model are: because the both sides of the edge undulate of the chip section of lead frame of the present utility model, strengthened the bonded area of itself and capsulation material, secondly because faying face does not belong to the smooth excessiveness face, make between this lead frame and the capsulation material combine bigger.
Description of drawings
Accompanying drawing 1 is the structural representation of lead frame of the present utility model;
Accompanying drawing 2 be in the accompanying drawing 1 A-A to the cutaway view schematic diagram;
Accompanying drawing 3 be in the accompanying drawing 1 B-B to the cutaway view schematic diagram.
In the accompanying drawing: 1, radiating part; 2, chip section; 3, interim pins; 4, side pipe pin; 5, side portion.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical solution of the utility model is done following detailed description the in detail:
As accompanying drawing 1, shown in accompanying drawing 2 and the accompanying drawing 3, lead frame of the present utility model comprises several frame units, adjacent frame unit is connected with end muscle 7 by middle muscle 6, each frame unit includes radiating part 1, chip section 2, interim pins 3, two side pipe pin 4, two side pipe pin 4 are positioned at the both sides of interim pins, the bottom of interim pins 3 and two side pipe pin 4 all is connected on the end muscle 7, middle muscle 6 is cascaded interim pins 3 and two side pipe pin 4, chip section 2 is positioned at the upper end of interim pins 3, the centre position, connection is provided with a manhole between radiating part 1 and the chip section 2, chip section 2 is provided with the side portion 5 of two undulates, form cascaded surface respectively between two side portion 5 and the chip section 2, the longitudinal sectional view of side portion 5 as shown in Figure 3.
On this lead frame during packaged chip, capsulation material is full of the through hole between radiating part 1 and the chip section 2, and simultaneously, the corrugated side portion 5 of the both sides of chip section 2 strengthens with the contact area of capsulation material, in conjunction with more firmly, encapsulation performance is good, prolonged the useful life of chip effectively.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (3)
1. lead frame, comprise frame body, described frame body comprises a plurality of frame units, be connected with middle muscle by end muscle between the adjacent frame unit, each frame unit comprises radiating part, chip section, interim pins and is distributed in two side pipe pin of the both sides of described interim pins that it is characterized in that: described chip section is provided with the side portion of two undulates.
2. a kind of lead frame according to claim 1 is characterized in that: form cascaded surface between the side portion of described two undulates and the chip section respectively.
3. a kind of lead frame according to claim 1 is characterized in that: the connection of described radiating part and described chip section has a manhole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202775168U CN201741688U (en) | 2010-07-30 | 2010-07-30 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202775168U CN201741688U (en) | 2010-07-30 | 2010-07-30 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201741688U true CN201741688U (en) | 2011-02-09 |
Family
ID=43556966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202775168U Expired - Fee Related CN201741688U (en) | 2010-07-30 | 2010-07-30 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201741688U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928421A (en) * | 2014-03-27 | 2014-07-16 | 张轩 | Lead frame with sawtooth-shaped waterproof grooves |
| CN104659006A (en) * | 2013-11-19 | 2015-05-27 | 西安永电电气有限责任公司 | Lead frame structure of plastic package type IPM (intelligent power module) |
-
2010
- 2010-07-30 CN CN2010202775168U patent/CN201741688U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659006A (en) * | 2013-11-19 | 2015-05-27 | 西安永电电气有限责任公司 | Lead frame structure of plastic package type IPM (intelligent power module) |
| CN104659006B (en) * | 2013-11-19 | 2017-11-03 | 西安永电电气有限责任公司 | A kind of plastic sealed IPM lead frame structure |
| CN103928421A (en) * | 2014-03-27 | 2014-07-16 | 张轩 | Lead frame with sawtooth-shaped waterproof grooves |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110209 Termination date: 20150730 |
|
| EXPY | Termination of patent right or utility model |