CN203733782U

CN203733782U - TO-220HF waterproof seal lead frame

Info

Publication number: CN203733782U
Application number: CN201320813577.5U
Authority: CN
Inventors: 吴斌
Original assignee: NANTONG HUALONG MICROELECTRONICS CO Ltd
Current assignee: NANTONG HUALONG MICROELECTRONICS CO Ltd
Priority date: 2013-12-12
Filing date: 2013-12-12
Publication date: 2014-07-23
Anticipated expiration: 2023-12-12

Abstract

The utility model relates to a TO-220HF waterproof seal lead frame. The frame comprises a chip holder, an inner lead welding part and lead pins. A chip is disposed on the chip holder. The upper part, the left side, the right side and the lower part of the chip holder are respectively provided with a first V-shaped waterproof groove, a second V-shaped waterproof groove, a third V-shaped waterproof groove and a fourth V-shaped waterproof groove, wherein the four V-shaped waterproof grooves form an enclosed chamber. A fifth V-shaped waterproof groove having a width of 0.30 mm is disposed outside the first V-shaped waterproof groove. The root part of the inner lead pin in the center of the chip holder is provided with a sixth V-shaped waterproof groove having a width ranging from 0.04 to 0.16mm. The root parts of the two lead pins at the two sides of the chip holder are provided with seventh V-shaped waterproof groove having a width ranging from 0.03 to 0.15mm. The beneficial effects are that the TO-220HF waterproof seal lead frame is high in impact resistance and good in waterproof effects.

Description

A kind of TO-220HF waterproof sealed lead wire frame

Technical field

The utility model relates to the technical field of semiconductor packages, relates in particular to a kind of TO-220HF waterproof sealed lead wire frame.

Background technology

At present, existing TO-220HF lead frame, after being seated, the chip section substrate of chip and lead frame carries out plastic packaging, because the surrounding of chip slide holder is plane, thereby therefore the low weak and poor defect of water proofing property of impact strength that causes of the bond strength of lead frame and plastic packaging material, in addition, although be provided with capillary groove on the chip slide holder on some TO-220HF lead frames, but formation closed loop is not sealed in capillary groove bottom, and middle pin root is without capillary groove, waterproof effect is desirable not to the utmost, the impact meeting that often can find steam or stress breaks through without the position of capillary groove from middle pin and slide holder bottom, direct effect is to the chip on slide holder, while causing product test, lost efficacy or dysfunction when upper machine.

Utility model content

In view of the above-mentioned problems in the prior art, the purpose of this utility model is to address the deficiencies of the prior art, and provides a kind of impact resistance by force and the TO-220HF waterproof sealed lead wire frame of good water-proof effect.

The utility model provides a kind of TO-220HF waterproof sealed lead wire frame, comprise chip slide holder, lead weld part and terminal pins, described chip is arranged on described chip slide holder, the top of described chip slide holder is provided with the first V-type capillary groove, the left side of described chip slide holder is provided with the second V-type capillary groove, the right side of described chip slide holder is provided with the 3rd V-type capillary groove, the bottom of described chip slide holder is provided with the 4th V-type capillary groove, described the first V-type capillary groove, the second V-type capillary groove, the 3rd V-type capillary groove and the 4th V-type capillary groove form a closed space, it is the 5th V-type capillary groove of 0.30mm that described the first V-type capillary groove arranged outside has width, the root of described chip slide holder middle leads pin is provided with the 6th V-type capillary groove that width is 0.04～0.16mm, the root of two terminal pins in described chip slide holder outside is provided with the 7th V-type capillary groove that width is 0.03～0.15mm.

Further, the width of described the first V-type capillary groove, the second V-type capillary groove, the 3rd V-type capillary groove and the 4th V-type capillary groove is 0.20～0.40mm.

Further, the centre-to-centre spacing between described the first V-type capillary groove and described the 5th V-type capillary groove is 0.40～0.60mm.

Further, the width of described the 6th V-type capillary groove is 0.08～0.12mm.

Further, the width of described the 7th V-type capillary groove is 0.07～0.11mm.

Further, the width of described the first V-type capillary groove, the second V-type capillary groove, the 3rd V-type capillary groove and the 4th V-type capillary groove is 0.30mm.

Further, the centre-to-centre spacing between described the first V-type capillary groove and described the 5th V-type capillary groove is 0.50mm.

The advantage the utlity model has and beneficial effect are: top, left side, right side and the bottom of the chip slide holder of the TO-220HF waterproof sealed lead wire frame of this enforcement is respectively arranged with the first V-type capillary groove, the second V-type capillary groove, the 3rd V-type capillary groove and the 4th V-type capillary groove, and form a closed anti-hydrospace, improve water-tight performance and the impact resistance of chip slide holder; In addition, it is the 5th V-type capillary groove of 0.30mm that the arranged outside of described the first V-type capillary groove has width, and the waterproofing and airtight performance of chip slide holder is got a promotion again; Simultaneously, the root of described chip slide holder middle leads pin is provided with the 6th V-type capillary groove that width is 0.04～0.16mm, the root of two terminal pins in described chip slide holder outside is provided with the 7th V-type capillary groove that width is 0.03～0.15mm, in encapsulation process, these capillary grooves will be filled by plastic packaging material, thereby form the trough body structure with certain depth and width, form latching function, by plastic packaging material tightly with framework combination, coupling mechanism force is further strengthened; Such design makes the outside of the V-type capillary groove on chip slide holder increase by a blockage more, so the area of actual frame and plastic packaging material combination increases greatly, the snap close coupling mechanism force forming is thus that former design is incomparable, so the adhesion of plastic packaging material and framework is better in the time of encapsulation, air-tightness is better, there is better anti-impact force, can effectively ensure the reliability of product.

