CN202003987U - Bare copper frame with water-proof groove structure - Google Patents
Bare copper frame with water-proof groove structure Download PDFInfo
- Publication number
- CN202003987U CN202003987U CN 201120001323 CN201120001323U CN202003987U CN 202003987 U CN202003987 U CN 202003987U CN 201120001323 CN201120001323 CN 201120001323 CN 201120001323 U CN201120001323 U CN 201120001323U CN 202003987 U CN202003987 U CN 202003987U
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- CN
- China
- Prior art keywords
- groove structure
- frame
- framework
- water
- bare copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The utility model relates to a bare copper frame with a water-proof groove structure. The bare copper frame is provided with a stack-shaped groove structure. The stack-shaped groove structure has an outer wide part and a bottom narrow part. The stack-shaped groove structure can be arranged at two opposite sides of the frame or be evenly arranged on the periphery of the frame. Through an improvement of the utility model, the water-proof performance of the frame and a plastic sealing material can be greatly enhanced, and the bonding area between the frame and the plastic sealing material is increased by over two times, so the bonding strength is dramatically increased, and consequently the quality and reliability of a device are also improved.
Description
Technical field
The utility model relates to the semi-conductor discrete device sealed in unit, particularly has the naked copper framework of capillary groove structure.
Background technology
Existing Discrete device packaging framework capillary groove is the square structure, and the edge all is smooth, and the water leakage ability is low, and behind the cast EMC, EMC and framework adhesion are poor.
The utility model content
The purpose of this utility model provides a kind of naked copper framework with capillary groove structure, solve behind the entire Discrete device packaging framework cast EMC commonly used problem with framework adhesion difference, reaching increases the framework water resistance, improves the effect of the adhesion of plastic packaging material and framework.
The purpose of this utility model is to be achieved through the following technical solutions:
Naked copper framework with capillary groove structure is provided with buttress connected in star structure at the edge, the groove structure of described buttress shape has wide and the narrow portion of bottom of outer rim.Described buttress connected in star structure discrete with framework both sides or be distributed on framework around.
By transformation of the present utility model, the water resistance of framework and plastic packaging material is improved greatly, the bonded area of framework and plastic packaging material has increased more than the twice, adhesion improve greatly, the quality of device, unfailing performance are improved.
Description of drawings
With embodiment the utility model is described in further detail with reference to the accompanying drawings below.
Fig. 1 is the described structure chart with naked copper framework of capillary groove structure of the utility model embodiment;
Fig. 2 is the partial enlarged drawing among Fig. 1;
Embodiment
Shown in Fig. 1-2, the naked copper framework with capillary groove structure described in the utility model is provided with buttress connected in star structure 2 at the edge, and the groove structure 2 of described buttress shape has wide and the narrow portion of bottom of outer rim.Described buttress connected in star structure 2 discrete with framework 1 both sides or be distributed on framework 1 around.
By transformation of the present utility model, the water resistance of framework and plastic packaging material is improved greatly, the bonded area of framework and plastic packaging material has increased more than the twice, adhesion improve greatly, the quality of device, unfailing performance are improved.
Claims (2)
1. have the naked copper framework of capillary groove structure, it is characterized in that, be provided with buttress connected in star structure at the edge, the groove structure of described buttress shape has wide and the narrow portion of bottom of outer rim.
2. naked copper framework according to claim 1 is characterized in that, described buttress connected in star structure discrete with framework both sides or be distributed on framework around.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120001323 CN202003987U (en) | 2011-01-05 | 2011-01-05 | Bare copper frame with water-proof groove structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120001323 CN202003987U (en) | 2011-01-05 | 2011-01-05 | Bare copper frame with water-proof groove structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202003987U true CN202003987U (en) | 2011-10-05 |
Family
ID=44706714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120001323 Expired - Fee Related CN202003987U (en) | 2011-01-05 | 2011-01-05 | Bare copper frame with water-proof groove structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202003987U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956573A (en) * | 2012-11-19 | 2013-03-06 | 无锡九条龙汽车设备有限公司 | Triode with firm structure |
-
2011
- 2011-01-05 CN CN 201120001323 patent/CN202003987U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956573A (en) * | 2012-11-19 | 2013-03-06 | 无锡九条龙汽车设备有限公司 | Triode with firm structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111005 Termination date: 20150105 |
|
| EXPY | Termination of patent right or utility model |