Brief description of the drawings

Fig. 1 is the structural representation of the TO-220HF waterproof sealed lead wire frame of the present embodiment;

Fig. 2 is that in Fig. 1, A--A cuts open structural representation enlarged drawing.

Embodiment

With specific embodiment, the utility model is further described below with reference to accompanying drawings.

As shown in Figure 1 and Figure 2: a kind of TO-220HF waterproof sealed lead wire frame of the utility model embodiment, described TO-220HF waterproof sealed lead wire frame comprises multiple separate units 1, each separate unit 1 comprises chip slide holder 2, lead weld part 3 and terminal pins 4, described chip is arranged on described chip slide holder 2, the top of described chip slide holder 2 is provided with the first V-type capillary groove 201, the left side of described chip slide holder 2 is provided with the second V-type capillary groove 202, the right side of described chip slide holder 2 is provided with the 3rd V-type capillary groove 203, the bottom of described chip slide holder 2 is provided with the 4th V-type capillary groove 204, described the first V-type capillary groove 201, the second V-type capillary groove 202, the 3rd V-type capillary groove 203 and the 4th V-type capillary groove 204 form a closed space, water-tight performance and the impact resistance of chip slide holder 1 are improved, it is the 5th V-type capillary groove 205 of 0.30mm that described the first V-type capillary groove 201 arranged outside have width, the root of described chip slide holder 2 middle leads pins 4 is provided with the 6th V-type capillary groove 207 that width is 0.04～0.16mm, the root of two terminal pins 4 in described chip slide holder outside is provided with the 7th V-type capillary groove 206 that width is 0.03～0.15mm, the setting of the above V-type capillary groove can make the waterproof ability of lead frame further improve, simultaneously in encapsulation process, make encapsulating compound tightly with framework combination, coupling mechanism force is further strengthened, anti-impact force performance is further promoted.

As the preferred implementation of above-described embodiment, the width of described the first V-type capillary groove 201, the second V-type capillary groove 202, the 3rd V-type capillary groove 203 and the 4th V-type capillary groove 204 is 0.20～0.40mm.

As the preferred implementation of above-described embodiment, the centre-to-centre spacing between described the first V-type capillary groove 201 and described the 5th V-type capillary groove 205 is 0.40～0.60mm.

As the preferred implementation of above-described embodiment, the width of described the 6th V-type capillary groove 207 is 0.08～0.12mm.

As the preferred implementation of above-described embodiment, the width of described the 7th V-type capillary groove 206 is 0.07～0.11mm.

As the preferred implementation of above-described embodiment, the width of described the first V-type capillary groove 201, the second V-type capillary groove 202, the 3rd V-type capillary groove 203 and the 4th V-type capillary groove 204 is all set to 0.30mm.

As the preferred implementation of above-described embodiment, the centre-to-centre spacing between described the first V-type capillary groove 201 and described the 5th V-type capillary groove 205 is chosen as 0.50mm.

Finally it should be noted that: above-described each embodiment, only for the technical solution of the utility model is described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record previous embodiment is modified, or to wherein partly or entirely technical characterictic be equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of the each embodiment technical scheme of the utility model.

Claims

1. a TO-220HF waterproof sealed lead wire frame, comprise chip slide holder, lead weld part and terminal pins, described chip is arranged on described chip slide holder, it is characterized in that: the top of described chip slide holder is provided with the first V-type capillary groove, the left side of described chip slide holder is provided with the second V-type capillary groove, the right side of described chip slide holder is provided with the 3rd V-type capillary groove, the bottom of described chip slide holder is provided with the 4th V-type capillary groove, described the first V-type capillary groove, the second V-type capillary groove, the 3rd V-type capillary groove and the 4th V-type capillary groove form a closed space, it is the 5th V-type capillary groove of 0.30mm that described the first V-type capillary groove arranged outside has width, the root of described chip slide holder middle leads pin is provided with the 6th V-type capillary groove that width is 0.04～0.16mm, the root of two terminal pins in described chip slide holder outside is provided with the 7th V-type capillary groove that width is 0.03～0.15mm.

2. TO-220HF waterproof sealed lead wire frame according to claim 1, is characterized in that, the width of described the first V-type capillary groove, the second V-type capillary groove, the 3rd V-type capillary groove and the 4th V-type capillary groove is 0.20～0.40mm.

3. TO-220HF waterproof sealed lead wire frame according to claim 1, is characterized in that, the centre-to-centre spacing between described the first V-type capillary groove and described the 5th V-type capillary groove is 0.40～0.60mm.

4. TO-220HF waterproof sealed lead wire frame according to claim 1, is characterized in that, the width of described the 6th V-type capillary groove is 0.08～0.12mm.

5. TO-220HF waterproof sealed lead wire frame according to claim 1, is characterized in that, the width of described the 7th V-type capillary groove is 0.07～0.11mm.

6. TO-220HF waterproof sealed lead wire frame according to claim 2, is characterized in that, the width of described the first V-type capillary groove, the second V-type capillary groove, the 3rd V-type capillary groove and the 4th V-type capillary groove is 0.30mm.

7. TO-220HF waterproof sealed lead wire frame according to claim 3, is characterized in that, the centre-to-centre spacing between described the first V-type capillary groove and described the 5th V-type capillary groove is 0.50mm.